JP7279324B2 - 半導体モジュール - Google Patents
半導体モジュール Download PDFInfo
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- JP7279324B2 JP7279324B2 JP2018173083A JP2018173083A JP7279324B2 JP 7279324 B2 JP7279324 B2 JP 7279324B2 JP 2018173083 A JP2018173083 A JP 2018173083A JP 2018173083 A JP2018173083 A JP 2018173083A JP 7279324 B2 JP7279324 B2 JP 7279324B2
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- 239000004065 semiconductor Substances 0.000 title claims description 231
- 239000003566 sealing material Substances 0.000 claims description 25
- 239000000919 ceramic Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 239000010949 copper Substances 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011888 foil Substances 0.000 description 9
- 239000004020 conductor Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Description
<半導体モジュールの構成>
本発明の第1実施形態に係る半導体モジュールとして、ハーフブリッジ回路の一部を構成する1in1型の半導体モジュールを例示する。図1は、本発明の第1実施形態に係る半導体モジュールの側面図であり、図2は、本発明の第1実施形態に係る半導体モジュールの第2回路基板7及び封止材8を省略し、第1回路基板1及び半導体素子(半導体チップ)2a~2f,3a~3fの部分を上から見た上面図である。図2の下側から見た半導体モジュールの側面が図1に対応する。
ここで、図6及び図7を参照して、比較例に係る半導体モジュールを説明する。図6は、比較例に係る半導体モジュールの側面図であり、図2は、比較例に係る半導体モジュールの第2回路基板107及び封止材108を省略し、第1回路基板101及び半導体素子102a,102b,102c,102d,102e,102f,103a,103b,103c,103d,103e,103fの部分を上から見た上面図である。
次に、図8~図11等を参照して、本発明の第1実施形態に係る半導体モジュールの製造方法の一例を説明する。
本発明の第1実施形態の第1変形例に係る半導体モジュールは、図12に示すように、第2回路基板7の上面側の絶縁層70上に抵抗素子9が配置されていない点が、本発明の第1実施形態に係る半導体モジュールと異なる。抵抗素子9が配置されていない場合には、図4に示した制御配線層72の平面パターンとしては、第1配線部71aと第2配線部72bとを抵抗素子9を介さずに直接接続すればよい。なお、抵抗素子9が、第2回路基板7の上面側の絶縁層70上に配置される代わりに、絶縁層70の内部に埋め込まれていてもよく、絶縁層70上に配置される場合よりも厚みを抑制することができる。
本発明の第1実施形態の第2変形例に係る半導体モジュールは、図13に示すように、封止材8が、第2回路基板7の絶縁層70の上面を露出するように配置されている点が、本発明の第1実施形態に係る半導体モジュールと異なる。絶縁層70の露出した上面には、例えば冷却器やその他の部品等を搭載してもよい。本発明の第1実施形態の第2変形例によれば、第2回路基板7の絶縁層70の上面側からも冷却することができ、放熱効率を向上させることができる。
図14は、本発明の第2実施形態に係る半導体モジュールの側面図であり、図15は、本発明の第2実施形態に係る半導体モジュールの第2回路基板7a及び封止材8を省略し、第1回路基板1及び半導体素子(半導体チップ)2a~2f,3a~3fの部分を上から見た上面図である。
上記のように、本発明は実施形態によって記載したが、この開示の一部をなす論述及び図面は本発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかとなろう。
2a,2b,2c,2d,2e,2f,3a,3b,3c,3d,3e,3f,102a,102b,102c,102d,102e,102f,103a,103b,103c,103d,103e,103f…半導体素子
4a,4b,4c,4d,4e,4f,4g,4h,4i,4j,4k,4l,4m,6a,6b,6c,6d,6e,6f,104a,104b,104c,104d,104e,104f,104g,104h,104i,104j,104k,104l,106a,106b,106c,106d,106e,106f,106g,106h,106i,106j,106k,106l,131a,131b,131c,131d,132a,132b,132c,132d…主電流ピン
5a,5b,5c,5d,5e,5f,105a,105b,105c,105d,105e,105f,109a…制御ピン
7,7a,7b,107…第2回路基板
8,108…封止材
9,109…抵抗素子
11,11a,11b,111…絶縁板
12,12a,12b,13,13a,13b,112,113a,113b,113c,113d…導電層
21a,21b,21c,21d,121a,121b,121c,121d…第1リード端子
22a,22b,22c,22d,122a,122b,122c,122d…第2リード端子
23a,23b,123a,123b…センスリード端子
24a,24b,25a,25b,124a,124b…第3リード端子
70,171…絶縁層
71,71i,71j…主電流配線層
72,72c,72d…制御配線層
71a,73a…第1配線部
72b,73b…第2配線部
73…センス配線層
172,173…配線層
Claims (10)
- 絶縁板及び該絶縁板上に配置された導電層を有する第1回路基板と、
上面側に制御電極及び第1主電極、並びに前記上面に対向する下面側に前記導電層に電気的に接続された第2主電極を有する半導体素子と、
セラミクスからなる絶縁層並びに該絶縁層の内部にそれぞれ埋め込まれた主電流配線層及び該主電流配線層よりも上層の制御配線層を有し、前記半導体素子の上方に配置された第2回路基板と、
前記第1主電極と前記主電流配線層を接続する主電流ピンと、
前記制御電極と前記制御配線層を接続する制御ピンと、
前記主電流配線層上から上方に延伸し、前記主電流配線層に接続された、前記第1主電極の電位を外部へ取り出すための第1リード端子と、
前記導電層上から上方に延伸し、前記導電層に接続された第2リード端子と、
前記制御配線層上から上方に延伸し、前記制御配線層に接続された第3リード端子と、
前記第1回路基板の上面、前記半導体素子の側面及び上面、並びに前記第2回路基板の下面を少なくとも覆う封止材と、
前記第2回路基板の上面に配置された抵抗素子と、
を備え、
前記制御配線層の前記抵抗素子と接続される部位が、前記絶縁層から露出している半導体モジュール。 - 前記絶縁板がセラミクスからなる請求項1に記載の半導体モジュール。
- 前記抵抗素子が、前記絶縁層の上面に配置され、前記制御配線層と前記第3リード端子との間に接続されている請求項1又は2に記載の半導体モジュール。
- 前記制御配線層は、
複数の前記制御ピン間を等長配線するように、前記複数の制御ピンと前記抵抗素子との間を配線する第1配線部と、
前記抵抗素子と前記第3リード端子との間を配線する第2配線部と、
を有する請求項3に記載の半導体モジュール。 - 前記第1リード端子及び前記第3リード端子が、前記第2主電極に接続されている前記導電層の上方に位置する請求項1~4のいずれか1項に記載の半導体モジュール。
- 前記主電流配線層上から上方に延伸し、前記主電流配線層に接続されたセンスリード端子を更に備える請求項1~5のいずれか1項に記載の半導体モジュール。
- 前記封止材が、前記第1回路基板の下面と、前記第2回路基板の前記絶縁層の上面とを露出する請求項1~6のいずれか1項に記載の半導体モジュール。
- 前記第2回路基板は、
前記絶縁層の前記主電流配線層と前記制御配線層との間に埋め込まれ、前記半導体素子の前記第1主電極に接続されたセンス配線層を更に有する
請求項1~5のいずれか1項に記載の半導体モジュール。 - 前記センス配線層は、前記絶縁層の一部を挟んで前記制御配線層の少なくとも一部と対向して配置されている請求項8に記載の半導体モジュール。
- 複数の前記半導体素子は、前記半導体モジュールの長手方向に沿って2列に配列されている請求項1~9のいずれか1項に記載の半導体モジュール。
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