CN1360685A - 碱显影型光固化性组合物及使用该组合物所得的烧成物图案 - Google Patents
碱显影型光固化性组合物及使用该组合物所得的烧成物图案 Download PDFInfo
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- CN1360685A CN1360685A CN00810240A CN00810240A CN1360685A CN 1360685 A CN1360685 A CN 1360685A CN 00810240 A CN00810240 A CN 00810240A CN 00810240 A CN00810240 A CN 00810240A CN 1360685 A CN1360685 A CN 1360685A
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- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 1
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- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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- 235000019352 zinc silicate Nutrition 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/006—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character
- C03C17/007—Surface treatment of glass, not in the form of fibres or filaments, by coating with materials of composite character containing a dispersed phase, e.g. particles, fibres or flakes, in a continuous phase
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
- C03C17/04—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass by fritting glass powder
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
- G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
- C03C2217/44—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the composition of the continuous phase
- C03C2217/445—Organic continuous phases
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/40—Coatings comprising at least one inhomogeneous layer
- C03C2217/43—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase
- C03C2217/46—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase
- C03C2217/47—Coatings comprising at least one inhomogeneous layer consisting of a dispersed phase in a continuous phase characterized by the dispersed phase consisting of a specific material
- C03C2217/475—Inorganic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/22—Electrodes
- H01J2211/225—Material of electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/36—Spacers, barriers, ribs, partitions or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/38—Dielectric or insulating layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/42—Fluorescent layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
- H01J2211/20—Constructional details
- H01J2211/34—Vessels, containers or parts thereof, e.g. substrates
- H01J2211/44—Optical arrangements or shielding arrangements, e.g. filters or lenses
- H01J2211/444—Means for improving contrast or colour purity, e.g. black matrix or light shielding means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
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- Chemical & Material Sciences (AREA)
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- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Engineering & Computer Science (AREA)
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- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Ceramic Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Materials For Photolithography (AREA)
- Conductive Materials (AREA)
- Glass Compositions (AREA)
Abstract
一种碱显影型光固化性组合物,含有(A)使具有乙烯性不饱和键且一分子中有一个羧基的化合物(a)与具有乙烯性不饱和键的不具有羟基及酸性基的化合物(b)的共聚物的羧基,或使具有乙烯性不饱和键且一分子中具有一个羧基的化合物(a)与具有乙烯性不饱和键的不具有羟基及酸性基的化合物(b)及具有乙烯性不饱和键及羟基的化合物(c)的共聚物的羧基,与一分子中具有一个缩水甘油基的化合物(d)反应,使生成的仲羟基及该共聚物中的伯羟基与多碱基酸酐(e)反应而得的重量平均分子量5,000~100,000,酸价50~150mg/KOH的碱可溶性高分子粘合剂,(B)无机粉体,(C)光聚合性单体,(D)光聚合引发剂,及(E)有机溶剂。此组合物在保存稳定性优越,通过使用此组合物,由影印技术可容易的形成高精细的导体图案,介电体图案等烧成物图案。
Description
技术领域
本发明涉及适用于等离子体显示面板(PDP)的前面基板或背面基板所形成的导体图案或隔壁图案,介电体图案、萤光体图案、黑底的形成,在萤光显示管及电子组件用的导电体、电阻体、介电体的形成方面亦可适用的利用碱水溶液可显影的光固化性组合物,及使用该组合物而得的导体图案或玻璃质介电体图案、萤光体图案等的烧成物图案。
背景技术
近年,等离子体显示面板的前面基板、背面基板或印刷电路板的电极电路基板等方面随着形成图案的高精细化进展,图案形成技术的提高亦令人期待的。尤其,等离子体显示面板在向大型高视野(highvision)化的技术革新是令人瞩目的,最近各制造厂商,以将50英寸级予以制品化、更大型化、高视野化作为目标。
现有,等离子体显示面板、萤光显示管、电子组件等的导体图案或介电体图案的形成,通常以采用含有极多量的金属粉或玻璃粉末的导电性糊或玻璃糊,利用丝网印刷法,进行图案形成。然而在利用丝网印刷法的图案形成,需熟练,又印刷时的渗墨,归因于丝网的伸缩的位置对正精度的降低,丝网筛目痕的杂乱等问题,良品率降低,对高精细图案或大型化的对应即成为困难。因此,可对应于较稳定,高精细且可大型化的图案加工材料是令人期待的。
因此,至于可取代丝网印刷法的图案形成法,有影印(photolithography)法被提出(例如日本特开平1-296534号、特开平2-165538号、特开平5-342992号)。影印是将紫外线固化型玻璃浆材料涂布于绝缘基板上,利用曝光、显影以形成图案。
于影印的显影中,出于对环境问题的顾虑,以碱显影型成为主流。因此,为使成碱显影型,具有羧基的高分子化合物主要被用作被膜形成成分。
然而,若于具有羧基的高分子化合物内配合玻璃釉类碱性无机微粒子时,则所得的玻璃浆组合物的粘度稳定性变成极恶劣。因此,由组合物的凝胶化或流动性的降低引起的涂布作业性的恶化或生成涂膜的显影性的降低,有未能取得足够的作业从容度的问题存在。
本发明是鉴于前述的现有技术的问题点而完成的,其基本目的是提供即使含有极多量的无机微粉末,亦在贮存稳定性(粘度稳定性)或涂布作业性,由碱水溶液引起的显影性优越,同时在烧成工序不致生成图案边缘的翘曲或剥离等,可形成高精细、高长径比的图案的碱显影型的光固化性组合物。
本发明的另一目的,是提供烧成性优越,可在较低的温度烧成,又在干燥、曝光、显影、烧成的各工序,显示出对基板的稳定密合性的碱显影型光固化性组合物。
本发明的较具体的目的,是利用影印技术可形成作业性、生产性良好、高精细的导体电路图案或玻璃质介电体图案、萤光体图案,而且不致生成对影像有恶劣影响的烧成残渣,可在600℃以下进行烧成工序的碱显影型光固化性组合物。
本发明的再一其它目的,是提供由此种光固化性组合物由选择性曝光、显影及烧成的一系列工序生产性良好的制出的高精细烧成物图案及其制造技术。
发明公开
为实现前述目的,本发明的第一方案,是提供含有
(A)使具有乙烯性不饱和键且一分子中有一个羧基的化合物(a)及具有乙烯性不饱和键的不具有羟基及酸性基的化合物(b)的共聚物的羧基,或使具有乙烯性不饱和键且一分子中具有一个羧基的化合物(a)与具有乙烯性不饱和键的不具有羟基及酸性基的化合物(b)及具有乙烯性不饱和键及羟基的化合物(c)的共聚物的羧基,与一分子中具有一个缩水甘油基的化合物(d)反应,使生成的仲羟基及该共聚物中的伯羟基与多碱基酸酐(e)反应而得的重量平均分子量5,000~100,000,酸价50~150mg/KOH的碱可溶性高分子粘合剂,
(B)无机粉体,
(C)光聚合性单体,
(D)光聚合引发剂及
(E)有机溶剂,
为特征的碱显影型光固化性组合物。较合适为上述无机粉体(B)之中5重量%以上为低熔点玻璃釉而成。
本发明的光固化性组合物可为糊状形态,亦可为事先已成膜的干膜形态。
糊状形态的情形,若采用导电性微粒子作为前述无机粉末(B)时,则成为光固化性导电糊组合物,若仅采用玻璃粉末时,则成为光固化性玻璃糊组合物。又黑色图案用糊组合物的情形,再含有黑色颜料。
至于上述无机粉体,可较合适的使用10μm以下的粒径的粉末。
至于光固化性导电糊时的导电性微粒子,可采用钌、金、银、铜、钯、铂、铝、镍等导电性金属粉或黑色导电性微粒子。另一方面光固化性玻璃糊时,可较合适使用软化点300~600℃的低熔点玻璃。
至于黑色颜料,可较合适使用由含有以Fe、Co、Cu、Cr、Mn、Al的一种或二种以上为主成分的金属氧化物而成的黑色颜料。
本发明的碱显影型光固化性组合物,碱可溶性高分子粘合剂的羧基因主链和侧链的立体障碍而抑制了与碱性的无机微粒子的接触,尽管可以由碱性水溶液进行显影,但粘度稳定性(保存稳定性)优良,因凝胶化或流动性的降低导致涂布操作性恶化,或因显影性的降低而导致图案形成性变差。光固化性组合物中含有这种碱可溶性高分子粘合剂和稳定剂时,即使含有多量的无机粉体也可显示优良的保存稳定性。
再者,若依本发明的其它方案,可提供由前述的光固化性组合物所形成的烧成物图案。例如前述光固化性组合物为糊状形态时,于基板上涂布糊状光固化性组合物,干燥并成膜,另一方面于干膜形态的情形是于基板上层合,其后利用选择性曝光、显影予以电路布线图案化后,烧成,可得高精细的烧成物图案。
如此所形成的烧成物图案,在使用金属微粒子作为前述无机粉体(B)时,成为导电图案,采用玻璃粉末时,成为玻璃介电体图案。又通过使用萤光体粉体作为无机粉末时,亦可形成萤光体图案。发明的最佳实施形态
如前述,现有的碱显影型光固化性浆组合物的情形,贮存稳定性(粘度稳定性)极差,由组合物的凝胶化或流动性的降低引起的涂布作业性的恶化或涂膜的显影性的降低,有作业条件的设定被制限成极狭窄的范围的问题存在。
因此,本发明人等,以抑制碱性无机微粒子及羧基的反应为目的,尝试于碱显影型光固化性糊组合物内添加有机酸或无机酸。然而,此时组合物凝胶化虽可予抑制,只是干燥后的涂膜的指触干燥性会降低,其后的作业性会低劣,或经予描绘的图案上有针孔发生,生成图案线的缺陷等缺点。
为解决此问题,本发明人等精心研究,结果发现通过抑制使对碱可溶性高分子粘合剂的羧基带来立体阻碍的碱性无机微粒子间的接触,可得显示出优越的贮存稳定性的感光性糊组合物,从而完成本发明。
本发明的光固化性组合物,作为无机粉体的粘合剂,采用使具有乙烯性不饱和键且一分子中有一个羧基的化合物(a)及具有乙烯性不饱和键的不具有羟基及酸性基的化合物(b)的共聚物的羧基,或使具有乙烯性不饱和键且一分子中具有一个羧基的化合物(a)与具有乙烯性不饱和键的不具有羟基及酸性基的化合物(b)及具有乙烯性不饱和键及羟基的化合物(c)形成的共聚物的羧基,与一分子中具有一个缩水甘油基的化合物(d)反应,使生成的仲羟基及该共聚合物中的伯羟基,与多碱基酸酐(e)反应而得的重量平均分子量5,000~100,000,酸价50~150mg/KOH的碱可溶性高分子粘合剂(A)。
此高分子粘合剂(A)因是于侧链上具有羧基,对碱水溶液是可溶性的,因此,由本发明的光固化性组合物所形成的被膜,于经选择性曝光后利用碱水溶液进行稳定的显影即成为可能。
另一方面,上述侧链的羧基,是包含使于上述共聚物的羧基与分子中有一个缩水甘油基的化合物(d)反应,于由此而生成且位于主链附近的仲羟基上使多碱基酸酐进行加成反应并予导入,且该羧基是键结至侧链的主链附近部位上,故由主链与侧链的立体阻碍使与碱性无机微粒子间的接触可予抑制。结果,同时含有无机微粒子,此种碱可溶性高分子粘合剂的组合物,是显示出优越的贮存稳定性,在贮存中几乎不生成粘度的变化或凝胶化。
又,以合并使用本发明所用的碱可溶性高分子粘合剂(A)及稳定剂(F),可得显示出优越的贮存稳定性的感旋光性组合物。若采用比高分子粘合剂(A)的侧链羧基强的酸,例如无机酸、有机酸、磷酸化合物等作为稳定剂(F)时,则侧链羧基与碱性无机粉体间的反应可予进一步抑制。结果,同时含有无机粉末及此种碱可溶性高分子粘合剂的组合物,添加稳定剂可再显示出优越的贮存稳定性。
又,本发明的光固化性组合物,组成玻璃糊时,虽可采用低熔点玻璃粉末作为前述无机粉末(B),只是于采用组成导电性糊时的金属粉等,采用其它的无机粉末的情形亦宜为配合5重量%以上的低熔点玻璃粉末,从而在600℃以下的温度烧成即成为可能,又烧成物图案对基板的密合性会提高。
结果,本发明的光固化性组合物,无贮存稳定性低劣、凝胶化或因流动性的降低引起的涂布作业性恶劣的问题,由影印技术可容易的于大面积的基板上形成高精细的图案,而且亦可在600℃以下的烧成工序中充分使用,可实现良品率的大幅提高。
以下详细说明本发明的光固化性组合物的各成分。
至于本发明所用的碱可溶性高分子粘合剂(A)的骨干聚合物的单体成分,可采用具有乙烯性不饱和键,且一分子中具有一个羧基的化合物(a)。至于此种化合物的具体例,可举出有:丙烯酸、甲基丙烯酸、巴豆酸或醋酸乙烯酯,再者有顺丁烯二酸酐、衣康酸酐、均苯四酸酐等的酸酐与(甲基)丙烯酸2-羟乙酯、(甲基)丙烯酸2-羟丙酯等(甲基)丙烯酸羟烷酯类等具有羟基的不饱和化合物间的反应物等。此等化合物是可单独采用或可组合二种以上采用。此等之中丙烯酸及/或甲基丙烯酸(以下总称此等为(甲基)丙烯酸)优选。且本发明说明书中(甲基)丙烯酸酯,是总称丙烯酸酯及甲基丙烯酸酯的用语。
至于前述一分子中具有乙烯性不饱和键,不具有羟基及酸性基的化合物(b),可举出有:苯乙烯、氯苯乙烯、α-甲基苯乙烯;具有作为取代基的甲基、乙基、正丙基、异丙基、丁基、异丁基、叔丁基、戊基、2-乙己基、辛基、壬基、癸基、十六烷基、十八烷基、环己基、异冰片基、甲氧基乙基、丁氧基乙基、2-羟乙基、2-羟丙基、3-氯-2-羟丙基等的(甲基)丙烯酸酯;聚乙二醇的单(甲基)丙烯酸酯或聚丙二醇的单(甲基)丙烯酸酯;醋酸乙烯酯,丁酸乙烯基酯,苯甲酸乙烯基酯;丙烯酰胺、甲基丙烯酰胺、N-羟基甲基丙烯酰胺、N-羟基甲基甲基丙烯酰胺、N-甲氧基甲基丙烯酰胺、N-乙氧基甲基丙烯酰胺、N-丁氧基甲基丙烯酰胺、丙烯腈、乙烯醚类、或异丁烯等。此等化合物可单独使用或亦可组合二种以上使用。此等化合物之中宜为采用苯乙烯、α-甲基苯乙烯、(甲基)丙烯酸低级烷基酯、异丁烯等,由树脂的热分解性的观点尤宜为甲基丙烯酸甲酯。
至于具有乙烯性不饱和键及羟基的化合物(c),可举出有:甲基丙烯酸2-羟乙酯、甲基丙烯酸2-羟丙酯、丙烯酸2-羟乙酯、丙烯酸2-羟丙酯等。此等化合物是可单独使用亦可组合二种以上使用。此等化合物之中,甲基丙烯酸2-羟乙酯较优选。
具有此种乙烯性不饱和键,且一分子中有一个羧基的化合物(a),与具有乙烯性不饱和键,不具有羟基及酸性基的化合物(b)间的共聚合反应,或具有乙烯性不饱和键且一分子中有一个羧基的化合物(a),与具有乙烯性不饱和键,不具有羟基及酸性基的化合物(b),与具有乙烯性不饱和键及羟基的化合物(c)间的共聚合反应,例如在偶氮异丁腈、有机过氧化物等游离基聚合催化剂的存在下可容易进行,依常用方法例如可利用约40~130℃的溶液聚合法等进行,生成无规共聚物。
至于前述一分子中具有一个缩水甘油基的化合物(d),可举出:甲基缩水甘油基醚、丁基缩水甘油基醚、2-乙基己基缩水甘油基醚、苯基缩水甘油基醚、甘油内醚等缩水甘油基醚等。又至于具有缩水甘油基的乙烯性不饱和化合物,例如有具有乙烯基、烯丙基、丙烯酰基等的缩水甘油基化合物。
所谓具有缩水甘油基的乙烯性不饱和化合物,可举出:(甲基)丙烯酸缩水甘油基酯、烯丙基缩水甘油基醚、(甲基)丙烯酸α-甲基环氧丙酯、(甲基)丙烯酸α-乙基环氧丙酯等。此等之中宜为丁基缩水甘油基醚。
又,具有此种缩水甘油基的化合物(d)对共聚合物侧链(羧基)的加成反应,及利用该加成反应生成的仲羟基的饱和或不饱和的多碱基酸酐(e)的酯化反应,为使反应促进而使用催化剂,例如三乙胺、苄基二甲基胺、氯化甲基三乙基铵、溴化四丁基铵、溴化苄基三甲基铵、碘化苄基三甲基铵、三苯基膦、三苯基、辛烷酸铬、辛烷酸锆等优选。该催化剂的使用量对反应原料混合物宜为0.1~10重量%。上述加成反应及酯化反应的反应温度宜为60~120℃。且,多碱基酸酐(e)的反应比率,是含有如此而得的羧基的聚合物的酸价是予以调整成50~150mgKOH/g为优选。
至于此酯化反应所用的前述多碱基酸酐(e),可举出有:顺丁烯二酐、琥珀酸酐、邻苯二甲酸酐、四氢化邻苯二甲酸酐、六氢化邻苯二甲酸酐、甲基四氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、甲基端亚甲基四氢邻苯二甲酸酐、端亚甲基四氢邻苯二甲酸酐、氯菌酸酐、偏苯三酸酐等。此等多碱基酸酐,可单独使用或可组合二种以上使用。
至于上述的成分构成的碱可溶性高分子粘合剂(A),可较合适使用重量平均分子量5,000~100,000,宜为6,000~30,000及酸价50~150mgKOH/g,宜为60~100mgKOH/g的。高分子粘合剂(A)的分子量较5,000为低时,对显影时的涂布层的密合性赋与恶影响,另一方面较100,000高时,较易发生显影不良,故并不宜。又酸价较50mgKOH/g低时,对碱水溶液的溶解性并不足够,于曝光后的涂布层变成容易生成显影不良,另一方面酸价较150mgKOH/g高时,因变成容易生成显影时涂布层的密合性的劣化或光固化部(曝光部)的溶解,故并不合适。
此种碱可溶性高分子粘合剂(A),以组合物全量的5~50重量%的比例配合优选。该高分子粘合剂的配合量较上述范围过少的情形,形成的被膜中的上述树脂的分布容易变成不均,由选择性曝光、显影引起的高精细图案形成是成为困难。另一方面若较上述范围亦过多时,容易生成烧成时的图案的扭曲或线幅收缩,故并不优选。
至于以本发明的光固化性组合物为导电性糊并予处方的情形所用的无机粉体(B)的具体例,可举出有:金属微粒子(B-1)或黑色导电性微粒子(B-2),与此等的导电性微粒子及玻璃微粒子(B-3)的混合物。
至于金属微粒子(B-1),可采用金、银、铜、钌、钯、铂、铝、镍等或此等的合金。上述金属微粒子是可单独采用或组合二种类以上使用,至于平均粒径,从分辨率方面考虑为10μm以下,宜为5μm以下的粒径。又,此等的金属微粒子可单独使用或合并使用二种以上的球状、砖块状、鳞片状、树枝状的物。又为此等的金属微粒子的防止氧化组合物的提高分散性、显影性的稳定化,对Ag、Ni、Al以进行利用脂肪酸的处理为尤宜。至于脂肪酸,可举出油酸、亚油酸、亚麻酸、硬脂酸等。
又,黑色导电性微粒子(B-2),是于PDP用电极制造工序,因随着500~600℃的高温烧成,有在高温的色调或导电性的稳定性者的必要,例如以钌氧化物或钌化合物,铜-铬系黑色复合氧化物,铜-铁系黑色复合氧化物等较适合使用。尤其钌氧化物或钌化合物,因在高温的色调或导电性的稳定性方面极优越,故最适合。
此种导电性微粒子的配合量,以相对于前述碱可溶性高分子粘合剂(A)100重量份为25~1,000重量份的比例较适当。导电性微粒子的配合量较上述范围亦少的情形,容易生成导体电路的绵幅收缩或断线,另一方面,若超过上述范围予以大量配合时,则较难获得不损及透光性,组合物的足够光固化性。
再者,为提高烧成后的被膜的强度,对基板的密合性,对金属粉100重量份可以5~30重量份的范围添加后述的玻璃粉末(B-3)。
以本发明的光固化性组合物为玻璃糊并予处方的情形所用的玻璃粉末(B-3),可采用软化点300~600℃的低熔点玻璃釉,以氧化铅、氧化铋、氧化锌或氧化锂为主成分者可较合适使用。又至于低熔点玻璃釉,宜采用玻璃化温度300~550℃,热膨胀系数α300=70~90×10-7/℃者,从分辨率方面考虑,平均粒径是10μm以下,较宜采用2.5μm以下者。
玻璃粉末的配合量相对于前述碱可溶性高分子粘合剂(A)100重量份优选为25~1,000重量份。
至于以氧化铅为主成分的玻璃粉末的较佳例子,可举出有:以氧化物基准的重量%计,有PbO:48~82%、B2O3:0.5~22%、SiO2:3~32%、Al2O3:0~12%、BaO:0~10%、ZnO:0~15%、TiO2:0~2.5%、Bi2O3:0~25%的组成,软化点为420~590℃的非结晶性釉。
至于以氧化铋为主成分的玻璃粉末的较佳例子,可举出有:以氧化物基准的重量计,有Bi2O3:35~88%、B2O3:5~30%、SiO2:0~20%、Al2O3:0~5%、BaO:1~25%、ZnO:1~20%的组成,软化点为420~590℃的非结晶釉。
至于以氧化锌为主成分的玻璃粉末的较佳例子,可举出有:以氧化物基准的重量计,有ZnO:25~60%、K2O:2~15%、B2O3:25~45%、SiO2:1~7%、Al2O3:0~10%、BaO:0~20%、MgO:0~10%的组成,软化点为420~590℃的非结晶性釉。
至于以氧化锂为主成分的玻璃粉末的较佳例子,可举出有:以氧化物基准的重量计,有Li2O:1~13%、Bi2O3:0~30%、B2O3:1~50%、SiO2:1~50%、Al2O3:1~40%、BaO:1~20%、ZnO:1~25%的组成,软化点为420~590℃的非结晶性釉。
使糊的色调成黑色的情形,可添加含有以Fe、Co、Cu、Cr、Mn、Al的一种或二种以上为主成分的金属氧化物或复合氧化物而成的黑色颜料。至于此种黑色颜料,从黑色度方面考虑,平均粒径为1.0μm以下,宜为0.6μm以下。
至于以本发明的光固化性组合物为萤光体糊并予处方的情形所用的无机粉末(B-3),因用途可采用各种的萤光体粉末,例如于由氧化钙、氧化锶、氧化钡、氧化铝、氧化铈等短周期表的属于IIa族、IIIa族、及IIIb族的元素的金属氧化物的至少一种内,混合用作赋活剂或共赋活剂的Sc、Y、La、Ce、Pr、Nd、Sm、Eu、Gd、Tb、Dy、Ho、Er、Tm、Yb及Lu中选出的至少一种稀土类元素,采用具有经予烧结的一种陶瓷构造的长残光性萤光物质或代表性的磷光体的锌或碱土类的硫化物等萤光物质。于等离子体显示面板的萤光层,通常采用(Y,Gd)BO3:Eu(以铕(Eu)为发光中心的钇(Y),钆(Gd)的硼酸盐,红色发光),Zn2SiO4:Mn(以锰(Mn)为发光中心的硅酸锌、绿色发光),BaO6Al2O3:Mn(绿色发光),BaMgAl14O23:Eu(以Eu为发光中心的铝酸钡镁,蓝色发光)。此等萤光体粉末的平均粒径为10μm以下,宜为5μm以下为佳,又其配合比率是与前述金属粉的情形相同。
至于可添加于本发明的光固化性组合物的其它无机微粒子(B-4),可举出有陶瓷微粒子。至于陶瓷微粒子,宜采用氧化铝、瑾青石,锆石之中的一种或二种以上。又,从分辨率方面考虑,可采用平均粒径10μm以下,宜为2.5μm以下的陶瓷微粒子。
本发明所用的无机粉体,因以10μm以下的粒径者较合适使用,故以防止二次凝集、提高分散性为目的,在不损及无机粉体的性质的范围内采用已事先用有机酸、无机酸、硅烷偶合剂、钛酸盐系偶合剂、铝系偶合剂等处理者,优选在将光固化性组合物形成糊时,添加上述处理剂。至于无机粉体的处理方法,使上述的表面处理剂溶解于有机溶剂或水等后,添加搅拌无机粉体,馏出溶剂后,在约50~200℃施加加热处理2小时以上为佳。
至于前述光聚合性单体(C),可举出有:二丙烯酸二乙二醇酯、二丙烯酸三乙二醇酯、二丙烯酸聚乙二醇酯、二丙烯酸壬二醇、二丙烯酸聚胺酸酯、三丙烯酸三羟甲基丙烷酯、三丙烯酸季戊四醇酯、三羟甲基丙烷环氧乙烷改质三丙烯酸酯、丙烯酸二季戊四醇酯、四丙烯酸二季戊四醇酯及对应于上述丙烯酸酯的甲基丙烯酸酯类、多碱基酸及(甲基)丙烯酸羟烷基酯的单、二、三或三以上的聚酯,具有多碱基酸及OH基的多官能(甲基)丙烯酸酯单体的单、二、三或三以上的聚酯等。此等光聚合性单体,可单独使用或组合二种以上。
上述光聚合性单体(C)的配合比例,从组合物的光固化促进方面考虑,一般相对于前述碱可溶性高分子粘合剂(A)100重量份配合1~200重量份,宜为20~100重量份较合适。
至于前述光聚合引发剂(D)的具体例,有苯偶因、苯偶因甲醚、苯偶因乙醚、苯偶因丙醚等的苯偶因与苯偶因烷基醚类;苯乙酮、2,2-二甲氧基-2-苯基苯乙酮、2,2-二乙氧基-2-苯基苯乙酮、1,1-二氯苯乙酮等苯乙酮类、2-甲基-1-〔4-(甲基硫代)苯基〕-2-吗啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-吗啉基苯基)-丁烷-1-酮等胺基苯乙酮类;2-甲基蒽醌、2-乙基蒽醌、2-叔丁基蒽醌、1-氯蒽醌、2-戊基蒽醌等蒽醌类;2,4-二甲基硫杂呫吨酮、2,4-二乙基硫杂呫吨酮、2-氯硫杂呫吨酮、2,4-二异丙基硫杂呫吨酮等硫杂呫吨酮类;苯乙酮二甲基酮缩醇、苄基二甲基酮缩醇等酮缩醇类;二苯酮等二苯酮类;呫吨酮类;氧化(2,6-二甲氧基苯甲酰基)-2,4,4-戊基膦、氧化双(2,4,6-三甲基苯甲酰基)-苯基膦、乙基-2,4,6-三甲基苯甲酰基苯基膦酸酯等氧化膦类;各种过氧化物类:1,7-双(9-
啶基)庚烷等。此种公知惯用的光聚合引发剂,可单独使用亦可组合二种以上使用。此等光聚合引发剂(D)的配合比率,相对于每100重量份碱可溶性高分子粘合剂优选为1~20重量份。
又,上述的光聚合引发剂(D),可使用N,N-二甲基胺基苯甲酸异戊酯、N,N-二甲基胺基苯甲酸异戊酯、戊基-4-二甲基胺基苯甲酸酯、三乙胺、三乙醇胺等叔胺类的公知惯用的光增感剂的一种或组合二种以上使用。
再者对被要求较深的光固化性深度的情形,因应必要时,可使用在可见光领域引发自由基聚合物的Ciba Speciality Chemicals公司(汽巴特殊化学品公司)制造的CGI784等芳环烯钛衍生物系光聚合引发剂,3-取代香豆素色素,隐色染料等作为固化助剂并可予组合使用。
有机溶剂(E),是通过稀释光固化性组合物予以糊化,使涂有工序可成为容易进行,其次干燥并予造膜,供可接触曝光而使用。具体而言,可使用甲乙酮、环己酮等酮类;甲苯、二甲苯、四甲基苯等芳香族烃类;2-乙氧基乙醇、2-甲氧基乙醇、卡必醇、甲基卡必醇、丁基卡必醇、丙二醇单甲醚、二丙二醇单甲醚、二丙二醇单乙醚、三乙二醇单乙醚等二醇醚类;醋酸乙酯、醋酸丁酯、乙氧基乙醇乙酸酯、丁基乙氧基乙醇乙酸酯、卡必醇乙酸酯、丁基卡必醇乙酯、丙二醇单甲醚乙酸酯、二丙二醇单甲基醚乙酸酯等醋酸酯类;辛烷、癸烷等脂肪族烃;石油醚、石油脑、氢化石油脑、石油脑溶剂等石油系溶剂等公知惯用的有机溶剂。此等有机溶剂是可单独使用或可组合二种以上。
有机溶剂的使用量,若为可调整成因应涂布方法的光固化性组合物的所期待的粘度的量比例时即可。
在与本发明有关的光固化性组合物,为提高组合物的保存稳定性,可添加与金属或氧化物粉末间的配位化合物化或盐形成等的效果的化合物作为稳定剂。
至于稳定剂,可合适的采用无机酸、有机酸、磷酸化合物(无机磷酸、有机磷酸)等酸。此种稳定剂,以相对于每100重量份添加5重量份以下的比例优选。
至于无机酸,可举出:硝酸、硫酸、盐酸、硼酸等。
又至于有机酸,可举出:甲酸、乙酸、乙酰乙酸、柠檬酸、异柠檬酸、茴香酸、丙酸、丁酸、异丁酸、戊酸、异戊酸、壬二酸、已酸、异已酸、庚酸、辛酸、壬酸、十一烷酸、月桂酸、十三烷酸、肉豆蔻酸、棕榈酸、硬脂酸、花生酸、二十二酸、草酸、丙二酸、乙基丙二酸、琥珀酸、戊二酸、已二酸、庚二酸、丙酮酸、胡椒基酸、苯偏三甲酸、辛二酸、壬二酸、癸二酸、顺丁烯二酸、反丁烯二酸、苯二甲酸、间苯二甲酸、对苯二甲酸、酒石酸、乙酰丙酸、乳酸、苯甲酸、异丙基苯甲酸、水杨酸、巴豆酸、异巴豆酸、丙烯酸、甲基丙烯酸、惕各酸、乙基丙烯酸、亚乙基丙酸、二甲基丙烯酸、香茅酸、十一烯酸、十一烷酸、油酸、反油酸、芥酸、巴西烯酸、苯基醋酸、桂皮酸、甲基桂皮酸、
甲酸、松香酸、乙炔二羧酸、α-苯基乳酸、衣康酸、山梨糖酸、香草酸、羟基桂皮酸、羟基萘甲酸、羟基丁酸、联苯基二羧酸、苯基桂皮酸、苯基醋酸、苯基丙酸、苯氧基乙酸、丙酸、已烷酸、庚烷酸、藜芦酸、苄基酸、乙二酸一酰琥珀酸、乙二酸一酰乙酸、辛烷酸、没食子酸、苦杏仁酸、甲基丙二酸、苯六甲酸、月桂酸、蓖麻醇酸、亚油酸、苹果酸等。
至于无机磷酸,可举出有:磷酸、亚磷酸、次磷酸、正磷酸、二磷酸、三多磷酸、磺酸等。
又至于有机磷酸,可举出有:磷酸甲酯、磷酸乙酯、磷酸丙酯、磷酸丁酯、磷酸苯酯、磷酸二甲酯、磷酸二乙酯、磷酸二丁酯、磷酸二丙酯、磷酸二苯酯、磷酸异丙酯、磷酸二异丙酯、磷酸正丁酯、亚磷酸甲酯、亚磷酸乙酯亚磷酸丙酯、亚磷酸丁酯、亚磷酸苯酯、亚磷酸二甲酯、亚磷酸二乙酯、亚磷酸二丁酯、亚磷酸二丙酯、亚磷酸二苯酯、亚磷酸异丙酯、亚磷酸二异丙酯、亚磷酸正丁基-2-乙基己酯、羟基亚乙基二磺酸、腺苷三磷酸、腺苷磷酸、磷酸单(2-丙烯酰氧基乙基)酸酯、磷酸二(2-丙烯酰氧基乙基)酸酯、乙基二乙基磷乙酸酯、磷酸乙基酸酯、磷酸丁基酸酯、焦磷酸丁基酯、磷酸丁氧基乙基酸酯、磷酸2-乙基己基酸酯、磷酸油基酸酯、磷酸二十四烷基酸酯、磷酸二乙二醇酸酯、磷酸(2-羟乙基)甲基丙烯酸酯等。
至于其它酸,亦可采用苯磺酸、甲苯磺酸、萘磺酸、乙烷磺酸、萘酚磺酸、牛磺酸、间苯酸、磺胺酸、萘胺磺酸、磺基苯甲酸、磺胺酸等磺酸系的酸。
以上列举的稳定剂,可单独使用或可组合二种以上使用。
本发明的光固化性组合物,在不损及其所期待的特性的范围内,根据需要,亦可配合各种颜料,尤其耐热性无机颜料、硅氧系、丙烯酸酯系等的消泡剂、均展剂等的其它添加剂。又可根据需要,亦可添加为防止导电性金属粉的氧化而用的公知惯用抗氧化剂,或使贮存时的热稳定性提高而用的热聚合抑制剂,用作与烧成时的基板间的结合成分的金属氧化物、硅氧化物、硼氧化物等的微粒子。
本发明的光固化性组合物,如前述般可用作导电性糊、玻璃糊、萤光体糊等,此等虽亦可予薄膜化并使用,但也可直接使用糊,利用丝网印刷法,帘幕涂布法、辊涂布法、棒涂法、刮涂法、模涂法等适宜方法,涂布于玻璃板、陶瓷板等各种基板上。涂布后,在热风循环式干燥炉、远红外线干燥炉等例如在约60~120℃使干燥5~40分钟而得无指触现象的涂膜。其后,进行选择性的曝光、显影、烧成并形成指定的导体图案、玻璃质介电体图案、萤光体图案。
至于曝光工序,采用具有指定的曝光图案的负片型掩膜的接触曝光及非接触曝光是可能的,只是从分辨率方面考虑以接触曝光优选。又,曝光环境以在真空中或氮气气氛下优选。至于曝光光源,可使用卤灯、高压汞灯、雷射光、卤化金属灯、黑灯、无电极灯等。至于曝光量,宜为50~1000mJ/cm2。
至于显影工序可使用喷雾法、浸渍法等。至于显影液,以氢氧化钠、氢氧化钾、碳酸钠、碳酸钾、硅酸钠等的金属碱水溶液,或单乙醇胺、二乙醇胺、三乙醇胺等胺水溶液,尤其以约1.5重量%以下的浓度的稀碱水溶液较合适使用,只是组合物中的碱可溶性高分子粘合剂的羧基经予皂化,未固化部(未曝光部)若可予去除即可,并不予限定成上述的显影液者。又显影后为去除不需要的显影液,以进行水洗或酸中和优选。
于烧成工序,在空气中或氮气氛下对显影后的基板进行约380~600℃的加热处理,熔融玻璃成分,固着导体图案、玻璃质介电体图案、萤光体图案等所期待的图案。又此时,至于烧成工序之前阶段,是加热至约300~500℃并在该温度保持指定时间,进入去除有机物的工序优选。
以下显示出实施例及比较例并具体的说明本发明,只是以下的实施例仅是用于说明本发明,并非限定本发明。且以下的「分」及「%」,若未予特别限定时,是完全指重量基准。合成例1
于附有温度计、搅拌机、滴液漏斗及回流冷凝管的烧瓶内,加入作为溶剂的二乙二醇单乙醚乙酸酯,作为催化剂的偶氮双异丁腈,在氮气气氛下加热至80℃,于2小时内滴下以表1所示的摩尔比混合的甲基丙烯酸及甲基丙烯酸酯甲酯的单体,再搅拌1小时后,提高温度至115℃,使失去活性,而得树脂溶液。
冷却此树脂溶液后,采用溴化四丁基铵为催化剂,在95~105℃30小时的条件下,使以表1所示的摩尔比而得的树脂的羧基的等量与丁基缩水甘油基醚进行加成反应,冷却。
再对所得的树脂的OH基,在95~105℃8小时的条件使四氢邻苯二甲酸酐以表1所示的摩尔比进行加成反应,冷却后取出而得固形分50%的树脂溶液A。合成例2
于附有温度计、搅拌机、滴液漏斗及回流冷凝管的烧瓶内,加入溶剂二乙二醇单乙醚乙酸酯,催化剂偶氮双异丁腈,在氮气气氛下加热至80℃,于2小时内滴下以表1所示的摩尔比混合的甲基丙烯酸及甲基丙烯酸甲酯的单体,再搅拌1小时后,提高温度至115℃使失去活性,而得树脂溶液。
冷却此树脂溶液后,采用溴化四丁基铵为催化剂,在95~105℃30小时的条件下,使以表1所示的摩尔比而得的树脂的羧基的等量与2-乙基己基缩水甘油基醚进行加成反应,冷却。
再对所得的树脂的OH基,在95~105℃8小时的条件使四氢邻苯二甲酸酐以表1所示的摩尔比进行加成反应,冷却后取出而得固形分50%的树脂溶液B。合成例3
于附有温度计、搅拌机、滴液漏斗及回流冷凝管的烧瓶内,加入溶剂二乙二醇单乙醚乙酸酯,催化剂偶氮双异丁腈,在氮气气氛下加热至80℃,于2小时内滴加以表1所示的摩尔比混合的甲基丙烯酸及甲基丙烯酸甲酯的单体,再搅拌1小时后,提高温度至115℃使失去活性,而得树脂溶液。
冷却此树脂溶液后,采用溴化四丁基铵为催化剂,在95~105℃30小时的条件下,使以表1所示的摩尔比而得的树脂的羧基的等量与2-乙基己基缩水甘油基醚进行加成反应,冷却。
再对所得的树脂的OH基,在95~105℃8小时的条件使四氢邻苯二甲酸酐以表1所示的摩尔比进行加成反应,冷却后取出而得固形分50%的树脂溶液C。比较合成例1
于附有温度计、搅拌机、滴液漏斗及回流冷凝管的烧瓶内,加入溶剂二乙二醇单乙醚乙酸酯,催化剂偶氮双异丁腈,在氮气气氛下加热至80℃,于2小时内滴下以表2所示的摩尔比混合的甲基丙烯酸及甲基丙烯酸乙酯与甲基丙烯酸2-羧乙基酯的单体,再搅拌1小时后,提高温度至115℃使失去活性,而得固形分50%的树脂溶液D。比较合成例2
于附有温度计、搅拌机、滴液漏斗及回流冷凝管的烧瓶内,加入溶剂二乙二醇单乙醚乙酸酯,催化剂偶氮双异丁腈,在氮气气氛下加热至80℃,于2小时内滴下以表2所示的摩尔比混合的甲基丙烯酸乙酯及甲基丙烯酸2-羟乙酯的单体,再搅拌1小时后,提高温度至115℃使失去活性而得树脂溶液。
冷却此树脂溶液后,采用溴化四丁基铵为催化剂,对所得的树脂的OH基,在95~105℃8小时的条件下,使以表2所示的摩尔比与四氢邻苯二甲酸酐进行加成反应,冷却后取出,而得固形分50%的树脂溶液E。
上述合成例1~3及比较合成例1及2所得的树脂的成分及物性示于表1及表2。
且表中MA表示甲基丙烯酸,MMA表示甲基丙烯酸甲酯、HEMA表示甲基丙烯酸2-羟乙酯、BGE表示丁基缩水甘油基醚、EHGE表示2-乙基己基缩水甘油基醚、T HPA表示四氢邻苯二甲酸酐、EMA表示甲基丙烯酸乙酯。又所得的树脂的重量平均分子量的测定,是利用(株)岛津制作所制造的泵LC-6AD及昭和电工(株)制造的柱Shodex(注册商标)KF-804,KF-603,KF-802三根连结的高效液相色谱予以测定。
表1
成分及物性 | 合成例1(树脂A) | 合成例2(树脂B) | 合成例3(树脂C) |
MA摩尔比 | 0.40 | 0.40 | 0.25 |
MMA摩尔比 | 0.60 | 0.60 | 0.60 |
HEMA摩尔比 | - | - | 0.15 |
BGE摩尔比 | 0.40 | - | 0.25 |
EHGE摩尔比 | - | 0.40 | - |
T HPA摩尔比 | 0.26 | 0.26 | 0.25 |
重量平均分子量Mw | 35,000 | 35,000 | 35,000 |
酸价(mgKOH/g) | 78.1 | 71.2 | 83.9 |
表2
成分及物性 | 比较合成例1(树脂D) | 比较合成例2(树脂E) |
EMA摩尔比 | 0.67 | 0.4 |
MA摩尔比 | 0.15 | - |
HEMA摩尔比 | 0.18 | 0.6 |
T HPA摩尔比 | - | 0.2 |
重量平均分子量Mw | 20,000 | 20,000 |
酸价(mgKOH/g) | 78 | 73 |
采用由前述的合成例及比较合成例而得的各树脂,与其它成分同时以后述的组成比配合,利用搅拌机搅拌后,利用三辊磨予以混练,进行糊化,以制备光固化性糊状组合物。
且,作为玻璃釉,使用具有PbO:60%、B2O3:20%、SiO2:15%、Al2O3:5%的组成,热膨胀系数α300=70×10-7/℃,玻璃化转变温度445℃,平均粒径2.5μm的。黑色颜料,使用平均粒径0.5μm的Cu-Cr-Mn系氧化物。作为导电性金属粉,采用球状且平均粒径1μm的银粉末,以脂肪酸系的表面处理剂处理过的。脂肪酸处理是于水∶异丙醇的1∶1混合液中亚油酸1重量%的溶液内添加搅拌银粉400重量%,馏出溶剂后,在70℃进行3小时加热处理。组合物例1
树脂溶液A 200份
三丙烯酸季戊四醇酯 50份
2-苄基-2-二甲基氨基-1-(4-吗啉基苯 10份
基)-丁烷-1-酮
黑色颜料 150份
玻璃釉 500份组合物例2
树脂溶液A 200份
三丙烯酸三羟甲基丙烷酯 50份
2-苄基-2-二甲基氨基-1-(4-吗啉基苯 15份
基)-丁烷-1-酮
银粉末 150份
黑色颜料 100份
玻璃釉 25份组合物例3
树脂溶液B 200份
三丙烯酸季戊四醇酯 70份
2-苄基-2-二甲基氨基-1-(4-吗啉基苯 10份
基)-丁烷-1-酮
黑色颜料 150份
玻璃釉 500份组合物例4
树脂溶液C 200份
三丙烯酸季戊四醇酯 50份
2-苄基-2-二甲基氨基-1-(4-吗啉基苯 10份
基)-丁烷-1-酮
黑色颜料 150份
玻璃釉 500份比较组合物例1
树脂溶液D 200份
三丙烯酸季戊四醇酯 50份
2-苄基-2-二甲基氨基-1-(4-吗啉基苯 10份
基)-丁烷-1-酮
黑色颜料 150份
玻璃釉 500份比较组合物例2
树脂溶液D 200份
三丙烯酸三羟甲基丙烷酯 50份
2-苄基-2-二甲基氨基-1-(4-吗啉基苯 15份
基)-丁烷-1-酮
银粉末 150份
黑色颜料 100份
玻璃釉 25份比较组合物例3
树脂溶液E 200份
三丙烯酸季戊四醇酯 70份
2-苄基-2-二甲基氨基-1-(4-吗啉基苯 10份
基)-丁烷-1-酮
黑色颜料 150份
玻璃釉 500份
于25℃保存前述组合物例1~4及比较组合物例1~3的各光固化性糊状组合物,评估贮存稳定性(24小时及1周后的粘度稳定性)。
又采用前述组合物例1~4及比较组合物例1~3的各光固化性糊状组合物,于玻璃基板上形成条带状的线,对显影性(显影后,直接目视基板进行观察及由基板背面的透过光的目视观察),对烧成后的线形状予以评估。
条带状的图案的形成是依以下的顺序。首先制备后经过1小时后的组合物或经过1周后的组合物,采用300筛目的聚酯丝网全面的涂布于玻璃基板上。然后采用线宽100μm、空间宽度100μm的条带状图案的负片型薄膜,光源为卤化金属灯,曝光于组合物上的积算光量成为500mJ/cm2。其后,采用液温30℃的Na2CO3水溶液并进行显影、水洗。最后采用电炉在空气中进行烧成。且烧成是由室温至450℃以5℃/分钟的升温速度升温,在450℃保持30分钟,其后以5℃/分钟的升温速度升温至550℃,保持30分钟并予烧成,其后进行放冷至室温的工序。
对所得的基板进行试验的各种特性的评估结果示于表3。
表3
且,表3的评估基准是如下所示。保存稳定性
特性 | 组合物例 | 比较组合物例 | ||||||
1 | 2 | 3 | 4 | 1 | 2 | 3 | ||
贮存稳定性 | 24小时后 | ○ | ○ | ○ | ○ | △ | △ | × |
1周后 | △ | ○ | ○ | △ | × | × | × | |
显影性 | 1-3小时后 | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
1周后 | ○ | ○ | ○ | ○ | △ | △ | × | |
烧成后线形状 | 1-3小时后 | ○ | ○ | ○ | ○ | ○ | ○ | ○ |
1周后 | ○ | ○ | ○ | ○ | △ | △ | -*) | |
备注 | *)显影性×者因未能进行烧成后的评估,以空白表示。 |
○:增粘率未满10%
△:增粘率10%至未满30%
×:增粘率在30%以上显影性
○:线稳定残存,于空间部无糊的残存
△:线的剥离为未满全体的10%或于线间有若干糊的显影残存
×:线的剥离为10%以上或线间有显影残存(由透过光观察为不透明)的状态烧成后的线形状
○:于条带图案的截面形状上无翘曲、剥离的状态
△:于条带图案的截面形状有若干的翘曲,未满10%的剥离的状态
×:于条带图案的截面形状上有翘曲,10%以上的剥离的状态组合物例5
树脂溶液A 200份
三丙烯酸季戊四醇酯 50份
2-苄基-2-二甲基氨基-1-(4-吗啉基苯 10份
基)-丁烷-1-酮
磷酸2-甲基丙烯酰氧基乙基酸酯 5份
黑色颜料 150份
玻璃釉 500份组合物例6
树脂溶液B 200份
三丙烯酸季戊四醇酯 70份
2-苄基-2-二甲基氨基-1-(4-吗啉基苯 10份
基)-丁烷-1-酮
磷酸2-甲基丙烯酰氧基乙基酸酯 5份
黑色颜料 150份
玻璃釉 500份
于25℃保存前述组合物例5及6的各光固化性糊状组合物,与前述同法评估贮存稳定性(1周后及2周后的粘度稳定性)。其结果示于下述表4。
表4
贮存稳定性 | 组合物例 | |
5 | 6 | |
1周后 | ○ | ○ |
2周后 | ○ | ○ |
由表4的结果显而可知,本发明的组合物可通过再添加稳定剂,使贮存稳定性再进一步提升。
发明的功效
如以上说明,本发明的碱显影型光固化性组合物,不仅利用碱性水溶液可显影,粘度稳定性(贮存稳定性)优越,由于凝胶化或流动性的降低使涂布作业性恶化,或由于显影性的降低亦无图案形成性恶劣的问题。
因此,通过采用本发明的光固化性组合物,在无作业环境的恶化等的问题下,通过影印技术可良品率良好、生产性良好、稳定地形成高精细的导体图案,玻璃质介电体图案,萤光体图案等的烧成物图案于大面积的基板上。
Claims (16)
1.一种碱显影型光固化性组合物,含有
(A)使具有乙烯性不饱和键且一分子中有一个羧基的化合物(a)与具有乙烯性不饱和键的不具有羟基及酸性基的化合物(b)形成的共聚物的羧基,或使具有乙烯性不饱和键且一分子中具有一个羧基的化合物(a)与具有乙烯性不饱和键的不具有羟基及酸性基的化合物(b)及具有乙烯性不饱和键及羟基的化合物(c)形成的共聚物的羧基,与一分子中具有一个缩水甘油基的化合物(d)反应,使生成的仲羟基及该共聚物中的伯羟基与多碱基酸酐(e)反应而得的重量平均分子量5,000~100,000,酸价50~150mg/KOH的碱可溶性高分子粘合剂,
(B)无机粉体,
(C)光聚合性单体,
(D)光聚合引发剂,及
(E)有机溶剂。
2.如权利要求第1项的组合物,其中还含有(F)稳定剂。
3.如权利要求第1或2项的组合物,其中前述无机粉体(B)之中5重量%以上是由低熔点玻璃釉组成。
4.如权利要求第3项的组合物,其中前述低熔点玻璃釉以氧化物基准的重量%计,是如下的任一种,
含有PbO:48~82%、B2O3:0.5~22%、SiO2:3~32%、Al2O3:0~12%、BaO:0~10%、ZnO:0~15%、TiO2:0~2.5%、Bi2O3:0~25%,软化点为420~590℃氧化铅为主成分的非结晶釉,
含有Bi2O3:35~88%、B2O3:5~30%、SiO2:0~20%、Al2O3:0~5%、BaO:1~25%、ZnO:1~20%,软化点为420~590℃氧化铋为主成分的非结晶釉,
含有ZnO:25~60%、K2O:2~15%、B2O3:25~45%、SiO2:1~7%、Al2O3:0~10%、BaO:0~20%、MgO:0~10%,软化点为420~590℃氧化锌为主成分的非结晶釉,
含有Li2O:1~13%、Bi2O3:0~30%、B2O3:1~50%、SiO2:1~50%、Al2O3:1~40%、BaO:1~20%、ZnO:1~25%,软化点为420~590℃氧化锂为主成分的非结晶釉。
5.如权利要求第1或2项的组合物,其中前述无机粉体(B)含有由金属粉末、玻璃粉末、黑色颜料及陶瓷微粒子而成的组中选出的至少一种。
6.如权利要求第1或2项的组合物,其中前述无机粉体(B)是由含有以Fe、Co、Cu、Cr、Mn、Al中的一种或二种以上为主成分的金属氧化物而成的黑色颜料,及/或含有Ag、Au、Pd、Ni、Ru、Cu、Al、Pt中的一种以上的导电性金属粉末或黑色导电性微粒子。
7.如权利要求第1或2项的组合物,其中前述无机粉体(B)是含有氧化铝、瑾青石、锆石之中的一种或二种以上的陶瓷。
8.如权利要求第2项的组合物,其中前述稳定剂(F)是由无机酸、有机酸、磷酸化合物(无机磷酸、有机磷酸)而成的组选出的至少一种。
9.如权利要求第3项的组合物,其中前述玻璃釉是具有10μm以下的平均粒径,相对于每100重量份前述碱可溶性高分子粘合剂(A)含有25~1000重量份。
10.如权利要求第6项的组合物,其中前述导电性金属粉是具有10μm以下的平均粒径,相对于每100重量份前述碱可溶性高分子粘合剂(A)含有25~1000重量份。
11.如权利要求第1或2项的组合物,其中前述光聚合性单体(C)相对于每100重量份前述碱可溶性高分子粘合剂(A)含有1~200重量份。
12.如权利要求第1或2项的组合物,其中前述光聚合引发剂(D)相对于每100重量份前述碱可溶性高分子粘合剂(A)含有1~20重量份。
13.如权利要求第2项的组合物,其中前述稳定剂(F)相对于每100重量份前述无机粉体(B)含有5重量份。
14.如权利要求第1或2项的组合物,呈糊状形态。
15.如权利要求第1或2项的组合物,成形成薄膜状。
16.一种烧成物图案,是将于基板上已密合的权利要求第1或2项的碱显影型光固化性组合物的被膜图案化后,烧成而得。
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TW (1) | TW473738B (zh) |
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-
2000
- 2000-07-06 CN CNB008102406A patent/CN1318915C/zh not_active Expired - Lifetime
- 2000-07-06 KR KR1020027000457A patent/KR100671986B1/ko active IP Right Grant
- 2000-07-06 JP JP2001510052A patent/JP3742009B2/ja not_active Expired - Lifetime
- 2000-07-06 WO PCT/JP2000/004495 patent/WO2001004705A1/ja active IP Right Grant
- 2000-07-11 TW TW089113789A patent/TW473738B/zh not_active IP Right Cessation
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- 2002-01-11 US US10/042,201 patent/US6793850B2/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100409371C (zh) * | 2003-08-21 | 2008-08-06 | 太阳油墨制造株式会社 | 感光性导电组合物和等离子显示板 |
CN1661475B (zh) * | 2004-02-26 | 2011-01-26 | 太阳油墨制造株式会社 | 光固化性·热固性树脂组合物和使用该组合物的印刷线路板 |
CN101002142B (zh) * | 2004-08-11 | 2010-12-15 | 日立化成工业株式会社 | 感光性树脂组合物及使用其的感光性薄膜 |
CN1821870B (zh) * | 2005-01-05 | 2011-08-10 | 三星Sdi株式会社 | 光敏胶组合物及使用该组合物制造的等离子体显示板 |
US8093814B2 (en) | 2006-09-15 | 2012-01-10 | Samsung Sdi Co., Ltd. | Electrode-forming composition and plasma display panel manufactured using the same |
CN101183216B (zh) * | 2006-11-15 | 2011-11-02 | 太阳控股株式会社 | 感光性组合物 |
CN101192001B (zh) * | 2006-11-15 | 2012-01-11 | 太阳控股株式会社 | 阻焊膜形成方法和感光性组合物 |
CN101403856B (zh) * | 2007-10-01 | 2011-12-07 | 太阳控股株式会社 | 组合物、干膜、固化物和印刷线路板 |
Also Published As
Publication number | Publication date |
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KR20020060683A (ko) | 2002-07-18 |
CN1318915C (zh) | 2007-05-30 |
US20020096666A1 (en) | 2002-07-25 |
WO2001004705A1 (fr) | 2001-01-18 |
KR100671986B1 (ko) | 2007-01-23 |
TW473738B (en) | 2002-01-21 |
JP3742009B2 (ja) | 2006-02-01 |
US6793850B2 (en) | 2004-09-21 |
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