CN1322794C - 用于导电凸点的热固性导电膏 - Google Patents

用于导电凸点的热固性导电膏 Download PDF

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Publication number
CN1322794C
CN1322794C CNB028165888A CN02816588A CN1322794C CN 1322794 C CN1322794 C CN 1322794C CN B028165888 A CNB028165888 A CN B028165888A CN 02816588 A CN02816588 A CN 02816588A CN 1322794 C CN1322794 C CN 1322794C
Authority
CN
China
Prior art keywords
powder
conductive
electroconductive
thermosetting
bulk density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB028165888A
Other languages
English (en)
Chinese (zh)
Other versions
CN1547874A (zh
Inventor
H·科约
H·马特苏诺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN1547874A publication Critical patent/CN1547874A/zh
Application granted granted Critical
Publication of CN1322794C publication Critical patent/CN1322794C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CNB028165888A 2001-08-24 2002-08-23 用于导电凸点的热固性导电膏 Expired - Lifetime CN1322794C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31468801P 2001-08-24 2001-08-24
US60/314,688 2001-08-24

Publications (2)

Publication Number Publication Date
CN1547874A CN1547874A (zh) 2004-11-17
CN1322794C true CN1322794C (zh) 2007-06-20

Family

ID=23221009

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028165888A Expired - Lifetime CN1322794C (zh) 2001-08-24 2002-08-23 用于导电凸点的热固性导电膏

Country Status (7)

Country Link
US (1) US6800223B2 (enExample)
EP (1) EP1419678B1 (enExample)
JP (1) JP3964868B2 (enExample)
KR (1) KR100552034B1 (enExample)
CN (1) CN1322794C (enExample)
DE (1) DE60202218T2 (enExample)
WO (1) WO2003019998A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003318545A (ja) * 2002-04-22 2003-11-07 Sony Corp 多層型プリント配線基板及び多層型プリント配線基板の製造方法
JP3767514B2 (ja) * 2002-04-26 2006-04-19 株式会社村田製作所 導電性ペースト
KR100719993B1 (ko) 2003-09-26 2007-05-21 히다치 가세고교 가부시끼가이샤 혼합 도전 분말 및 그의 이용
EP1560272B1 (en) * 2004-01-29 2016-04-27 Panasonic Intellectual Property Management Co., Ltd. Solar cell module
DE112005001527B4 (de) * 2004-07-06 2019-10-02 Murata Manufacturing Co., Ltd. Elektrisch leitfähige Paste und eine elektrisch leitfähige Paste aufweisendes keramisches Elektronikbauelment
JP5141249B2 (ja) * 2005-05-30 2013-02-13 住友電気工業株式会社 導電性ペースト及びそれを用いた多層プリント配線板
JP4821396B2 (ja) * 2006-03-27 2011-11-24 住友金属鉱山株式会社 導電性組成物及び導電膜形成方法
US20080182011A1 (en) * 2007-01-26 2008-07-31 Ng Hou T Metal and metal oxide circuit element ink formulation and method
KR100956074B1 (ko) * 2007-12-06 2010-05-07 제일모직주식회사 범프 형성용 페이스트 조성물
WO2009142310A1 (en) * 2008-05-23 2009-11-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
KR100974439B1 (ko) * 2008-05-30 2010-08-06 전자부품연구원 무소결 세라믹 하이브리드 기판용 비아 페이스트
US8053253B2 (en) * 2008-06-06 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP5248412B2 (ja) * 2008-06-06 2013-07-31 株式会社半導体エネルギー研究所 半導体装置の作製方法
CN101515486B (zh) * 2009-03-27 2011-08-17 彩虹集团公司 一种光热固化导电浆料的制造方法
JP5520097B2 (ja) * 2010-03-23 2014-06-11 富士フイルム株式会社 微小構造体の製造方法
US8685284B2 (en) * 2010-09-17 2014-04-01 Endicott Interconnect Technologies, Inc. Conducting paste for device level interconnects
JP2012164696A (ja) * 2011-02-03 2012-08-30 Sumitomo Bakelite Co Ltd バンプ形成用導電性ペースト
JP2012186254A (ja) * 2011-03-04 2012-09-27 Sumitomo Bakelite Co Ltd 多層配線基板の製造方法
JP2012230866A (ja) * 2011-04-27 2012-11-22 Dainippon Printing Co Ltd 導電性ペースト
JP2012244075A (ja) * 2011-05-23 2012-12-10 Sumitomo Bakelite Co Ltd 導電性樹脂組成物および多層配線基板
KR101796452B1 (ko) * 2012-12-31 2017-11-13 주식회사 아모그린텍 연성인쇄회로기판 및 그 제조 방법
FR3041210B1 (fr) * 2015-09-15 2017-09-15 Sagem Defense Securite Procede d'assemblage par frittage d'argent sans pression
JP6594156B2 (ja) * 2015-10-14 2019-10-23 株式会社ノリタケカンパニーリミテド 加熱硬化型導電性ペースト
CN105646968A (zh) * 2016-03-02 2016-06-08 安徽汇精模具研发科技有限公司 一种降噪导电橡胶垫片

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62150227A (ja) * 1985-12-25 1987-07-04 Hitachi Ltd 液晶表示素子
JPH0198674A (ja) * 1987-10-09 1989-04-17 Daido Steel Co Ltd 導電性組成物
JPH01165654A (ja) * 1987-12-23 1989-06-29 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト
CN1070417A (zh) * 1989-11-14 1993-03-31 戴维·杜兰特 抗潮异电粘合剂及其制造和使用方法
JPH10107431A (ja) * 1996-07-18 1998-04-24 E I Du Pont De Nemours & Co バイア充填用組成物およびバイア充填方法
US6010769A (en) * 1995-11-17 2000-01-04 Kabushiki Kaisha Toshiba Multilayer wiring board and method for forming the same
JP2000138434A (ja) * 1998-10-30 2000-05-16 Denso Corp 回路基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5183593A (en) 1989-11-14 1993-02-02 Poly-Flex Circuits, Inc. Electrically conductive cement
JP3251711B2 (ja) 1993-06-02 2002-01-28 株式会社東芝 印刷配線板および印刷配線板の製造方法
US6221327B1 (en) 1998-05-15 2001-04-24 Rohm And Haas Company Catalyst system using flow-through radiation shielding and a process for producing hydrogen cyanide using the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62150227A (ja) * 1985-12-25 1987-07-04 Hitachi Ltd 液晶表示素子
JPH0198674A (ja) * 1987-10-09 1989-04-17 Daido Steel Co Ltd 導電性組成物
JPH01165654A (ja) * 1987-12-23 1989-06-29 Sumitomo Bakelite Co Ltd 導電性樹脂ペースト
CN1070417A (zh) * 1989-11-14 1993-03-31 戴维·杜兰特 抗潮异电粘合剂及其制造和使用方法
US6010769A (en) * 1995-11-17 2000-01-04 Kabushiki Kaisha Toshiba Multilayer wiring board and method for forming the same
JPH10107431A (ja) * 1996-07-18 1998-04-24 E I Du Pont De Nemours & Co バイア充填用組成物およびバイア充填方法
JP2000138434A (ja) * 1998-10-30 2000-05-16 Denso Corp 回路基板

Also Published As

Publication number Publication date
US20030038280A1 (en) 2003-02-27
EP1419678B1 (en) 2004-12-08
US6800223B2 (en) 2004-10-05
DE60202218D1 (de) 2005-01-13
DE60202218T2 (de) 2005-12-15
CN1547874A (zh) 2004-11-17
JP2005502191A (ja) 2005-01-20
JP3964868B2 (ja) 2007-08-22
EP1419678A1 (en) 2004-05-19
WO2003019998A1 (en) 2003-03-06
KR20040027993A (ko) 2004-04-01
KR100552034B1 (ko) 2006-02-20

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GR01 Patent grant
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Granted publication date: 20070620