DE69938431D1 - Herstellungsverfahren für ein mehrschichtiges piezoelektrisches bauteil sowie für eine zweidimensional angeordnete bauelement-packungsstruktur - Google Patents

Herstellungsverfahren für ein mehrschichtiges piezoelektrisches bauteil sowie für eine zweidimensional angeordnete bauelement-packungsstruktur

Info

Publication number
DE69938431D1
DE69938431D1 DE69938431T DE69938431T DE69938431D1 DE 69938431 D1 DE69938431 D1 DE 69938431D1 DE 69938431 T DE69938431 T DE 69938431T DE 69938431 T DE69938431 T DE 69938431T DE 69938431 D1 DE69938431 D1 DE 69938431D1
Authority
DE
Germany
Prior art keywords
component
twin
manufacturing
dimensionally arranged
multilayer piezoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69938431T
Other languages
English (en)
Other versions
DE69938431T2 (de
Inventor
Shosaku Ishihara
Masato Nakamura
Takashi Kuroki
Shuzou Sano
Mikio Izumi
Takaya Ohosawa
Mitsuhiro Oshiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Healthcare Manufacturing Ltd
Original Assignee
Hitachi Ltd
Hitachi Medical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Medical Corp filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69938431D1 publication Critical patent/DE69938431D1/de
Publication of DE69938431T2 publication Critical patent/DE69938431T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/064—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface with multiple active layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Connection electrodes of multilayer piezoelectric or electrostrictive devices, e.g. external electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Ceramic Capacitors (AREA)
DE1999638431 1998-10-29 1999-10-22 Herstellungsverfahren für ein mehrschichtiges piezoelektrisches bauteil sowie für eine zweidimensional angeordnete bauelement-packungsstruktur Expired - Lifetime DE69938431T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP30872698 1998-10-29
JP30872698A JP3876082B2 (ja) 1998-10-29 1998-10-29 ２次元アレイ型モジュールの製造方法
PCT/JP1999/005848 WO2000026971A1 (fr) 1998-10-29 1999-10-22 Composant electronique multicouche et son procede de fabrication; structure de conditionnement bi-dimensionnelle a jeux d'elements et son procede de fabrication

Publications (2)

Publication Number Publication Date
DE69938431D1 true DE69938431D1 (de) 2008-05-08
DE69938431T2 DE69938431T2 (de) 2009-06-18

Family

ID=17984554

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1999638431 Expired - Lifetime DE69938431T2 (de) 1998-10-29 1999-10-22 Herstellungsverfahren für ein mehrschichtiges piezoelektrisches bauteil sowie für eine zweidimensional angeordnete bauelement-packungsstruktur

Country Status (7)

Country Link
US (1) US6798059B1 (de)
EP (1) EP1132978B1 (de)
JP (1) JP3876082B2 (de)
CN (1) CN1192442C (de)
AU (1) AU6229199A (de)
DE (1) DE69938431T2 (de)
WO (1) WO2000026971A1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6640634B2 (en) 2000-03-31 2003-11-04 Kabushiki Kaisha Toshiba Ultrasonic probe, method of manufacturing the same and ultrasonic diagnosis apparatus
JP4519259B2 (ja) * 2000-04-19 2010-08-04 株式会社東芝 ２次元アレイ超音波プローブ及びその製造方法
JP2003009555A (ja) * 2001-06-25 2003-01-10 Canon Inc 積層電気−機械エネルギー変換素子および振動波駆動装置
DE60334256D1 (de) 2002-01-21 2010-11-04 Nat Inst Of Advanced Ind Scien Blei-Zirkonate-Titanate-Faser und Verwendung für Aktuatoren und Sensoren
EP1382301B1 (de) * 2002-07-19 2010-11-17 Aloka Co. Ltd. Ultraschallsonde und Herstellungsverfahren hiervon
JP3920223B2 (ja) * 2003-01-07 2007-05-30 日本碍子株式会社 反応性チップと、このチップを用いた標的物質の結合検出方法
TWI264969B (en) * 2003-11-28 2006-10-21 Murata Manufacturing Co Multilayer ceramic electronic component and its manufacturing method
JP4617078B2 (ja) * 2003-12-08 2011-01-19 北陸電気工業株式会社 積層圧電体及び圧電型振動素子
JP5167576B2 (ja) * 2005-04-22 2013-03-21 Ｔｄｋ株式会社 積層型圧電素子
DE102004057795B4 (de) 2004-11-30 2006-12-28 Siemens Ag Kontaktierung von Vielschicht-Piezoaktoren bzw. -sensoren
JP2006253349A (ja) * 2005-03-10 2006-09-21 Shizuki Electric Co Inc コンデンサ及びその製造方法
JP5076312B2 (ja) * 2005-12-09 2012-11-21 Ｔｄｋ株式会社 積層型圧電素子
JP4703416B2 (ja) * 2006-01-27 2011-06-15 株式会社東芝 超音波トランスデューサ
DE102006025362A1 (de) * 2006-05-31 2007-12-06 Siemens Ag Vollaktiver Piezoaktor und Verfahren zu seiner Herstellung
JP4253334B2 (ja) * 2006-07-12 2009-04-08 株式会社東芝 ２次元アレイ型超音波プローブ
KR100843434B1 (ko) * 2006-09-22 2008-07-03 삼성전기주식회사 적층형 칩 커패시터
JP5461769B2 (ja) * 2007-09-20 2014-04-02 株式会社東芝 超音波トランスデューサ、超音波プローブおよび超音波トランスデューサの製造方法
DE112008003054T5 (de) * 2007-11-14 2010-10-14 Interplex Nas, Inc. Ebene Federanordnung mit angebrachtem Lotstreifen
DE102007058875A1 (de) * 2007-12-06 2009-06-25 Siemens Ag Piezoelektrisches Bauteil mit photostrukturierter Einzelkontaktierung der Innenelektroden, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils
DE102007058874A1 (de) * 2007-12-06 2010-05-20 Siemens Ag Piezoelektrisches Bauteil mit direkt strukturierter Außenkontaktierung, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils
US8258677B2 (en) 2008-07-31 2012-09-04 Siemens Aktiengesellschaft Piezoelectric component with directly structured external contacting, method for manufacturing the component and use of said component
CN101383394B (zh) * 2008-09-26 2010-06-02 瑞声声学科技(常州)有限公司 新的压电陶瓷传感器及其制作方法
JP2012075555A (ja) 2010-09-30 2012-04-19 Advantest Corp 変換器および測定装置
ES2560011T3 (es) * 2011-02-24 2016-02-17 Ceramtec Gmbh Módulo de fuerza con submódulos y un módulo de control y seguridad para la generación de fuerza altamente dinámica
DE102012000063B4 (de) 2012-01-03 2018-04-05 Festo Ag & Co. Kg Piezoelektrische Baugruppe und Verfahren zu ihrer Herstellung
JP5746082B2 (ja) * 2012-03-30 2015-07-08 富士フイルム株式会社 超音波探触子および信号線の接続方法
KR101336246B1 (ko) * 2012-04-23 2013-12-03 삼성전자주식회사 초음파 트랜스듀서, 초음파 프로브, 및 초음파 진단장치
CN104923469A (zh) * 2015-05-16 2015-09-23 哈尔滨工业大学 基于压电陶瓷剪切片不同摆放方向的二维振动装置
US10707404B2 (en) * 2016-07-07 2020-07-07 Tdk Corporation Piezoelectric element
KR20190001276A (ko) * 2017-06-27 2019-01-04 삼성전기주식회사 전자 부품 및 그 제조 방법
JP6876645B2 (ja) * 2018-03-15 2021-05-26 株式会社日立製作所 超音波プローブ及びその製造方法
CN112954556A (zh) * 2021-01-28 2021-06-11 南京槅扇贸易有限公司 一种薄型压电扬声器安装设备

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211974A (ja) * 1986-03-12 1987-09-17 Hitachi Metals Ltd 積層型圧電素子およびその製造方法
JP2738706B2 (ja) * 1988-07-15 1998-04-08 株式会社日立製作所 積層型圧電素子の製法
JPH0653567A (ja) * 1992-07-27 1994-02-25 Fujitsu Ltd 積層型圧電アクチュエータ
JPH06132578A (ja) * 1992-10-21 1994-05-13 Nikon Corp 積層型アクチュエーター
JPH06224483A (ja) * 1993-01-25 1994-08-12 Brother Ind Ltd 積層型圧電素子
JPH06283776A (ja) * 1993-03-26 1994-10-07 Brother Ind Ltd 積層型圧電素子
US5457863A (en) * 1993-03-22 1995-10-17 General Electric Company Method of making a two dimensional ultrasonic transducer array
US5381385A (en) * 1993-08-04 1995-01-10 Hewlett-Packard Company Electrical interconnect for multilayer transducer elements of a two-dimensional transducer array
JPH0758373A (ja) * 1993-08-18 1995-03-03 Brother Ind Ltd 積層型圧電素子
JP2748830B2 (ja) * 1993-09-30 1998-05-13 日本電気株式会社 積層型電歪効果素子
JPH08172227A (ja) * 1994-12-19 1996-07-02 Sumitomo Metal Ind Ltd 積層型圧電アクチュエータ及びその製造方法
US5629578A (en) * 1995-03-20 1997-05-13 Martin Marietta Corp. Integrated composite acoustic transducer array
JPH0923030A (ja) * 1995-07-05 1997-01-21 Oki Electric Ind Co Ltd 積層型圧電素子の製造方法

Also Published As

Publication number Publication date
US6798059B1 (en) 2004-09-28
JP3876082B2 (ja) 2007-01-31
WO2000026971A1 (fr) 2000-05-11
DE69938431T2 (de) 2009-06-18
AU6229199A (en) 2000-05-22
EP1132978A1 (de) 2001-09-12
CN1192442C (zh) 2005-03-09
CN1331842A (zh) 2002-01-16
JP2000138400A (ja) 2000-05-16
EP1132978B1 (de) 2008-03-26
EP1132978A4 (de) 2006-03-01

Similar Documents

Publication Publication Date Title
DE69938431D1 (de) Herstellungsverfahren für ein mehrschichtiges piezoelektrisches bauteil sowie für eine zweidimensional angeordnete bauelement-packungsstruktur
DK1011527T3 (da) Rörformet flerlagskompositstruktur og fremstillingsfremgangsmåde
DE69939895D1 (de) Herstellungsverfahren für ein halbleiterbauelement
DE69833222D1 (de) Mehrlagige deckschicht und herstellungsverfahren
DE69830391D1 (de) Schraubenförmige endoprothese sowie herstellungsverfahren
DE69516045D1 (de) Keramischer Mehrschichtkondensator und Herstellungsverfahren
DE60001033T2 (de) Verfahren zur Herstellung einer Sandwichverbundplatte und dadurch hergestellte Platte
DE60128411D1 (de) Mehrschichtelektrodenstruktur und Verfahren für ihre Herstellung
DE59807086D1 (de) Cholesterische effektschichten und verfahren zu deren herstellung
DE69808460T2 (de) Verpackung mit einer zwischenlage für in zwei lagen angeordnete dosen sowie verfahren zu ihrer herstellung
DE69835659D1 (de) Mehrschichtiges keramisches Substrat mit einem passiven Bauelement, sowie Herstellungsverfahren
DE69830605D1 (de) Intravaskularer stent sowie herstellungsverfahren dafür
FI982127A (fi) Menetelmä monikerroksisen suodatinmateriaalin valmistamiseksi ja monik erroksinen suodatinmateriaali
DE69835934D1 (de) Mehrlagiges keramisches Elektronikbauteil und dessen Herstellungsverfahren
DE69613882D1 (de) Herstellungsverfahren eines piezoelektrischen Schichtenelementes
DE69623577D1 (de) Mehrschichtstruktur und Sensor sowie Herstellungsverfahren
DE69931336D1 (de) Abdeckung für Tastschalter und deren Herstellungsmethode
DE69809082D1 (de) AMPULLE FüR UNTERDRUCKSPRITZE SOWIE HERSTELLUNGSVERFAHREN DAFÜR
FI960784A0 (fi) Polyuretaania oleva kerrosrakenne-elementti ja menetelmä sen valmistamiseksi
DE60326822D1 (de) Mehrschichtiges piezoelektrisches element und herstellungsverfahren dafür
DE69738705D1 (de) Herstellungsverfahren für eine Kontaktstruktur
DE60238570D1 (de) Piezoelektrischer Oszillator und Verfahren zu dessen Herstellung
DE59801304D1 (de) Bewegbare Baukomponente für eine thermomechanisch belastete Bauanordnung sowie ein Verfahren zur Herstellung der Baukomponente
GB0130336D0 (en) A method of manufacturing honeycomb structures and tooling for such manufacture
DE69833495D1 (de) Herstellungsvefahren für eine mehrschichtige leiterplatte

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HITACHI MEDICAL CORP., TOKIO/TOKYO, JP

8328 Change in the person/name/address of the agent

Representative=s name: STREHL, SCHUEBEL-HOPF & PARTNER, 80538 MUENCHEN