CN1396034A - 超声波丝焊用的谐振器 - Google Patents

超声波丝焊用的谐振器 Download PDF

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CN1396034A
CN1396034A CN02140617A CN02140617A CN1396034A CN 1396034 A CN1396034 A CN 1396034A CN 02140617 A CN02140617 A CN 02140617A CN 02140617 A CN02140617 A CN 02140617A CN 1396034 A CN1396034 A CN 1396034A
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佐藤茂
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Abstract

一种超声波丝焊用的谐振器，在毛细管的两侧支持超声波射筒，从而能够正确维持接线与电极的焊接位置，进行合适的焊接。其中，超声波射筒2通过设置在毛细管3两侧相等距离上的最小振幅点的支持部8的安装部18以双支持方式安装于焊接机。在这样的状态下，接线9经箝定件20通过丝材通路5、12从小孔15通向下方后，接线9与超声波射筒2和毛细管3一起下降，从焊接作用部13往下伸出的接线9的端部与焊接对象重叠，与该焊接作用部13以规定的压力加压夹紧，并且超声波射筒2、毛细管3和焊接作用部13产生超声波振动，使接线9的端部与焊接对象接合。

Description

超声波丝焊用的谐振器
技术领域
本发明涉及制造半导体器件时用于以超声波进行接线焊接的超声波丝焊用谐振器。
背景技术
图4示出用于制造半导体器件的已有的超声波焊接机，金线那样的接线101经箝定件102通过形成于设置在超声波射筒103前端部的毛细管104内部的丝材通路105，在这种状态下，使从毛细管104前端部向下方伸出的接线101的端部与超声波射筒103及毛细管104一起下降，与作为焊接对象的图外的半导体器件、引线框架等的电极叠合，用电极和毛细管104夹在一起后，使超声波筒103和毛细管104进行超声波振动，从而将接线101的端部焊接到电极上。
然而，所述已有例的结构是，将毛细管104设置在以悬臂支承方式装于超声波焊接机的超声波射筒103的前端部，因此，在将接线101焊接于电极时施加的压力下，超声波射筒103发生挠曲，以对超声波焊接机的支持点为支点倾斜，接线101与电极的接合位置发生微妙变化，不能进行合适的焊接。
因此，本发明提供一种超声波焊接用的谐振器，能够在毛细管的两侧支持超声波射筒，从而能正确维持接线与电极的焊接位置，进行合适的焊接。
发明内容
本发明中，超声波射筒具有在穿通接线用的毛细管两侧的最小振幅点设置的支持部，借助于此，超声波射筒以双点支承方式通过支承部安装于图外的焊接机上，因而在用规定压力用接合对象和毛细管夹紧接线端部时，在接线与接合对象焊接时施加的压力下，超声波射筒以接线与接合对象的焊接位置为中心挠曲，能正确维持接线与接合对象的焊接位置，接线与接合对象能够合适地焊接。由于超声波射筒以毛细管为中心，用双支承方式安装于焊接机，焊接时从毛细管加到接线上的压力取得左右平衡，因而作为接线，可用细线不消说，也可用粗线或高分子材料被覆线。
附图说明
图1是示出实施形态的谐振器的内部结构的截面图。
图2是示出实施形态的毛细管前端部的截面图。
图3是示出相同实施形态的谐振器的俯视图。
图4是示出已有例的示意图。
附图中，1为谐振器，2为超声波射筒，3为毛细管，8为支持部，9为接线。
具体实施形态
图1～图3为一实施形态，图1示出横向剖切谐振器1所得的截面图，图2示出毛细管3前端部的截面，图3示出谐振器1的上表面。
下面参照图1说明实施形态中的谐振器1的主要部分。谐振器1具有超声波射筒2和毛细管3。超声波射筒2为棒状，具有从振子4传递来的超声波振动谐振频率的至少一个波长的长度(从最大振幅点f1到最大振幅点f5的长度)，由铝或钛之类的合金或者淬火的铁等音响特性良好的材料作为一体形成，该一体形成的超声波射筒2具有丝材通路5、毛细管接合部6、零件接合部7和图3所示的支持部8。丝材通路5是贯通孔，位于超声波射筒2的最大振幅点f3，用于使接线9通过。毛细管接合部6是形成阴螺纹的螺纹孔，同轴状地形成在丝材通路5的一端。零件接合部7也是螺纹孔，形成阴螺纹，用于利用无头螺钉将振子4或图外的增强器同轴安装于超声波射筒2，并且该螺纹孔形成于存在超声波射筒2最大振幅点f1、f5的左右端面的中央。
毛细管3设置于作为超声波射筒2的外侧面的下表面上的最大振幅点f3，以便使接线9通过。毛细管3为直棒状，由铝或钛之类的合金或淬火的铁等音响特性良好的材料形成与超声波射筒2分开的构件，该毛细管3在上部具有连接部11，使其在内部沿轴方向贯通丝材通路12。连接部11在外周面具有阳螺纹。丝材通路12用钻床等工具从毛细管3的连接部11的上表面往下表面开孔加工形成，丝材通路12的下部则如图2所示，形成从上到下直径逐渐减小的圆锥状前端，并且贯通到毛细管3的下表面。利用连接部11的阳螺纹与毛细管接合部6的阴螺纹的啮合，将毛细管3装到超声波射筒2，使其从超声波射筒2的下表面伸出。这样将毛细管安装于超声波射筒2时，毛细管3的丝材电路12与超声波射筒2的丝材通路5同轴相连。
用钎焊料等焊料14，将与毛细管3分开形成的板状焊接作用部13焊接于毛细管3的下表面。焊接作用部13是将高速钢那样的超硬钢做成板状的零件，用焊料将其按该板状原样焊接于毛细管3的外侧面，然后在该焊接作用部13上从其外侧面向毛细管3一侧，用放电加工方法、线切割加工方法或水加工方法等形成小孔15，再对焊接作用部13的外侧面进行研磨。小孔15具有使接线9能够通过的尺寸，如图2所示，同轴连接贯通到毛细管3下表面的丝材通路12的开口。
如图3所示，支持部8在离开最大振幅点f3相等距离的左右两侧的最小振幅点f2、f4的位置上处于超声波射筒2前后的外侧面上，与毛细管3成垂直，配置在超声波射筒2上，以中心线L2和通过最大振幅点f3且与中心线L2垂直的中心线L3为线对称轴的对称位置上，而且是前后左右对称。支持部8具有根部16、中间部17和安装部18。根部16为厚板状，在最小振幅点f2、f4的位置上从超声波射筒2往外侧笔直伸出，与振动方向X垂直。中间部17连接根部16和安装部18，在与振动方向X平行的方向呈薄板状。安装部18在与振动方向X平行的方向呈厚板状。由根部16、中间部17和安装部18构成的曲柄形状是前后左右对称的形状，但左右同向也可以。超声波射筒2在中间部17形成缩颈部19，但也有不设置缩颈部19的情况。
采用本实施形态的结构，超声波射筒2通过设置于离开毛细管3等距离的两侧的最小振幅点的支持部8中的安装部18，以双支承方式安装于图外的焊接机上。在该状态下，如图1所示，接线9经过与谐振器1分开设置的箝定件20，从超声波射筒2的丝材通道5经过毛细管3的丝材通道12，从焊接作用部13的小孔15通到下方。在该状态下，接线9与超声波射筒2和毛细管3一起下降，从而由焊接作用部13的前端伸出的接线9的端部与作为焊接对象的图外半导体器件或引线框架等的电极重叠，用电极和焊接作用部13以规定的压力夹紧该端部。
特别是，超声波射筒2具有设置于毛细管3两侧的相等距离上的最小振幅点上的支持部8，由于具有这样的结构，超声波射筒2通过支持部8以双支承方式安装于焊接机，从而接线9的端部被作为接合对象的电极和毛细管3的焊接作用部13以规定压力夹紧时，将接线9焊接在电极上时的压力使超声波射筒2以接线9与电极的焊接位置为中心挠曲，能正确维持接线9与电极的焊接位置。
在正确维持接线9与电极的焊接位置的状态下，振子4激发超声波振动。该超声波振动使超声波射筒2、毛细管3和焊接作用部13在箭头X方向上谐振，该谐振产生的超声波振动从焊接作用部13作用于接线9的端部与作为焊接对象的电极的接触部，使接线9的端部与电极能够得到良好的焊接。
在实施形态中，为了使接线9通过，从超声波射筒2到毛细管3，形成丝材通路5、12，使其在上下方向直线贯通，但是做成使丝材通路5从超声波射筒2的中间部向径向外侧贯通，使接线9从超声波射筒2中途通向小孔15也同样可用。又，从超声波射筒2省略丝材通路5，使丝材通路12从毛细管3的中间部向径向外侧贯通，并且使接线9从毛细管3的中途通向小孔15，这样的结构也同样可用。虽然用与毛细管3不同的构件形成焊接作用部13，但是如果用同一构件与毛细管3一体形成，则不需要用结合剂14将焊接作用部13接合于毛细管3。

Claims (1)

1.一种超声波丝焊用的谐振器，其特征在于，超声波射筒具有在穿通接线用的毛细管两侧的最小振幅点设置的支持部。
CN02140617A 2001-07-06 2002-07-05 超声波丝焊用的谐振器 Pending CN1396034A (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101712097B (zh) * 2008-11-24 2011-09-07 深圳市创唯星自动化设备有限公司 带静电吸附的劈刀结构、超声波焊接设备及键合方法
CN102725090A (zh) * 2009-12-08 2012-10-10 欧陆汽车有限责任公司 用于加工工件的方法和装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3768432B2 (ja) * 2001-11-01 2006-04-19 株式会社新川 ボンディング装置
JP4303673B2 (ja) * 2004-11-30 2009-07-29 富士通株式会社 共振器、超音波ヘッド及びそれを用いた超音波接合装置
US20060233991A1 (en) * 2005-04-13 2006-10-19 Trivascular, Inc. PTFE layers and methods of manufacturing
US8212171B2 (en) * 2006-12-22 2012-07-03 Sonics & Materials Inc. System and method for ultrasonic assisted EDM machining
US20090127317A1 (en) * 2007-11-15 2009-05-21 Infineon Technologies Ag Device and method for producing a bonding connection
JP5313751B2 (ja) * 2008-05-07 2013-10-09 パナソニック株式会社 電子部品装着装置
JP5491081B2 (ja) * 2009-06-22 2014-05-14 株式会社アルテクス 超音波振動金属接合用共振器
US8129220B2 (en) * 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
TW201116358A (en) * 2009-11-11 2011-05-16 Cheng-Fu Wu Welding device of electric welding machine
EP2457683A1 (de) * 2010-11-25 2012-05-30 Telsonic Holding AG Torsionales Schweissen
KR102073189B1 (ko) * 2013-04-04 2020-02-04 삼성에스디아이 주식회사 이차전지용 용접혼
CN105345353B (zh) * 2015-11-27 2017-04-05 广东工业大学 一种led自动焊线机穿夹线机构
US11205634B2 (en) * 2018-07-16 2021-12-21 Asm Technology Singapore Pte Ltd Bonding apparatus with replaceable bonding tool
CN112367772A (zh) * 2020-10-28 2021-02-12 安徽瑞迪微电子有限公司 Igbt功率模块端子压焊方法
CN112872678A (zh) * 2020-12-29 2021-06-01 昆山信方达电子有限公司 一种5g通讯手机天线fpc的组装焊接压合治具

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4884334A (en) * 1986-02-05 1989-12-05 International Business Machines, Corp. Resonant stylus support
JP2812104B2 (ja) * 1992-10-26 1998-10-22 松下電器産業株式会社 超音波ワイヤボンディング装置
EP0655815B1 (en) * 1993-11-30 1997-06-04 STMicroelectronics S.r.l. an instrument for the electrical connection of integrated circuits
US5443240A (en) * 1994-02-09 1995-08-22 Branson Ultrasonics Corporation Mounting means for vibration member
US5603444A (en) * 1995-08-22 1997-02-18 Ultex Corporation Ultrasonic bonding machine and resonator thereof
JP2911394B2 (ja) * 1995-08-22 1999-06-23 株式会社アルテクス 超音波接合装置及び共振器
JP2875211B2 (ja) * 1996-06-28 1999-03-31 株式会社アルテクス 半田付け用超音波ホーン
JP3409689B2 (ja) * 1998-04-21 2003-05-26 松下電器産業株式会社 電子部品のボンディングツールおよびボンディング装置
JP3215084B2 (ja) * 1998-04-28 2001-10-02 株式会社アルテクス 超音波振動接合用共振器
JP3290632B2 (ja) * 1999-01-06 2002-06-10 株式会社アルテクス 超音波振動接合装置
JP3447982B2 (ja) * 1999-06-16 2003-09-16 株式会社アルテクス 超音波振動接合装置
JP3430095B2 (ja) * 1999-12-03 2003-07-28 株式会社アルテクス 超音波振動接合用ツール
JP3492298B2 (ja) * 2000-07-27 2004-02-03 株式会社アルテクス 超音波振動接合用ツールとそれを支持する支持装置
TW460345B (en) * 1999-08-02 2001-10-21 Arutekusu Kk Joining device by ultrasonic vibration

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101712097B (zh) * 2008-11-24 2011-09-07 深圳市创唯星自动化设备有限公司 带静电吸附的劈刀结构、超声波焊接设备及键合方法
CN102725090A (zh) * 2009-12-08 2012-10-10 欧陆汽车有限责任公司 用于加工工件的方法和装置
US9004335B2 (en) 2009-12-08 2015-04-14 Continental Automotive Gmbh Method and device for machining a workpiece
CN102725090B (zh) * 2009-12-08 2016-05-18 大陆汽车有限公司 用于加工工件的方法和装置

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DE60201382T2 (de) 2005-02-24
TW533113B (en) 2003-05-21
EP1273380A1 (en) 2003-01-08
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JP3568496B2 (ja) 2004-09-22

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