DE60201382D1 - Resonator für Ultraschallschweissen - Google Patents

Resonator für Ultraschallschweissen

Info

Publication number
DE60201382D1
DE60201382D1 DE60201382T DE60201382T DE60201382D1 DE 60201382 D1 DE60201382 D1 DE 60201382D1 DE 60201382 T DE60201382 T DE 60201382T DE 60201382 T DE60201382 T DE 60201382T DE 60201382 D1 DE60201382 D1 DE 60201382D1
Authority
DE
Germany
Prior art keywords
resonator
ultrasonic welding
ultrasonic
welding
welding resonator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60201382T
Other languages
English (en)
Other versions
DE60201382T2 (de
Inventor
Shigeru Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ultex Corp
Original Assignee
Ultex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ultex Corp filed Critical Ultex Corp
Application granted granted Critical
Publication of DE60201382D1 publication Critical patent/DE60201382D1/de
Publication of DE60201382T2 publication Critical patent/DE60201382T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/4501—Shape
    • H01L2224/45012—Cross-sectional shape
    • H01L2224/45015—Cross-sectional shape being circular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
DE2002601382 2001-07-06 2002-07-02 Resonator für Ultraschallschweissen Expired - Fee Related DE60201382T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001205925A JP3568496B2 (ja) 2001-07-06 2001-07-06 超音波ワイヤボンディング用共振器
JP2001205925 2001-07-06

Publications (2)

Publication Number Publication Date
DE60201382D1 true DE60201382D1 (de) 2004-11-04
DE60201382T2 DE60201382T2 (de) 2005-02-24

Family

ID=19042145

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2002601382 Expired - Fee Related DE60201382T2 (de) 2001-07-06 2002-07-02 Resonator für Ultraschallschweissen

Country Status (8)

Country Link
US (1) US6669074B2 (de)
EP (1) EP1273380B1 (de)
JP (1) JP3568496B2 (de)
KR (1) KR20030005017A (de)
CN (1) CN1396034A (de)
CA (1) CA2392460A1 (de)
DE (1) DE60201382T2 (de)
TW (1) TW533113B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3768432B2 (ja) * 2001-11-01 2006-04-19 株式会社新川 ボンディング装置
JP4303673B2 (ja) * 2004-11-30 2009-07-29 富士通株式会社 共振器、超音波ヘッド及びそれを用いた超音波接合装置
US20060233991A1 (en) * 2005-04-13 2006-10-19 Trivascular, Inc. PTFE layers and methods of manufacturing
US8212171B2 (en) * 2006-12-22 2012-07-03 Sonics & Materials Inc. System and method for ultrasonic assisted EDM machining
US20090127317A1 (en) * 2007-11-15 2009-05-21 Infineon Technologies Ag Device and method for producing a bonding connection
JP5313751B2 (ja) * 2008-05-07 2013-10-09 パナソニック株式会社 電子部品装着装置
CN101712097B (zh) * 2008-11-24 2011-09-07 深圳市创唯星自动化设备有限公司 带静电吸附的劈刀结构、超声波焊接设备及键合方法
JP5491081B2 (ja) * 2009-06-22 2014-05-14 株式会社アルテクス 超音波振動金属接合用共振器
US8129220B2 (en) * 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
TW201116358A (en) * 2009-11-11 2011-05-16 Cheng-Fu Wu Welding device of electric welding machine
DE102009057410A1 (de) * 2009-12-08 2011-06-09 Continental Automotive Gmbh Verfahren und Vorrichtung zum Bearbeiten eines Werkstücks
EP2457683A1 (de) * 2010-11-25 2012-05-30 Telsonic Holding AG Torsionales Schweissen
KR102073189B1 (ko) * 2013-04-04 2020-02-04 삼성에스디아이 주식회사 이차전지용 용접혼
CN105345353B (zh) * 2015-11-27 2017-04-05 广东工业大学 一种led自动焊线机穿夹线机构
US11205634B2 (en) * 2018-07-16 2021-12-21 Asm Technology Singapore Pte Ltd Bonding apparatus with replaceable bonding tool
CN112367772A (zh) * 2020-10-28 2021-02-12 安徽瑞迪微电子有限公司 Igbt功率模块端子压焊方法
CN112872678A (zh) * 2020-12-29 2021-06-01 昆山信方达电子有限公司 一种5g通讯手机天线fpc的组装焊接压合治具

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4884334A (en) * 1986-02-05 1989-12-05 International Business Machines, Corp. Resonant stylus support
JP2812104B2 (ja) * 1992-10-26 1998-10-22 松下電器産業株式会社 超音波ワイヤボンディング装置
EP0655815B1 (de) * 1993-11-30 1997-06-04 STMicroelectronics S.r.l. Einrichtung für die elektrische Verbindung von integrierten Schaltungen
US5443240A (en) * 1994-02-09 1995-08-22 Branson Ultrasonics Corporation Mounting means for vibration member
US5603444A (en) * 1995-08-22 1997-02-18 Ultex Corporation Ultrasonic bonding machine and resonator thereof
JP2911394B2 (ja) * 1995-08-22 1999-06-23 株式会社アルテクス 超音波接合装置及び共振器
JP2875211B2 (ja) * 1996-06-28 1999-03-31 株式会社アルテクス 半田付け用超音波ホーン
JP3409689B2 (ja) * 1998-04-21 2003-05-26 松下電器産業株式会社 電子部品のボンディングツールおよびボンディング装置
JP3215084B2 (ja) * 1998-04-28 2001-10-02 株式会社アルテクス 超音波振動接合用共振器
JP3290632B2 (ja) * 1999-01-06 2002-06-10 株式会社アルテクス 超音波振動接合装置
JP3447982B2 (ja) * 1999-06-16 2003-09-16 株式会社アルテクス 超音波振動接合装置
JP3430095B2 (ja) * 1999-12-03 2003-07-28 株式会社アルテクス 超音波振動接合用ツール
JP3492298B2 (ja) * 2000-07-27 2004-02-03 株式会社アルテクス 超音波振動接合用ツールとそれを支持する支持装置
TW460345B (en) * 1999-08-02 2001-10-21 Arutekusu Kk Joining device by ultrasonic vibration

Also Published As

Publication number Publication date
EP1273380B1 (de) 2004-09-29
CA2392460A1 (en) 2003-01-06
US6669074B2 (en) 2003-12-30
US20030006265A1 (en) 2003-01-09
DE60201382T2 (de) 2005-02-24
TW533113B (en) 2003-05-21
EP1273380A1 (de) 2003-01-08
CN1396034A (zh) 2003-02-12
KR20030005017A (ko) 2003-01-15
JP2003023031A (ja) 2003-01-24
JP3568496B2 (ja) 2004-09-22

Similar Documents

Publication Publication Date Title
DE60130298D1 (de) Akustischer Resonator
DE60202325D1 (de) Behälter für Schweissdraht
DE60203153D1 (de) Rasiergerät
DE60201382D1 (de) Resonator für Ultraschallschweissen
DE60239035D1 (de) Zwischenschichtvorbereitung für geschweisste Verbindungsstelle
ATE295923T1 (de) Verbindungsflansch für rohrförmige bauteile
DE69919822D1 (de) Ultraschallschwingungsschweissverfahren
DE60223857D1 (de) Verbindung für Bewehrungsstäbe und Verbindungsverfahren
DE60212216D1 (de) Giessformanordnung für exothermisches Schweissen
DE60227134D1 (de) Verbindungsanordnung
DE60132410D1 (de) Resonator
DE60237872D1 (de) Knetapparat
DE60229433D1 (de) Isches koppler
DE50109453D1 (de) Resonatoranordnung
DE50211054D1 (de) Frequenzabstimmbarer resonator
DE60220521D1 (de) Doppelbrechungsmessung für wellenlängen im tiefen ultraviolettbereich
DE60127669D1 (de) Flüssigkeitsundurchlässige ultraschallerzeugte punktverschweissungen
FR2830063B1 (fr) Joint homocinetique
DE60206685D1 (de) Rasierkopf
DE60229764D1 (de) Entgratwerkzeug
DE60111790D1 (de) Laserschweissverfahren
DE60222035D1 (de) Vibrationswellenantrieb
SE0202849L (sv) Sonarlokalisering
DE50213801D1 (de) Gelenk
DE50208514D1 (de) Spannvorrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee