CN107834989A - 一种应用于薄膜体声波器件的高散热陶瓷外壳结构 - Google Patents
一种应用于薄膜体声波器件的高散热陶瓷外壳结构 Download PDFInfo
- Publication number
- CN107834989A CN107834989A CN201711090078.7A CN201711090078A CN107834989A CN 107834989 A CN107834989 A CN 107834989A CN 201711090078 A CN201711090078 A CN 201711090078A CN 107834989 A CN107834989 A CN 107834989A
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- heat
- bulk acoustic
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- metal
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- 239000000919 ceramic Substances 0.000 title claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000005245 sintering Methods 0.000 claims abstract description 5
- 238000010438 heat treatment Methods 0.000 claims description 11
- 230000007246 mechanism Effects 0.000 claims description 7
- 238000004891 communication Methods 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 17
- 108010063955 thrombin receptor peptide (42-47) Proteins 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
- H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201711090078.7A CN107834989B (zh) | 2017-11-08 | 2017-11-08 | 一种应用于薄膜体声波器件的高散热陶瓷外壳结构 |
Applications Claiming Priority (1)
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CN201711090078.7A CN107834989B (zh) | 2017-11-08 | 2017-11-08 | 一种应用于薄膜体声波器件的高散热陶瓷外壳结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107834989A true CN107834989A (zh) | 2018-03-23 |
CN107834989B CN107834989B (zh) | 2022-10-25 |
Family
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Family Applications (1)
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CN201711090078.7A Active CN107834989B (zh) | 2017-11-08 | 2017-11-08 | 一种应用于薄膜体声波器件的高散热陶瓷外壳结构 |
Country Status (1)
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CN (1) | CN107834989B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114421918A (zh) * | 2022-03-31 | 2022-04-29 | 深圳新声半导体有限公司 | 一种体声波滤波器芯片 |
Citations (10)
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---|---|---|---|---|
CN1489201A (zh) * | 2002-08-28 | 2004-04-14 | 松下电器产业株式会社 | 半导体器件 |
CN1611002A (zh) * | 2001-12-28 | 2005-04-27 | 埃普科斯股份有限公司 | 结构高度低的封装元器件及制造方法 |
CN101252162A (zh) * | 2008-03-27 | 2008-08-27 | 潮州三环(集团)股份有限公司 | 一种高功率led陶瓷封装基座 |
CN101252163A (zh) * | 2008-03-27 | 2008-08-27 | 潮州三环(集团)股份有限公司 | 一种smd高功率led陶瓷封装基座 |
CN101276869A (zh) * | 2008-05-04 | 2008-10-01 | 潮州市三江电子有限公司 | 一种片式led封装用陶瓷散热基板 |
US20080268637A1 (en) * | 2007-04-26 | 2008-10-30 | E. I. Dupont De Nemours And Company | Electrically conductive composition for via-holes |
CN101335319A (zh) * | 2008-05-30 | 2008-12-31 | 潮州市三江电子有限公司 | 一种高功率led陶瓷封装基座 |
CN201246695Y (zh) * | 2008-05-04 | 2009-05-27 | 潮州市三江电子有限公司 | 一种片式led封装用陶瓷散热基板 |
CN101820264A (zh) * | 2010-04-06 | 2010-09-01 | 台晶(宁波)电子有限公司 | 一种贯孔式振子装置晶圆级封装结构 |
WO2016128096A1 (de) * | 2015-02-13 | 2016-08-18 | Robert Bosch Gmbh | Schaltungsträger und verfahren zur herstellung eines schaltungsträgers |
-
2017
- 2017-11-08 CN CN201711090078.7A patent/CN107834989B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1611002A (zh) * | 2001-12-28 | 2005-04-27 | 埃普科斯股份有限公司 | 结构高度低的封装元器件及制造方法 |
CN1489201A (zh) * | 2002-08-28 | 2004-04-14 | 松下电器产业株式会社 | 半导体器件 |
US20080268637A1 (en) * | 2007-04-26 | 2008-10-30 | E. I. Dupont De Nemours And Company | Electrically conductive composition for via-holes |
CN101252162A (zh) * | 2008-03-27 | 2008-08-27 | 潮州三环(集团)股份有限公司 | 一种高功率led陶瓷封装基座 |
CN101252163A (zh) * | 2008-03-27 | 2008-08-27 | 潮州三环(集团)股份有限公司 | 一种smd高功率led陶瓷封装基座 |
CN101276869A (zh) * | 2008-05-04 | 2008-10-01 | 潮州市三江电子有限公司 | 一种片式led封装用陶瓷散热基板 |
CN201246695Y (zh) * | 2008-05-04 | 2009-05-27 | 潮州市三江电子有限公司 | 一种片式led封装用陶瓷散热基板 |
CN101335319A (zh) * | 2008-05-30 | 2008-12-31 | 潮州市三江电子有限公司 | 一种高功率led陶瓷封装基座 |
CN101820264A (zh) * | 2010-04-06 | 2010-09-01 | 台晶(宁波)电子有限公司 | 一种贯孔式振子装置晶圆级封装结构 |
WO2016128096A1 (de) * | 2015-02-13 | 2016-08-18 | Robert Bosch Gmbh | Schaltungsträger und verfahren zur herstellung eines schaltungsträgers |
Non-Patent Citations (1)
Title |
---|
印刷线路板技术: "《电子技术译丛》", 30 September 1979 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114421918A (zh) * | 2022-03-31 | 2022-04-29 | 深圳新声半导体有限公司 | 一种体声波滤波器芯片 |
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Publication number | Publication date |
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CN107834989B (zh) | 2022-10-25 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20220524 Address after: No.23 Xiyong Avenue, Shapingba District, Chongqing 401332 Applicant after: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION CHONGQING ACOUSTIC-OPTIC-ELECTRONIC CO.,LTD. Address before: 400060 Chongqing Nanping Nan'an District No. 14 Huayuan Road Applicant before: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO.26 Research Institute |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: No.23 Xiyong Avenue, Shapingba District, Chongqing 401332 Patentee after: CETC Chip Technology (Group) Co.,Ltd. Country or region after: China Address before: No.23 Xiyong Avenue, Shapingba District, Chongqing 401332 Patentee before: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION CHONGQING ACOUSTIC-OPTIC-ELECTRONIC CO.,LTD. Country or region before: China |
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CP03 | Change of name, title or address |