DE60326822D1 - Mehrschichtiges piezoelektrisches element und herstellungsverfahren dafür - Google Patents
Mehrschichtiges piezoelektrisches element und herstellungsverfahren dafürInfo
- Publication number
- DE60326822D1 DE60326822D1 DE60326822T DE60326822T DE60326822D1 DE 60326822 D1 DE60326822 D1 DE 60326822D1 DE 60326822 T DE60326822 T DE 60326822T DE 60326822 T DE60326822 T DE 60326822T DE 60326822 D1 DE60326822 D1 DE 60326822D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- piezoelectric element
- method therefor
- multilayer piezoelectric
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/501—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane parallel to the stacking direction, e.g. polygonal or trapezoidal in side view
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8548—Lead-based oxides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Compositions Of Oxide Ceramics (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002033165 | 2002-02-08 | ||
JP2002328503 | 2002-11-12 | ||
PCT/JP2003/001162 WO2003067673A1 (fr) | 2002-02-08 | 2003-02-05 | Element piezoelectrique multicouche et son procede de fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60326822D1 true DE60326822D1 (de) | 2009-05-07 |
Family
ID=27736471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60326822T Expired - Lifetime DE60326822D1 (de) | 2002-02-08 | 2003-02-05 | Mehrschichtiges piezoelektrisches element und herstellungsverfahren dafür |
Country Status (5)
Country | Link |
---|---|
US (2) | US6888292B2 (de) |
EP (1) | EP1473783B1 (de) |
JP (1) | JP4197494B2 (de) |
DE (1) | DE60326822D1 (de) |
WO (1) | WO2003067673A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4831051B2 (ja) * | 2002-03-18 | 2011-12-07 | セイコーエプソン株式会社 | 画像記録装置、圧電アクチュエータ、及び、液体噴射ヘッド |
JP4702316B2 (ja) * | 2002-03-18 | 2011-06-15 | セイコーエプソン株式会社 | 圧電アクチュエータユニット、圧電素子、及び、その製造方法 |
JP3999156B2 (ja) | 2003-03-31 | 2007-10-31 | 日本碍子株式会社 | 圧電/電歪膜型素子及び圧電/電歪磁器組成物 |
JP4777605B2 (ja) | 2003-05-21 | 2011-09-21 | 日本碍子株式会社 | 多層型圧電/電歪素子 |
US7375911B1 (en) * | 2003-11-25 | 2008-05-20 | Maxtor Corporation | Piezoelectric actuator and sensor for disk drive dual-stage servo systems |
JP2005170693A (ja) * | 2003-12-08 | 2005-06-30 | Ngk Insulators Ltd | 圧電/電歪磁器組成物、圧電/電歪体、及び圧電/電歪膜型素子 |
JP4782412B2 (ja) * | 2004-12-24 | 2011-09-28 | 日本碍子株式会社 | 圧電/電歪体、圧電/電歪積層体、及び圧電/電歪膜型アクチュエータ |
JP4782413B2 (ja) * | 2004-12-24 | 2011-09-28 | 日本碍子株式会社 | 圧電/電歪体、圧電/電歪積層体、及び圧電/電歪膜型アクチュエータ |
JP2006202990A (ja) * | 2005-01-20 | 2006-08-03 | Ngk Insulators Ltd | 圧電素子 |
DE102005008514B4 (de) * | 2005-02-24 | 2019-05-16 | Tdk Corporation | Mikrofonmembran und Mikrofon mit der Mikrofonmembran |
JP2007001838A (ja) * | 2005-06-27 | 2007-01-11 | Ngk Insulators Ltd | 圧電/電歪磁器組成物、圧電/電歪体、及び圧電/電歪膜型素子 |
JP2007123585A (ja) * | 2005-10-28 | 2007-05-17 | Kyocera Corp | 圧電アクチュエータおよびその製造方法、並びにインクジェットヘッド |
JP2010538476A (ja) | 2007-08-31 | 2010-12-09 | アプライド マテリアルズ インコーポレイテッド | 光電池製造ライン |
US7911113B1 (en) * | 2009-09-02 | 2011-03-22 | Ngk Insulators, Ltd. | Piezoelectric/electrostrictive element and method of manufacturing piezoelectric/electrostrictive element |
DE102010005906A1 (de) * | 2010-01-27 | 2011-07-28 | Epcos Ag, 81669 | Piezoelektrisches Bauelement |
US8324783B1 (en) | 2012-04-24 | 2012-12-04 | UltraSolar Technology, Inc. | Non-decaying electric power generation from pyroelectric materials |
CN106575698B (zh) * | 2014-08-18 | 2020-05-01 | 株式会社村田制作所 | 压电传感器以及弯曲检测传感器 |
CN105718116A (zh) * | 2016-02-01 | 2016-06-29 | 京东方科技集团股份有限公司 | 一种触控面板及其制备方法、触控显示屏 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4220029Y1 (de) | 1965-03-15 | 1967-11-21 | ||
US3481874A (en) * | 1965-10-19 | 1969-12-02 | Nippon Electric Co | Piezoelectric ceramic composition |
JPS4417103Y1 (de) | 1966-02-02 | 1969-07-23 | ||
JPS503519A (de) | 1973-05-14 | 1975-01-14 | ||
JPS60102779A (ja) * | 1983-11-09 | 1985-06-06 | Hitachi Metals Ltd | 圧電磁器組成物 |
JP3024763B2 (ja) | 1988-07-26 | 2000-03-21 | 日立金属株式会社 | 積層型変位素子 |
JPH07315926A (ja) * | 1994-05-23 | 1995-12-05 | Ngk Spark Plug Co Ltd | 耐湿性に優れたセラミックフィルタ素子用圧電磁器組成物 |
JP3487068B2 (ja) | 1995-04-03 | 2004-01-13 | セイコーエプソン株式会社 | 圧電体薄膜およびその製造法ならびにそれを用いたインクジェット記録ヘッド |
EP0736915A1 (de) | 1995-04-03 | 1996-10-09 | Seiko Epson Corporation | Piezoelektrische Dünnschicht, Verfahren zum Herstellen und Tintenstrahldruckkopf mit Verwendung dieser Dünnschicht |
JP3320596B2 (ja) * | 1995-09-27 | 2002-09-03 | 日本碍子株式会社 | 圧電/電歪膜型素子及びその製造方法 |
JP3209082B2 (ja) | 1996-03-06 | 2001-09-17 | セイコーエプソン株式会社 | 圧電体薄膜素子及びその製造方法、並びにこれを用いたインクジェット式記録ヘッド |
JP3260116B2 (ja) | 1997-05-12 | 2002-02-25 | 松下電器産業株式会社 | 圧電材料およびその製造方法およびそれを用いた圧電振動子および圧電発音体 |
JPH11191645A (ja) * | 1997-12-25 | 1999-07-13 | Kyocera Corp | 圧電/電歪膜型アクチュエータ |
JP2000357826A (ja) | 1999-04-13 | 2000-12-26 | Seiko Epson Corp | 圧電体素子の製造方法、圧電体素子、インクジェット式記録ヘッドおよびプリンタ |
EP1089353B1 (de) * | 1999-10-01 | 2006-11-08 | Ngk Insulators, Ltd. | Piezoelektrisches/elektrostriktives Bauelement |
JP4100847B2 (ja) | 1999-12-28 | 2008-06-11 | Tdk株式会社 | 圧電セラミック組成物 |
JP2001358377A (ja) * | 2000-02-10 | 2001-12-26 | Toshiba Corp | 超磁歪材料とその製造方法、およびそれを用いた磁歪アクチュエータと磁歪センサ |
JP3512379B2 (ja) | 2000-09-20 | 2004-03-29 | 日本碍子株式会社 | 圧電体素子、及びその製造方法 |
US6731049B2 (en) | 2000-09-20 | 2004-05-04 | Ngk Insulators, Ltd. | Piezoelectric element and process for production thereof |
JP3953806B2 (ja) | 2001-12-20 | 2007-08-08 | 日本碍子株式会社 | 圧電素子、及びその製造方法 |
JP3868285B2 (ja) * | 2001-12-20 | 2007-01-17 | 日本碍子株式会社 | 圧電素子、及びその製造方法 |
US6610427B2 (en) | 2000-09-20 | 2003-08-26 | Ngk Insulators, Ltd. | Piezoelectric element and process for production thereof |
JP4091260B2 (ja) | 2001-02-28 | 2008-05-28 | 太陽誘電株式会社 | 圧電素子,それを利用した圧電駆動体及び電子機器 |
JP4777605B2 (ja) | 2003-05-21 | 2011-09-21 | 日本碍子株式会社 | 多層型圧電/電歪素子 |
-
2003
- 2003-02-05 DE DE60326822T patent/DE60326822D1/de not_active Expired - Lifetime
- 2003-02-05 EP EP03705050A patent/EP1473783B1/de not_active Expired - Lifetime
- 2003-02-05 WO PCT/JP2003/001162 patent/WO2003067673A1/ja active Application Filing
- 2003-02-05 US US10/359,039 patent/US6888292B2/en not_active Expired - Fee Related
- 2003-02-05 JP JP2003566912A patent/JP4197494B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-12 US US11/033,785 patent/US7484278B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6888292B2 (en) | 2005-05-03 |
US20040051422A1 (en) | 2004-03-18 |
JP4197494B2 (ja) | 2008-12-17 |
US20050120529A1 (en) | 2005-06-09 |
EP1473783A4 (de) | 2008-05-28 |
JPWO2003067673A1 (ja) | 2005-06-02 |
EP1473783A1 (de) | 2004-11-03 |
WO2003067673A1 (fr) | 2003-08-14 |
US7484278B2 (en) | 2009-02-03 |
EP1473783B1 (de) | 2009-03-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |