CN1331842A - 层叠式电子零件及其制造方法以及二维阵列状元件实装结构及其制造方法 - Google Patents
层叠式电子零件及其制造方法以及二维阵列状元件实装结构及其制造方法 Download PDFInfo
- Publication number
- CN1331842A CN1331842A CN99814756A CN99814756A CN1331842A CN 1331842 A CN1331842 A CN 1331842A CN 99814756 A CN99814756 A CN 99814756A CN 99814756 A CN99814756 A CN 99814756A CN 1331842 A CN1331842 A CN 1331842A
- Authority
- CN
- China
- Prior art keywords
- electrode
- electronic component
- aforementioned
- circuit board
- flexible circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims description 34
- 238000004519 manufacturing process Methods 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000006071 cream Substances 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 2
- 238000010276 construction Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract description 54
- 239000000523 sample Substances 0.000 abstract description 24
- 230000002950 deficient Effects 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 17
- 238000010586 diagram Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000013016 damping Methods 0.000 description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000003745 diagnosis Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/064—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface with multiple active layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30872698A JP3876082B2 (ja) | 1998-10-29 | 1998-10-29 | 2次元アレイ型モジュールの製造方法 |
JP308726/1998 | 1998-10-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1331842A true CN1331842A (zh) | 2002-01-16 |
CN1192442C CN1192442C (zh) | 2005-03-09 |
Family
ID=17984554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB998147567A Expired - Fee Related CN1192442C (zh) | 1998-10-29 | 1999-10-22 | 层叠式电子零件及其制造方法以及二维阵列状元件实装结构及其制造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6798059B1 (zh) |
EP (1) | EP1132978B1 (zh) |
JP (1) | JP3876082B2 (zh) |
CN (1) | CN1192442C (zh) |
AU (1) | AU6229199A (zh) |
DE (1) | DE69938431T2 (zh) |
WO (1) | WO2000026971A1 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100403990C (zh) * | 2002-07-19 | 2008-07-23 | 阿洛卡株式会社 | 超声波探头及其制造方法 |
CN101383394B (zh) * | 2008-09-26 | 2010-06-02 | 瑞声声学科技(常州)有限公司 | 新的压电陶瓷传感器及其制作方法 |
CN1781166B (zh) * | 2003-11-28 | 2011-04-13 | 株式会社村田制作所 | 层叠式陶瓷电子元件及其制造方法 |
CN103371850A (zh) * | 2012-04-23 | 2013-10-30 | 三星电子株式会社 | 超声换能器、超声探头和超声波图像诊断设备 |
CN103493234A (zh) * | 2011-02-24 | 2014-01-01 | 陶瓷技术有限责任公司 | 用于以高度动态的方式产生力的具有子模块和控制与保险模块的力模块 |
CN109148156A (zh) * | 2017-06-27 | 2019-01-04 | 三星电机株式会社 | 电子组件及其制造方法 |
CN111050666A (zh) * | 2018-03-15 | 2020-04-21 | 株式会社日立制作所 | 超声波探头及其制造方法 |
CN112954556A (zh) * | 2021-01-28 | 2021-06-11 | 南京槅扇贸易有限公司 | 一种薄型压电扬声器安装设备 |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4519259B2 (ja) * | 2000-04-19 | 2010-08-04 | 株式会社東芝 | 2次元アレイ超音波プローブ及びその製造方法 |
US6640634B2 (en) | 2000-03-31 | 2003-11-04 | Kabushiki Kaisha Toshiba | Ultrasonic probe, method of manufacturing the same and ultrasonic diagnosis apparatus |
JP2003009555A (ja) * | 2001-06-25 | 2003-01-10 | Canon Inc | 積層電気−機械エネルギー変換素子および振動波駆動装置 |
DE60334256D1 (de) * | 2002-01-21 | 2010-11-04 | Nat Inst Of Advanced Ind Scien | Blei-Zirkonate-Titanate-Faser und Verwendung für Aktuatoren und Sensoren |
JP3920223B2 (ja) * | 2003-01-07 | 2007-05-30 | 日本碍子株式会社 | 反応性チップと、このチップを用いた標的物質の結合検出方法 |
JP4617078B2 (ja) * | 2003-12-08 | 2011-01-19 | 北陸電気工業株式会社 | 積層圧電体及び圧電型振動素子 |
JP5167576B2 (ja) * | 2005-04-22 | 2013-03-21 | Tdk株式会社 | 積層型圧電素子 |
DE102004057795B4 (de) | 2004-11-30 | 2006-12-28 | Siemens Ag | Kontaktierung von Vielschicht-Piezoaktoren bzw. -sensoren |
JP2006253349A (ja) * | 2005-03-10 | 2006-09-21 | Shizuki Electric Co Inc | コンデンサ及びその製造方法 |
JP5076312B2 (ja) * | 2005-12-09 | 2012-11-21 | Tdk株式会社 | 積層型圧電素子 |
JP4703416B2 (ja) * | 2006-01-27 | 2011-06-15 | 株式会社東芝 | 超音波トランスデューサ |
DE102006025362A1 (de) * | 2006-05-31 | 2007-12-06 | Siemens Ag | Vollaktiver Piezoaktor und Verfahren zu seiner Herstellung |
JP4253334B2 (ja) * | 2006-07-12 | 2009-04-08 | 株式会社東芝 | 2次元アレイ型超音波プローブ |
KR100843434B1 (ko) * | 2006-09-22 | 2008-07-03 | 삼성전기주식회사 | 적층형 칩 커패시터 |
JP5461769B2 (ja) * | 2007-09-20 | 2014-04-02 | 株式会社東芝 | 超音波トランスデューサ、超音波プローブおよび超音波トランスデューサの製造方法 |
US7855490B2 (en) * | 2007-11-14 | 2010-12-21 | Interplex Nas, Inc. | Planar spring assembly with attached solder strip and method for making same |
DE102007058874A1 (de) * | 2007-12-06 | 2010-05-20 | Siemens Ag | Piezoelektrisches Bauteil mit direkt strukturierter Außenkontaktierung, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils |
DE102007058875A1 (de) * | 2007-12-06 | 2009-06-25 | Siemens Ag | Piezoelektrisches Bauteil mit photostrukturierter Einzelkontaktierung der Innenelektroden, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils |
US8258677B2 (en) * | 2008-07-31 | 2012-09-04 | Siemens Aktiengesellschaft | Piezoelectric component with directly structured external contacting, method for manufacturing the component and use of said component |
JP2012075555A (ja) * | 2010-09-30 | 2012-04-19 | Advantest Corp | 変換器および測定装置 |
DE102012000063B4 (de) | 2012-01-03 | 2018-04-05 | Festo Ag & Co. Kg | Piezoelektrische Baugruppe und Verfahren zu ihrer Herstellung |
JP5746082B2 (ja) * | 2012-03-30 | 2015-07-08 | 富士フイルム株式会社 | 超音波探触子および信号線の接続方法 |
CN104923469A (zh) * | 2015-05-16 | 2015-09-23 | 哈尔滨工业大学 | 基于压电陶瓷剪切片不同摆放方向的二维振动装置 |
US10707404B2 (en) * | 2016-07-07 | 2020-07-07 | Tdk Corporation | Piezoelectric element |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62211974A (ja) * | 1986-03-12 | 1987-09-17 | Hitachi Metals Ltd | 積層型圧電素子およびその製造方法 |
JP2738706B2 (ja) * | 1988-07-15 | 1998-04-08 | 株式会社日立製作所 | 積層型圧電素子の製法 |
JPH0653567A (ja) * | 1992-07-27 | 1994-02-25 | Fujitsu Ltd | 積層型圧電アクチュエータ |
JPH06132578A (ja) * | 1992-10-21 | 1994-05-13 | Nikon Corp | 積層型アクチュエーター |
JPH06224483A (ja) * | 1993-01-25 | 1994-08-12 | Brother Ind Ltd | 積層型圧電素子 |
JPH06283776A (ja) * | 1993-03-26 | 1994-10-07 | Brother Ind Ltd | 積層型圧電素子 |
US5457863A (en) * | 1993-03-22 | 1995-10-17 | General Electric Company | Method of making a two dimensional ultrasonic transducer array |
US5381385A (en) * | 1993-08-04 | 1995-01-10 | Hewlett-Packard Company | Electrical interconnect for multilayer transducer elements of a two-dimensional transducer array |
JPH0758373A (ja) * | 1993-08-18 | 1995-03-03 | Brother Ind Ltd | 積層型圧電素子 |
JP2748830B2 (ja) * | 1993-09-30 | 1998-05-13 | 日本電気株式会社 | 積層型電歪効果素子 |
JPH08172227A (ja) * | 1994-12-19 | 1996-07-02 | Sumitomo Metal Ind Ltd | 積層型圧電アクチュエータ及びその製造方法 |
US5629578A (en) * | 1995-03-20 | 1997-05-13 | Martin Marietta Corp. | Integrated composite acoustic transducer array |
JPH0923030A (ja) * | 1995-07-05 | 1997-01-21 | Oki Electric Ind Co Ltd | 積層型圧電素子の製造方法 |
-
1998
- 1998-10-29 JP JP30872698A patent/JP3876082B2/ja not_active Expired - Fee Related
-
1999
- 1999-10-22 EP EP19990949374 patent/EP1132978B1/en not_active Expired - Lifetime
- 1999-10-22 US US09/830,127 patent/US6798059B1/en not_active Expired - Fee Related
- 1999-10-22 CN CNB998147567A patent/CN1192442C/zh not_active Expired - Fee Related
- 1999-10-22 DE DE1999638431 patent/DE69938431T2/de not_active Expired - Lifetime
- 1999-10-22 AU AU62291/99A patent/AU6229199A/en not_active Abandoned
- 1999-10-22 WO PCT/JP1999/005848 patent/WO2000026971A1/ja active IP Right Grant
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100403990C (zh) * | 2002-07-19 | 2008-07-23 | 阿洛卡株式会社 | 超声波探头及其制造方法 |
CN1781166B (zh) * | 2003-11-28 | 2011-04-13 | 株式会社村田制作所 | 层叠式陶瓷电子元件及其制造方法 |
CN101383394B (zh) * | 2008-09-26 | 2010-06-02 | 瑞声声学科技(常州)有限公司 | 新的压电陶瓷传感器及其制作方法 |
CN103493234A (zh) * | 2011-02-24 | 2014-01-01 | 陶瓷技术有限责任公司 | 用于以高度动态的方式产生力的具有子模块和控制与保险模块的力模块 |
CN103493234B (zh) * | 2011-02-24 | 2016-10-12 | 陶瓷技术有限责任公司 | 用于以高度动态的方式产生力的具有子模块和控制与保险模块的力模块 |
CN103371850A (zh) * | 2012-04-23 | 2013-10-30 | 三星电子株式会社 | 超声换能器、超声探头和超声波图像诊断设备 |
CN103371850B (zh) * | 2012-04-23 | 2015-06-17 | 三星电子株式会社 | 超声换能器、超声探头和超声波图像诊断设备 |
US9408589B2 (en) | 2012-04-23 | 2016-08-09 | Samsung Electronics Co., Ltd. | Ultrasonic transducer, ultrasonic probe, and ultrasound image diagnosis apparatus |
CN109148156A (zh) * | 2017-06-27 | 2019-01-04 | 三星电机株式会社 | 电子组件及其制造方法 |
CN109148156B (zh) * | 2017-06-27 | 2020-09-01 | 三星电机株式会社 | 电子组件及其制造方法 |
CN111050666A (zh) * | 2018-03-15 | 2020-04-21 | 株式会社日立制作所 | 超声波探头及其制造方法 |
CN112954556A (zh) * | 2021-01-28 | 2021-06-11 | 南京槅扇贸易有限公司 | 一种薄型压电扬声器安装设备 |
Also Published As
Publication number | Publication date |
---|---|
EP1132978A1 (en) | 2001-09-12 |
EP1132978B1 (en) | 2008-03-26 |
JP3876082B2 (ja) | 2007-01-31 |
AU6229199A (en) | 2000-05-22 |
DE69938431T2 (de) | 2009-06-18 |
US6798059B1 (en) | 2004-09-28 |
EP1132978A4 (en) | 2006-03-01 |
JP2000138400A (ja) | 2000-05-16 |
DE69938431D1 (de) | 2008-05-08 |
CN1192442C (zh) | 2005-03-09 |
WO2000026971A1 (fr) | 2000-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN1192442C (zh) | 层叠式电子零件及其制造方法以及二维阵列状元件实装结构及其制造方法 | |
US6467138B1 (en) | Integrated connector backings for matrix array transducers, matrix array transducers employing such backings and methods of making the same | |
US6656124B2 (en) | Stack based multidimensional ultrasonic transducer array | |
US5030874A (en) | Ultrasonic probe | |
RU2449418C2 (ru) | Межсоединение по методу перевернутого кристалла через сквозные отверстия в микросхеме | |
CN1289212C (zh) | 具有可变声学阻抗的超声波换能器晶片 | |
US7952260B2 (en) | Ultrasound imaging system | |
KR100722370B1 (ko) | 적층형 초음파 탐촉자 및 이의 제조방법 | |
US7288069B2 (en) | Ultrasonic probe and method of manufacturing the same | |
US20080106976A1 (en) | Redistribution Interconnect for Microbeamforming(S) and a Medical Ultrasound System | |
CN1531467A (zh) | 用于将声学元件装接到集成电路上的系统 | |
JP4519259B2 (ja) | 2次元アレイ超音波プローブ及びその製造方法 | |
US20110025172A1 (en) | Ultrasound Imaging Transducer Acoustic Stack with Integral Electrical Connections | |
JP2004363746A (ja) | 超音波用探触子及びその製造方法 | |
JPS5920240B2 (ja) | 超音波探触子及び該超音波探触子の製造方法 | |
JP2005210245A (ja) | 超音波プローブ | |
JPH07131895A (ja) | 2次元アレイ型超音波プローブおよびその製造方法 | |
JP2940110B2 (ja) | 超音波探触子 | |
JP3507655B2 (ja) | 探触子用バッキング材及びこれを用いた超音波探触子の製造方法並びに超音波探触子 | |
KR20190009163A (ko) | 인터포져와 집적회로칩의 접합 방법, 및 이를 이용한 초음파 프로브 | |
JPH0120615B2 (zh) | ||
JPH0614396A (ja) | 超音波探触子 | |
JP5338389B2 (ja) | 超音波探触子の製造方法、超音波探触子、超音波診断装置 | |
JP5349141B2 (ja) | 超音波プローブ | |
KR20020092980A (ko) | 단방향 음향 프로브 및 그의 제조 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
C10 | Entry into substantive examination | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: CORPORATION HITACHI MEDICAL TREATMENT EQUIPMENT Free format text: FORMER OWNER: HITACHI CO., LTD.; CORPORATION HITACHI MEDICAL TREATMENT EQUIPMENT Effective date: 20071130 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20071130 Address after: Japan Tokyo Chiyoda District 1 chome Kanda a No. 14 Patentee after: Hitachi Medical Corporation Address before: Tokyo, Japan Co-patentee before: Hitachi Medical Corporation Patentee before: Company of Hitachi |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050309 Termination date: 20151022 |
|
EXPY | Termination of patent right or utility model |