DE69833495D1 - Herstellungsvefahren für eine mehrschichtige leiterplatte - Google Patents

Herstellungsvefahren für eine mehrschichtige leiterplatte

Info

Publication number
DE69833495D1
DE69833495D1 DE69833495T DE69833495T DE69833495D1 DE 69833495 D1 DE69833495 D1 DE 69833495D1 DE 69833495 T DE69833495 T DE 69833495T DE 69833495 T DE69833495 T DE 69833495T DE 69833495 D1 DE69833495 D1 DE 69833495D1
Authority
DE
Germany
Prior art keywords
manufacturing
multilayered pcb
multilayered
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69833495T
Other languages
English (en)
Other versions
DE69833495T2 (de
Inventor
Leif Bergstedt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of DE69833495D1 publication Critical patent/DE69833495D1/de
Application granted granted Critical
Publication of DE69833495T2 publication Critical patent/DE69833495T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/061—Lamination of previously made multilayered subassemblies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
DE69833495T 1997-09-17 1998-09-15 Herstellungsvefahren für eine mehrschichtige leiterplatte Expired - Lifetime DE69833495T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SE9703344A SE510487C2 (sv) 1997-09-17 1997-09-17 Flerlagerskretskort
SE9703344 1997-09-17
PCT/SE1998/001633 WO1999014994A1 (en) 1997-09-17 1998-09-15 Multi-layer circuit board

Publications (2)

Publication Number Publication Date
DE69833495D1 true DE69833495D1 (de) 2006-04-20
DE69833495T2 DE69833495T2 (de) 2006-09-28

Family

ID=20408269

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69833495T Expired - Lifetime DE69833495T2 (de) 1997-09-17 1998-09-15 Herstellungsvefahren für eine mehrschichtige leiterplatte

Country Status (6)

Country Link
US (2) US6249962B1 (de)
EP (1) EP1025749B1 (de)
AU (1) AU9194498A (de)
DE (1) DE69833495T2 (de)
SE (1) SE510487C2 (de)
WO (1) WO1999014994A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345549A (ja) * 2000-06-01 2001-12-14 Fujitsu Ltd 実装用基板の製造方法及び部品実装方法並びに実装用基板製造装置
US7506438B1 (en) * 2000-11-14 2009-03-24 Freescale Semiconductor, Inc. Low profile integrated module interconnects and method of fabrication
AT412681B (de) * 2002-04-22 2005-05-25 Hueck Folien Gmbh Substrate mit unsichtbaren elektrisch leitfähigen schichten
US6987307B2 (en) * 2002-06-26 2006-01-17 Georgia Tech Research Corporation Stand-alone organic-based passive devices
US7260890B2 (en) * 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
US6900708B2 (en) * 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
US7489914B2 (en) * 2003-03-28 2009-02-10 Georgia Tech Research Corporation Multi-band RF transceiver with passive reuse in organic substrates
US8345433B2 (en) * 2004-07-08 2013-01-01 Avx Corporation Heterogeneous organic laminate stack ups for high frequency applications
US7439840B2 (en) 2006-06-27 2008-10-21 Jacket Micro Devices, Inc. Methods and apparatuses for high-performing multi-layer inductors
US7808434B2 (en) * 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7989895B2 (en) 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4180608A (en) * 1977-01-07 1979-12-25 Del Joseph A Process for making multi-layer printed circuit boards, and the article resulting therefrom
JPH074822B2 (ja) 1986-08-15 1995-01-25 松下電工株式会社 多層プリント配線板の製法
JP2517726B2 (ja) 1987-07-22 1996-07-24 ソニー株式会社 多層配線基板の製造方法
US4806188A (en) * 1988-03-04 1989-02-21 E. I. Du Pont De Nemours And Company Method for fabricating multilayer circuits
JPH02237197A (ja) * 1989-03-10 1990-09-19 Hitachi Ltd 多層回路基板及びその製造方法並びにその用途
JPH0632670A (ja) 1992-07-16 1994-02-08 Nippon Cement Co Ltd セラミックスと金属の接合用ロウ材及びその接合方法
US5384690A (en) * 1993-07-27 1995-01-24 International Business Machines Corporation Flex laminate package for a parallel processor
JPH07249869A (ja) 1994-03-08 1995-09-26 Sumitomo Metal Mining Co Ltd ガラスセラミックス多層回路板及びその製造方法
US5434751A (en) * 1994-04-11 1995-07-18 Martin Marietta Corporation Reworkable high density interconnect structure incorporating a release layer
US5449427A (en) * 1994-05-23 1995-09-12 General Electric Company Processing low dielectric constant materials for high speed electronics
US5719354A (en) * 1994-09-16 1998-02-17 Hoechst Celanese Corp. Monolithic LCP polymer microelectronic wiring modules
EP0768334B1 (de) * 1995-10-16 2004-02-18 Sumitomo Chemical Company Limited Prepreg, Verfahren zur Herstellung und gedrucktes Leiterplattensubstrat und dessen Verwendung
US5993945A (en) * 1996-05-30 1999-11-30 International Business Machines Corporation Process for high resolution photoimageable dielectric
US5679444A (en) * 1996-07-15 1997-10-21 International Business Machines Corporation Method for producing multi-layer circuit board and resulting article of manufacture

Also Published As

Publication number Publication date
EP1025749A1 (de) 2000-08-09
SE510487C2 (sv) 1999-05-31
AU9194498A (en) 1999-04-05
WO1999014994A1 (en) 1999-03-25
SE9703344L (sv) 1999-03-18
US6717063B2 (en) 2004-04-06
EP1025749B1 (de) 2006-02-15
SE9703344D0 (sv) 1997-09-17
US6249962B1 (en) 2001-06-26
DE69833495T2 (de) 2006-09-28
US20010016980A1 (en) 2001-08-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition