CN1315185C - 包括载体的电子器件和制造该电子器件的方法 - Google Patents
包括载体的电子器件和制造该电子器件的方法 Download PDFInfo
- Publication number
- CN1315185C CN1315185C CNB038080575A CN03808057A CN1315185C CN 1315185 C CN1315185 C CN 1315185C CN B038080575 A CNB038080575 A CN B038080575A CN 03808057 A CN03808057 A CN 03808057A CN 1315185 C CN1315185 C CN 1315185C
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- electric device
- etching mask
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- metal
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- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0361—Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
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- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
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- Microbiology (AREA)
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- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
Claims (6)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02076426 | 2002-04-11 | ||
EP02076426.2 | 2002-04-11 | ||
EP02079544.9 | 2002-10-30 | ||
EP02079544 | 2002-10-30 | ||
PCT/IB2003/001299 WO2003085728A1 (en) | 2002-04-11 | 2003-04-10 | Carrier, method of manufacturing a carrier and an electronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1647268A CN1647268A (zh) | 2005-07-27 |
CN1315185C true CN1315185C (zh) | 2007-05-09 |
Family
ID=28793208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB038080575A Expired - Lifetime CN1315185C (zh) | 2002-04-11 | 2003-04-10 | 包括载体的电子器件和制造该电子器件的方法 |
Country Status (8)
Country | Link |
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US (1) | US7247938B2 (zh) |
EP (1) | EP1500137A1 (zh) |
JP (1) | JP4526823B2 (zh) |
KR (1) | KR101009818B1 (zh) |
CN (1) | CN1315185C (zh) |
AU (1) | AU2003219354A1 (zh) |
TW (1) | TWI280646B (zh) |
WO (1) | WO2003085728A1 (zh) |
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WO2005038911A1 (en) | 2003-10-15 | 2005-04-28 | Koninklijke Philips Electronics N.V. | Device, system and electric element |
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EP2123126A2 (en) * | 2006-12-06 | 2009-11-25 | Nxp B.V. | Optical electrical system in package for led based lighting systems |
WO2008078237A2 (en) * | 2006-12-21 | 2008-07-03 | Koninklijke Philips Electronics N.V. | Carrier and optical semiconductor device based on such a carrier |
US8133764B2 (en) | 2007-02-14 | 2012-03-13 | Npx B.V. | Embedded inductor and method of producing thereof |
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EP2884242B1 (en) * | 2013-12-12 | 2021-12-08 | ams International AG | Sensor Package And Manufacturing Method |
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US10573583B2 (en) * | 2018-06-20 | 2020-02-25 | Texas Instruments Incorporated | Semiconductor device package with grooved substrate |
CN108796439A (zh) * | 2018-07-26 | 2018-11-13 | 京东方科技集团股份有限公司 | 一种掩膜板及其制作方法 |
US11002063B2 (en) * | 2018-10-26 | 2021-05-11 | Graffiti Shield, Inc. | Anti-graffiti laminate with visual indicia |
CN109712930B (zh) * | 2018-11-27 | 2020-10-30 | 合肥鑫晟光电科技有限公司 | 显示基板及其制作方法、显示装置 |
US11887916B2 (en) | 2020-09-09 | 2024-01-30 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor devices and methods of manufacturing semiconductor devices |
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JPH11163024A (ja) * | 1997-11-28 | 1999-06-18 | Sumitomo Metal Mining Co Ltd | 半導体装置とこれを組み立てるためのリードフレーム、及び半導体装置の製造方法 |
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JP2009156095A (ja) | 2007-12-25 | 2009-07-16 | Yamaha Motor Co Ltd | 船外機の冷却装置 |
-
2003
- 2003-04-10 WO PCT/IB2003/001299 patent/WO2003085728A1/en active Application Filing
- 2003-04-10 JP JP2003582812A patent/JP4526823B2/ja not_active Expired - Fee Related
- 2003-04-10 KR KR1020047016110A patent/KR101009818B1/ko not_active IP Right Cessation
- 2003-04-10 EP EP03715164A patent/EP1500137A1/en not_active Withdrawn
- 2003-04-10 US US10/510,588 patent/US7247938B2/en not_active Expired - Lifetime
- 2003-04-10 AU AU2003219354A patent/AU2003219354A1/en not_active Abandoned
- 2003-04-10 CN CNB038080575A patent/CN1315185C/zh not_active Expired - Lifetime
- 2003-04-11 TW TW092108375A patent/TWI280646B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1315823A (zh) * | 2000-03-08 | 2001-10-03 | 三洋电机株式会社 | 电路装置的制造方法及电路装置 |
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---|---|
TWI280646B (en) | 2007-05-01 |
EP1500137A1 (en) | 2005-01-26 |
KR101009818B1 (ko) | 2011-01-19 |
WO2003085728A1 (en) | 2003-10-16 |
US7247938B2 (en) | 2007-07-24 |
CN1647268A (zh) | 2005-07-27 |
US20050153483A1 (en) | 2005-07-14 |
KR20040106338A (ko) | 2004-12-17 |
AU2003219354A1 (en) | 2003-10-20 |
JP2005522860A (ja) | 2005-07-28 |
JP4526823B2 (ja) | 2010-08-18 |
TW200401416A (en) | 2004-01-16 |
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