CN1328934C - Ic装配印制线路板及其焊接方法和具备它的空气调节器 - Google Patents

Ic装配印制线路板及其焊接方法和具备它的空气调节器 Download PDF

Info

Publication number
CN1328934C
CN1328934C CNB2004101007023A CN200410100702A CN1328934C CN 1328934 C CN1328934 C CN 1328934C CN B2004101007023 A CNB2004101007023 A CN B2004101007023A CN 200410100702 A CN200410100702 A CN 200410100702A CN 1328934 C CN1328934 C CN 1328934C
Authority
CN
China
Prior art keywords
land group
pin flat
direction pin
soldering land
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004101007023A
Other languages
English (en)
Chinese (zh)
Other versions
CN1627882A (zh
Inventor
三浦刚
福岛宽信
森秀树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN1627882A publication Critical patent/CN1627882A/zh
Application granted granted Critical
Publication of CN1328934C publication Critical patent/CN1328934C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CNB2004101007023A 2003-12-11 2004-12-10 Ic装配印制线路板及其焊接方法和具备它的空气调节器 Expired - Fee Related CN1328934C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003412757A JP3988720B2 (ja) 2003-12-11 2003-12-11 ４方向リードフラットパッケージｉｃ実装プリント配線基板及び４方向リードフラットパッケージｉｃの半田付け方法、４方向リードフラットパッケージｉｃ実装プリント配線基板を備えた空気調和機。
JP2003412757 2003-12-11

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNB200610128097XA Division CN100553402C (zh) 2003-12-11 2004-12-10 4方向引脚扁平封装ic装配印制线路板

Publications (2)

Publication Number Publication Date
CN1627882A CN1627882A (zh) 2005-06-15
CN1328934C true CN1328934C (zh) 2007-07-25

Family

ID=34510535

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB2004101007023A Expired - Fee Related CN1328934C (zh) 2003-12-11 2004-12-10 Ic装配印制线路板及其焊接方法和具备它的空气调节器
CNB200610128097XA Expired - Fee Related CN100553402C (zh) 2003-12-11 2004-12-10 4方向引脚扁平封装ic装配印制线路板

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB200610128097XA Expired - Fee Related CN100553402C (zh) 2003-12-11 2004-12-10 4方向引脚扁平封装ic装配印制线路板

Country Status (5)

Country Link
EP (1) EP1542517B1 (https=)
JP (1) JP3988720B2 (https=)
CN (2) CN1328934C (https=)
AU (1) AU2004237811B2 (https=)
ES (1) ES2289446T3 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102208382A (zh) * 2010-03-29 2011-10-05 广达电脑股份有限公司 具有侧边接脚的集成电路封装元件

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4222260B2 (ja) * 2004-06-03 2009-02-12 三菱電機株式会社 リード形電子部品実装プリント配線基板及び空気調和機
JP4207934B2 (ja) 2005-08-09 2009-01-14 三菱電機株式会社 ４方向リードフラットパッケージｉｃ実装プリント配線基板、４方向リードフラットパッケージｉｃの半田付方法、空気調和機。
JP4196979B2 (ja) * 2005-09-07 2008-12-17 三菱電機株式会社 リード形電子部品実装プリント配線基板、リード形電子部品の半田付方法、空気調和機。
JP5599151B2 (ja) * 2009-01-30 2014-10-01 三菱電機株式会社 二列リード形電子部品実装プリント配線基板、二列リード形電子部品の半田付け方法、空気調和機
JP2009283983A (ja) * 2009-08-31 2009-12-03 Mitsubishi Electric Corp プリント配線基板、空気調和機、プリント配線基板の半田付け方法
JP5496118B2 (ja) 2011-01-14 2014-05-21 三菱電機株式会社 プリント配線基板、４方向リードフラットパッケージｉｃの半田付方法および空気調和機
JP6421554B2 (ja) * 2014-11-18 2018-11-14 株式会社ノーリツ プリント基板
KR102493152B1 (ko) * 2016-01-29 2023-01-27 엘지전자 주식회사 더미랜드 및 이를 포함하는 인쇄회로기판
CN106255318A (zh) * 2016-08-25 2016-12-21 广东欧珀移动通信有限公司 印刷电路板及其波峰焊焊接方法
CN119549824B (zh) * 2025-01-27 2025-04-04 四川英特丽电子科技有限公司 一种防溅射smt焊接设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08242067A (ja) * 1995-03-01 1996-09-17 Diamond Electric Mfg Co Ltd フラットパッケージｉｃ用プリント配線基板のパターン形状
JP2635323B2 (ja) * 1987-03-03 1997-07-30 松下電器産業株式会社 プリント配線基板及び４方向リードフラットパッケージｉｃの半田付方法
JPH11251725A (ja) * 1998-03-04 1999-09-17 Mitsuba Corp プリント配線基板およびそれを使用した半田付け方法
JP2001352159A (ja) * 2000-06-09 2001-12-21 Canon Inc プリント配線基板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3211408A1 (de) * 1982-03-27 1983-09-29 Vdo Adolf Schindling Ag, 6000 Frankfurt Substrat
DE4309846A1 (de) * 1993-03-26 1994-09-29 Siemens Ag Führungskörper
JPH11251727A (ja) * 1998-02-27 1999-09-17 Fuji Photo Film Co Ltd グリッドアレイ型半導体パッケージの実装方法
JP3633505B2 (ja) * 2001-04-27 2005-03-30 松下電器産業株式会社 プリント配線基板およびプリント配線基板の半田付け方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2635323B2 (ja) * 1987-03-03 1997-07-30 松下電器産業株式会社 プリント配線基板及び４方向リードフラットパッケージｉｃの半田付方法
JPH08242067A (ja) * 1995-03-01 1996-09-17 Diamond Electric Mfg Co Ltd フラットパッケージｉｃ用プリント配線基板のパターン形状
JPH11251725A (ja) * 1998-03-04 1999-09-17 Mitsuba Corp プリント配線基板およびそれを使用した半田付け方法
JP2001352159A (ja) * 2000-06-09 2001-12-21 Canon Inc プリント配線基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102208382A (zh) * 2010-03-29 2011-10-05 广达电脑股份有限公司 具有侧边接脚的集成电路封装元件
CN102208382B (zh) * 2010-03-29 2013-05-22 广达电脑股份有限公司 具有侧边接脚的集成电路封装元件

Also Published As

Publication number Publication date
CN1627882A (zh) 2005-06-15
EP1542517B1 (en) 2007-07-18
JP2005175186A (ja) 2005-06-30
AU2004237811A1 (en) 2005-06-30
JP3988720B2 (ja) 2007-10-10
CN100553402C (zh) 2009-10-21
AU2004237811B2 (en) 2006-01-19
ES2289446T3 (es) 2008-02-01
EP1542517A1 (en) 2005-06-15
CN1921733A (zh) 2007-02-28

Similar Documents

Publication Publication Date Title
CN1328934C (zh) Ic装配印制线路板及其焊接方法和具备它的空气调节器
US6998861B2 (en) Wiring board and soldering method therefor
CN100493295C (zh) 扁平封装ic装配印制线路板及其焊接方法、空气调节器
CN102595784B (zh) 印刷布线基板、四边引线扁平封装ic的焊接方法以及空气调节器
EP2219427B1 (en) Dual inline lead-type electronic-part-mounted printed circuit board, method of soldering dual inline lead-type electronic part, and air-conditioner
CN1929717B (zh) 导线型电子器件安装印刷电路基板、导线型电子器件的软钎焊方法、空气调节器
CN100475002C (zh) 印刷布线基板及锡焊方法以及装配有印刷布线基板的空调器
JP4041991B2 (ja) プリント配線基板
JP2020017588A (ja) 金属部品の結合構造
JP2013030686A (ja) プリント基板
JPH033260A (ja) Ｉｃパッケージのリード端子
JP5885162B2 (ja) プリント配線基板
JPS6039158Y2 (ja) はんだノズル

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070725