TWI280646B - Carrier, method of manufacturing a carrier and an electronic device - Google Patents

Carrier, method of manufacturing a carrier and an electronic device Download PDF

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Publication number
TWI280646B
TWI280646B TW092108375A TW92108375A TWI280646B TW I280646 B TWI280646 B TW I280646B TW 092108375 A TW092108375 A TW 092108375A TW 92108375 A TW92108375 A TW 92108375A TW I280646 B TWI280646 B TW I280646B
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TW
Taiwan
Prior art keywords
layer
carrier
metal layer
metal
intermediate layer
Prior art date
Application number
TW092108375A
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English (en)
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TW200401416A (en
Inventor
Roelf Anco Jacob Groenhuis
Paul Dijkstra
Cornelis Gerardus Schriks
De Water Peter Wilhelmus M Van
Original Assignee
Nxp Bv
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Publication of TW200401416A publication Critical patent/TW200401416A/zh
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Publication of TWI280646B publication Critical patent/TWI280646B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • A—HUMAN NECESSITIES
    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23G—COCOA; COCOA PRODUCTS, e.g. CHOCOLATE; SUBSTITUTES FOR COCOA OR COCOA PRODUCTS; CONFECTIONERY; CHEWING GUM; ICE-CREAM; PREPARATION THEREOF
    • A23G3/00—Sweetmeats; Confectionery; Marzipan; Coated or filled products
    • A23G3/34—Sweetmeats, confectionery or marzipan; Processes for the preparation thereof
    • A23G3/36—Sweetmeats, confectionery or marzipan; Processes for the preparation thereof characterised by the composition containing organic or inorganic compounds
    • A23G3/364—Sweetmeats, confectionery or marzipan; Processes for the preparation thereof characterised by the composition containing organic or inorganic compounds containing microorganisms or enzymes; containing paramedical or dietetical agents, e.g. vitamins
    • A23G3/366—Sweetmeats, confectionery or marzipan; Processes for the preparation thereof characterised by the composition containing organic or inorganic compounds containing microorganisms or enzymes; containing paramedical or dietetical agents, e.g. vitamins containing microorganisms, enzymes
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    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23G—COCOA; COCOA PRODUCTS, e.g. CHOCOLATE; SUBSTITUTES FOR COCOA OR COCOA PRODUCTS; CONFECTIONERY; CHEWING GUM; ICE-CREAM; PREPARATION THEREOF
    • A23G4/00—Chewing gum
    • A23G4/06—Chewing gum characterised by the composition containing organic or inorganic compounds
    • A23G4/12—Chewing gum characterised by the composition containing organic or inorganic compounds containing microorganisms or enzymes; containing paramedical or dietetical agents, e.g. vitamins
    • A23G4/123—Chewing gum characterised by the composition containing organic or inorganic compounds containing microorganisms or enzymes; containing paramedical or dietetical agents, e.g. vitamins containing microorganisms, enzymes
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    • A23L33/00—Modifying nutritive qualities of foods; Dietetic products; Preparation or treatment thereof
    • A23L33/10—Modifying nutritive qualities of foods; Dietetic products; Preparation or treatment thereof using additives
    • A23L33/135—Bacteria or derivatives thereof, e.g. probiotics
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    • A61K35/747—Lactobacilli, e.g. L. acidophilus or L. brevis
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    • A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
    • A23V—INDEXING SCHEME RELATING TO FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES AND LACTIC OR PROPIONIC ACID BACTERIA USED IN FOODSTUFFS OR FOOD PREPARATION
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    • A23V2400/179—Sakei
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0384—Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

Description

1280646 政、發明說明： [無明所屬之技術領域】 本發明係關於一種電子裝置之、 有-電子元件及具有一第—面万法’該電子裝置臭 體包括由-圖案化之第一金屬;^ /二面之一載體’該載 第-全^ 圖案化之中間層及/ 弟一至屬層組成之堆疊， 琢製造方法包括如下步驟·· 該電子元件之接 將一電子元件放置於該載體之第一 點與第-金屬層導電連接；以及 面 在該電子元件周圍加上一護套。 一面與一第二面之一載體 ~中間層及一第二金屬層 本發明進一步係關於具有—第 ，戎載體包括由一第一金屬層， 組成之堆疊。 冬發明還關於具有
造方法，,& Λ 相對第二面之載體的I 、乃’友，诼万法包括以下步驟： 提供由一第一金屬層，—中 堆最，JL +^ ^ ]層及一第二金屬層組成i ^ 人㈤ 15 51係導電連接，且JL中言 罘一金屬層係位於第一面上；以及 /、中’ 根據所需之圖案使該第一金屬 土屬層圖案化。 【先前技術】 自歐洲專利EP-A i麗85δ中可瞭解此種載體及包含該 載體爻—種電子裝置之製造方法。已知載體係一種A1、Cu FeNi合金之載體或由Cu-Al或Al-Cu-Al堆疊構成之載體。 居載體安置於第一面上，該第一面具有所需之圖案及至少 84901 1280646 由Ni、Au、Ag及Pd中之一種金屬製成之一導電層。在該裝 置之製造過程中，在安裝一半導體元件及加上護套之後， 移除該載體未圖案化之部分。然後，於該載體之第二面光 學微影蝕刻一遮罩，再接著形成接觸面或導梢。 已知方法之缺陷在於：組裝該電子元件後必須進行光學 微影蝕刻步驟。此意謂著組裝廠必須執行此步·驟，考慮當 前工廠之普遍狀況，此為吾人所不欲。 【發明内容】 因此，本發明之第一項目的係提供在序言中所提及類型 之電子裝置的製造方法，其中於安置該電子元件之後不需 光學微影蝕刻步驟，然而，此方法仍可產生一結構緊密且 足夠堅固之裝置。 此第一項目的之達成在於，該載體於第二面上包含一蝕 刻遮罩，且該載體之第一金屬層與第二金屬層係導電連接 ，且其具有相對於中間層凸出之部分。在加上護套合宜地 將該電子元件完全套住之後，自該載體之第二面按照蝕刻 遮罩所定義之圖案蝕刻該第二金屬層。 根據本發明之方法，該載體之第二金屬層未被完全移除 ，而係用於定義其中之接觸面及任何其他圖案。該圖案合 宜地藉由触刻遮罩方式固定，且此蚀刻遮罩係在組裝之前 就已提供。 第二金屬層未被移除之事實意謂著該載體係固定於護套 上。為保證該載體正確地固定於護套上，故將該載體之第 一金屬層機械地錨定於護套上。為此，將第一金屬層及中 84901.doc 1280646 間層圖案化使得第 部分。該等凸出部分與該載體各 ㈢凸出芡 4您万向平行。董 的圖案化最好係採用蝕刻方法， 、g曰 1用 < 蝕刻劑係對第一今 屬層具有選擇性。此將導致對第-金屬層產生―定:产: 侧蝕，其足夠進行機械錨定。 又 該載體之結構使得每一組成層之厚度均可縮小。 機械穩定性並非由第一金屬層而是由整個載體所決定。由 於圖案之解析度亦由該層之厚度决定，所以本發明提供之 載體的第-金屬層圖案可取得非常高之解析度。此效果可 實現進一步小型化以及線路之牿宕、、主 、 A合又狩疋π晰度，以用於精細間 距及高頻率運用。 該本方法之優勢在其可製造多種電子裝置。具體而言， 本方，適合製造半導體裝置，但亦可藉由本方法^造:有 感應器、微機電系統（MEMS)元件或顯示裝置之其他裝置。 可藉由本方法製造的第一組裝置係為結構緊密、包含自 幾個到約四十個接觸面之半導體裝置。具體而言，此係因 為在第一金屬層可定義高解析度圖案，同時第二金屬層可 包括一些接觸面，接觸面間之間距足夠寬，以 準裝置對它們進行焊接。 第二組裝置包括半導體裝置，其包含一個以上電子元件 ’孩等電子元件必須相互連接。由於第一及第二金屬層被 分別圖案化，所以可在第一金屬層定義自一第一電子元件 至一第二電子元件之互連線路。該等互連線路未存在於第 二金屬層之圖案中。因此，在對該載體之第二面進行焊接 84901 χ28〇646 時，該等互連線路與電路板之間不會出現吾人所不欲之接 觸。 此應用之較佳範例存在於一裝置中，此裝置首先包含一 :體電路’以及一或多個用於保護目的且充當元件之二極 體。在此情況下，該二極體可由，例如，具有smd接點之 一極體製成。 在該方法之另一實施例中，該電子元件位於基板之空腔 中，當該兀件被封裝時’填充該空腔。此具體實施例特別 有利於在问功率下運行之裝置，因為該具體實施例可將一 導熱層運用於該空腔之底部。該具體實施例還適用於模組 ’尤其是具有高功帛元件之模組，例如放大器。目此，各 種組件都可容納於不同之空腔中，並藉由三層或多層載體 連接及導電互連。亦可於㈣—金屬層定義各種接觸面^ 以接觸基板上之導體。 在一較佳具體實施例中’蝕刻遮罩具有用於焊接之一黏 接層，該IM矣層也位於該載體之第—面上。&具體實施例 之第一項優勢為可在製造載體期間沈積該黏接層。其第二 項優勢為該黏接層也可當作蝕刻遮罩使甩。其第三項優勢 為可於單私序中在泫載體之第一面及第二面上製造黏 接層。 第一金屬層及中間層之圖案化可在安裝電子元件之前， 在載體製造期間以及組裝過程中進行。若金屬層非常薄， 一般厚度小於約30 μηι，則在組裝過程中使該等層圖案化是 有利的。在此情況下，可避免運輸途中該載體破碎或變形 84901 1280646 之危險。且亦可避免第一金屬層及中間層中之孔洞遭受灰 麈或其他物質污染之危險。該等污染會減弱該載體對護套 之附著力。 在安裝電子元件之前，於該載體之第一面塗敷一液體或 可流動層是有利的。若使用一可流動層，則在安裝電子元 件之後執行一加熱步驟，使該可流動層液化。藉由使用該 種層，可避免焊接或金屬凸塊變形，未預先公開之專利申 請案歐洲專利EP 02077228.1(PHNL02〇471)對該種層有所說 明。该等金屬或焊接凸塊之使用衆所周知，且對元件及第 /金屬層之間之互連具有有利之影響。或者，例如在建立 該連接中可使用一導電黏著劑或許多連接線。 根據本發明之方法特別適合與根據本發明之載體結合運 用。 本發明之第一項目的係為製造序言中提及之類型的載體 藉由3方去，在將一電子元件安裝到該載體上後不需光 學微影蝕刻步驟便可製造出-結構緊密，構造結膏之電子 裝置。 邊弟一項目的係藉由包含由第一蝕刻遮罩、第一金屬層 中門層第一金屬層及第二蝕刻遮罩組成之堆疊之載 體所達成’該第一蝕刻遮罩安裝於該載體之第一面，該第 二蚀刻遮罩則安裝於該載體之第二面。 根據斤&月之载體與已知載體之不同在於，該載體之第 ' 一面及^弟-面上女 Λ 合具有一蝕刻遮罩。因此其優點為，可在 第-及第二金屬層上定義各自獨立之圖案。 84901 -10- 1280646 在一較佳具體實施例中，s 、、斤 技、 土乂琢弟二金屬層具有用於焊 接 < 一黏接層。該等黏接声 接滑 <乾例為至少包含Ag、Pd、Au 和沁中之一種金屬之層。 ， /香 日田文于劑可由Au、Ge合金 如Ti-Ni-AuGe-合金製忐。义丄、丨，成 ^ I成蝕刻遮罩可由黏接層構成，但 也可存在附加層，例如并 先F。此光阻劑之優勢在於其可 輸途中成為黏接層之保護層。頃發現，第二金屬層， =Cu之金屬層，^足夠良好之㈣速度及相對於該黏 接層疋蝕刻選擇性受到飿刿 ^ 」蚀幻例如，可使用Na2S2〇8/H2S04 洛硬作姓刻劑。可有利的按昭_ 文…、圑案，精由鍍金屬之程序 ，如電鍍，製造該黏接層。 未被覆蓋之位置。使用相同黏接層之另—優勢在於限制触 刻劑之用量。由於具有中間I，所以對第—金屬層進行触 刻不會影響第二金屬層。 在特疋較佳具體實施例中，可將由Ni、pd&Au之合金 子層所組成之多層用作黏接層。該層適合電子元件之安裝 及私子7G件 < 導電連接，且它還可用作蝕刻遮罩及用以焊 接電子裝置。 在另一項具體實施例中’第_㈣料亦具有用於焊接 《一黏接層’該黏接層之成份與第二姓刻遮罩之黏接層相 =。該載體可藉由將整個載體浸人浸泡劑中之簡單方法獲 仵在此過私中，黏接層沈積於該載體第一面及第二面上 該載體之中間層較佳係由可對應於第一金屬層選擇性蝕 刻之材料製成。最好係由一金屬製成，以便中間層不用被 單獨圖案化。合適之金屬包括八卜A1之合金、FeNi、FeCrNi 84901 -11 - 1280646 及不銹鋼。其厚度最好在10至100 μηι之間，在2〇至5〇 間更佳。第一及第三金屬層之厚度最好在5至5〇 Am之間， 在1 0至40 μιη之間更佳。 最好將用作焊料阻流劑之金屬用於中間層，特別係一導 電但又不受焊料影響而變得潮濕之金屬或合金。用AU1A1 之。金作中間層，用Cu作第一及第二金屬層效果更好。ai 合金可在其中包括AlxSil-x、ALxCui-?^AlxGeNx，其中以 0·5$χ$〇·99為佳。 或者，孩中間層可包含一絕緣材料，此時該中間層提供 傳導連接。例如，肖由在使中間層圖案化後運用來自溶液 之一傳導層，並藉由電鍍加强該傳導層即可實現該傳導連 接。·可自溶液塗敷之傳導層包括一傳導聚合體層，如聚乙 > di〇xyth10Phene(PEDOT)，與-藉由溶凝膠（s(}Kgel)處理方 法製成之銀層。該中間層也可包括一些子層。 、‘月《第一項目的係為提供一種載體製造方法，藉由 此万法可在有限之步驟内在遴 想圖案之層： J在載^兩相對面上製造具有理 提供一堆疊，其由一第一金 屬層組成，其中第—及第_二：層、—中間層及-第二金 里屬層導電連接，且其中中間 層由可相對於第一金屬層選 Y間 第入“ 屬層^擇性姓刻之材料製成，且其中 罘—金屬層係位於第一面上· ”甲 塗敷感光層並使其圖案化；及 在第 84901 -12- 1280646 0以此方式，可藉由# ^ 由間早之方式獲得具有所需功舻、^ 月亘0若使用該載體，第- 匕又一載 户一^_ 弟—面 < 黏接層可充當蝕刻遮罩。 在一像較佳具體實施 圖案將感光層塗敷到載㈣Τ :二i屬層所期望之 載體之第-面。在4: 接層塗敷到該 黏接層即充.第一 ：Γ ，移除該感光層，此後該 屬層之姓刻遮罩。在使 …、擇性〈蝕刻劑對中間層蝕刻圖案後，菸 由钱刻方法使該金屬展gj安 _ 曰 蜀層圖案化。在孩過程中，相 金屬層發生側餘。咸井 ' …、先層（例如）可使用希普八 (Slnpley)產品 SP2〇29 司 . 1固化後，茲層將具有足夠之機η、 =:因此’當在第二面上塗敷該感光層時，可將= -於罘-面上已經完成並被圖案化之感光層上 現任何問題。 曰 枯黏接層最好由Ni、Pd、"及心中的一種或多種金屬製 成。該等金屬也可料子層，而且可以合金之形式使用。
Ik後所叙具體實施例將清楚地說明並闡明根據本許明 載體與電子裝置之製造方法之該等方面及其他方面。& 【實施方式】 圖1係電子裝置10之第一項具體實施例之截面圖。此情沉 下，汶私子裝置係為一具有五個接點之半離散半導體装置 。然而，此決非關鍵。圖2係第一項具體實施例之平面圖， 其中線A-A表示圖1之橫截面。該半導體裝置包括由第一金 屬層11、一中間層12及第二金屬層n組成之載體。在此實^ 中，第一及第二金屬層11、13包含Cu，中間層包含Ai.99Si 84901 -13 - 1280646 。此外，載體30還包括一第一蝕刻遮罩14及一第二蝕刻遮 罩17。該第一及第二蝕刻遮罩14、17分別具有一由犯…心 合金製成之黏接層。載體3〇藉由第一蝕刻遮罩14自第一面 圖案化，從而形成孔徑丨5及連接導體3丨至35。為此目的， 一蝕刻過程，其中首先蝕刻第一金屬層u，隨後蝕刻中間層 12 ’從而在連接導體3 1至3 5之側面形成凹陷1 6。然後，具 有連接區21之該半導體元件2〇藉由連接裝置22與導體”至 35進行連接，在此為Au凸塊。為此目的，使用覆晶技術。 然後加上濩套40，由於護套延伸到該載體之凹陷丨6，導致形 成一機械錨疋。然後，藉由第二蝕刻遮罩丨7使第二金屬層i 3 圖案化。可藉由將該裝置放在一種蝕刻浸泡劑中實現，該蝕 刻浸泡劑相對於中間層以及第二蝕刻遮罩17選擇性地移除第 二金屬層。隨後利用開孔15將半導體裝置1〇分開。其另外優 勢在於，隨後之機械錨定不但可將連接導體31至35封裝在半 導體兀件20之位置，還可封裝在該元件上之位置。例如，該 半導體裝置之尺寸為大約丨mm見方。開孔15之寬度，例如， 為4〇至100 μιη。第一金屬層n，中間層u及第二金屬層。之 厚度則分別為30 μπι，40 μιη及3〇 μιη。 圖3係根據本發明之裝置1〇第二項具體實施例之截面圖 ’此處為一半導體裝置。該裝置1〇包括安裝在載體3〇上之 一半導體元件20。該載體3〇具有一第一面i及一第二面之， 並且包括許多連接導體31、32、33。該等連接導體31、32 、33具有側面，且相互之間被開孔丨5隔開。半導體元件之 連接導體31、32、33與連接區21之間為連接裝置，此處為 84901 -14- 1280646 連接線22。在該例中，半導體元件2〇藉由黏接層23附在該 載體30之第一面}上。半導體元件2〇及連接線以被護套的封 裝。此護套40延伸到載體3〇之開孔1 5中。 根據本發明，凹陷16位於連接導體31、32、33之側面。 由於孩等凹陷1 6被護套填充，因此該第一層3丨部分被護套 4 0固足。此確保濩套被機械錯定在載體3 〇中，且具有良好 之黏接及機械強度。在此情況下，該載體之第一面丨無需改 進黏接裝置。該第一面1也可最佳化以用於安裝電子元件2 〇 及連接線22。 根據本發明之另一特點，一第二黏接層17位於該載體 之第二面上，且第二金屬層13與第二黏接層17之圖案相同 。因此，在製造該裝置，將電子元件2〇安裝到載體3〇上時 ，不需光學微影蝕刻步驟。第二黏接層丨7亦作為用於焊接 之一黏接層，其可用以將該裝置安裝到一印刷電路板上。 在此項具體實施例中，載體30由一第一金屬層u、一中間 層12及一第二金屬層13組成。第一金屬層π及第二金屬層13 主要由銅製成，中間層12主要由鋁製成。第二金屬層二之 凹陷16係藉由蝕刻形成，將結合圖4至9對此進行解釋。第 一及第二黏接層由NipdAu合金或NiPd合金製成。熟知此項 技術者應可理解，黏接層14、17也可由不同之合適材料製 成。藉由延伸到該載體30之第二面之開口 15，第-人歷 ~'至屬層 13被圖案化以形成接點面，在此係為用於一雙極電晶體。 該連接導體32與接地連接，並充當散熱器。 圖4至1 2顯不根據本發明方法之各個步驟，其用於圖1所 84901 -15- 1280646 示之第二項具體實施例。圖4及圖5係關於該载體3〇之製造 方法。圖7、8、9係_裝置1Q之製造方法。圖6係關於載 體3〇之製造與裝置10之製造過程中可執行之兩個步驟。在 此表明之方法的優勢在於，在製好護套後不f進行微影餘 刻步驟，同時對護套4G之黏賤果很好，㈣裝之前載體 3 0不會分離。 圖4顯示經過第一步驟後之載體3〇,其中第—金屬^以層^ ，中間A1層12及第二金屬Cu層13相互黏接。可將中間層η 當作開始層並在各側面加上一個Cu層。或者，4可藉由同 時來動層U、12、13製成載體30，此技術通f用於形成雙層 。此滾動過程可具有兩個步驟。最後製成-四層或多層之 載㈣有可能。在第-項試驗tll、12、n層之厚度為7〇μιη 此厚度可在1 〇 μπι至i · 〇 _之間變化，^】至^層之厚度不 需相同：若第一金屬層11比較薄，則其最好由—種具有較大 機械強度及剛性之姑料愈】y， t料1成例如鎳鐵合金。可將銅與該 材料組合用於中間y&19。义泰西 、_ 间層Η右需要，可進行熱處理，以加強 等層11、1 2、1 3之間之黏接。 圖5頭示第—面1上且者裳 , 、 上具有罘一蝕刻遮罩14，第二面2上具有 弟《一蚀刻遮罩17之載體3 〇。今| ^ M、啦 戟把该寺蝕刻遮罩係藉由將一種光 阻飢例如希普勵公司生產之sp助])相繼塗敷於第一面 與弟-面’然後圖案化該光阻劑。在圖案化時，光學遮罩 亦被固化。第一面1盥 向”罘一面2又圖案不同。圖案化第一面 之光阻劑後，將載晋# ^ W丨罢 对戰30倒置，然後將光阻劑塗敷到第二面
。隨後，相繼將Ni、# Α Α I 肝⑷Pd及Au加到載體上。也可加Ag。此後 84901 •16- 1280646 ’載體即製成。最好將光阻劑移除。但亦可保留光阻劑當 作保護層。 ^ 圖6顯示經過下列步驟之載體3〇。首先，移除當作保護層 之光阻劑。然後，用若干浸泡劑對載體30進行處理；首先 ，將載體30放在45。〇之]^232〇4圯23〇4溶液浸泡劑中蝕刻5 至1 〇刀叙。於是，第一金屬層被蝕刻成第一蝕刻遮罩1 4所 定義之圖案。接著，將載體30放在K〇H溶液浸泡劑中處理 三分鐘，進而中間八丨層12被蝕刻，凹陷16形成。三分鐘後 ，凹陷义寬度達到70 μιη。10至20 μηι之寬度即足夠取得理 想t機械錨定效果。此寬度之優勢還在於可將連接導體小 型化；對於寬度大約100 μιη之連接導體，其中凹陷16形成 於兩侧面，凹陷之寬度至多約為30 μιη。 於圖7所示之載體3〇中，半導體元件2〇已安裝至載體⑽上 且在居半導骨豆元件2〇之連接區21與連接導體η、Μ之間 具有連接線22。儘管僅顯示單個元件2〇，但實際上載體 上安裝了許多元件，隨後將把該等元件分開。 π在圖8顯示之載體中，第—面！已經加上了護套扣。由於 第二金屬層13尚未圖案化，因此其充當護套材料之阻障。 該材料亦延伸進凹陷16，從而使第—金屬層u被機械錯定在 護套40上。護套4〇與載體高度相同1 —金屬層"以及姓刻 遮罩14之粗糙表面可加强護套4〇與載體之間之黏接。狹而 ，在必須提供接線之位置，ϋ由平面化步驟使表面平坦。 在加上蚀刻遮罩14、17之前即已對載體爽行平面化處理 。例如，可使用-滚筒進行平面化，使最外表面變得光滑 84901 -17- 1280646 ，同時在該表面下為護套黏接留一些孔洞。 圖9顯示之載體30具有元件20及護套40，第二金屬層I3 已圖案化。此藉由將載體30之第二面2放在或浸入45°C之
NaaSzCU/HeO4溶液浸泡劑中5至1〇分鐘達成。選擇圖案以 便在載體30被完全移除之位置定義分離路徑。沿該等分離 路&切割（例如藉由録切）護套4 〇之後，可獲得一最終裝置 10 〇 【圖式簡單說明】 在圖式中： 圖1係該電子裝置第一項具體實施例之截面圖； 圖2係第一項具體實施例之平面圖； 圖3係該電子裝置第二項具體實施例之截面圖；以及 圖4至9顯示圖3所示載體及電子裝置之製造方法之步驟。 該等圖式未按比例繪製。相似元件編號代表相似部分。 替代性具體實施例亦在申請專利範圍所保護之範圍中。 【圖式代表符號說明】 1 第一面 2 弟二面 10 可焊性裝置 11 第一金屬層 12 中間層 13 第二金屬層 14 第一蚀刻遮罩 15 開孔 84901 -18· 1280646 16 凹陷 17 第二蝕刻遮罩 20 半導體元件 21 連接區 22 連接裝置 30 載體 31 、 32 、 33、連接導體 34、35 40 護套 19- 84901

Claims (1)

1280!你108375號專利申請案 中文申請專利範圍替換本(96年元月拾、申請專利範園： 111 .......1 ............................. ,，， -月1日修(·#正本 種製造電子裝置之方法，其包括一載體，於該載體 與相對之第二面間具右一 金屬廣、 之 斤 ’六巴枯〆私·月豆 第J、相對之第二面間具有一圖案化之第一金 圖案化之中間層、一圖案化之第二金屬層及j虫刻遞軍 ^ 目 一_茉化之第二金屬層及〆挪 其第一金屬層係與_電子元件及該第二金屬廣 接^並包含相對於該中間層凸出之部分， 孩方法包括下列步驟： 將％子凡件安裝於該載體之第一面，該電子 各接點與第一金屬層導電連接； :、施加塗敷一護套，該第-金屬層之凸出部分被錨定 該護套上；以及 接'照讀名虫刻诚罢今呈、 二、心 —罩疋我 < 圖案自該載體之第 孩苐二金屬層。 2.如:請專利範園第1項之方法，其特徵在於該飾刻 八用万、&接 < —黏接層，該黏接層也位於该截赠二 一面上。 3·如申請專利範圍 ^ 員万法，其特徵在於該第 層及#亥中間層 > 園^ .. 臂 < 圖案化万式係藉由·· 將具有理想圖案之該黏 之圓案來圖案化該第一全屬；用作麵刻返罩，按1 力今楚人《 屬層’以及藉由相對、人 以弟一金屬層具選擇性之蝕刻劑圖案化:、於讀身 對於該第一金屬層進行側蝕。 崾中間層； 元件 面蝕 4· 種/、有一罘一面及一第- 吗久系—面<載體，並幻α組成之举叠： 八I接由 以 84901-960129.doc 1280646 一第一姓刻遮罩， 一第一金屬層， 一中間層， 一第二金屬層，以及 一第二姓刻遮罩， 該第一蝕刻遮罩係位於該載體之第一面上，且該第二 蝕刻遮罩係位於該載體之第二面上。 5. 如申請專利範圍第4項之載體，其特徵在於該第一金屬 層及孩中間層之圖案化方式係使該第一金屬層具有相 對於該中間層凸出之部分。 6. 如申請專利範圍第4或5项之載體，其特徵在於該第一及 該第二蝕刻遮罩包括用於焊接之一黏接層。 7. 如申請專利範圍第6項之載體，其特徵在於用於坪接之 該黏接層包括選自由Ag、Nipd、㈣仏所組成群組之 材料。 8. 9· 10. 如申叫專利圍第4或5項之載體’其特徵在於該中間層 包括可適當充當焊料阻流劑之一導電材料。 如申請專利範圍第8項之載體，其特徵在於該中間層包 括選自由A1、处合金、FeNi、及不銹鋼所組成 群組之材料’且該第一及該第二金屬層含有銅。 一種製造具有-第_面及—相對第二面之載體的方法 ’其包括如下步驟： 提供由一第一金屬層 之一堆疊，其中該第一 、一中間層及一第二金屬層組成 與该第二金屬層係導電互連，且 84901-960l29.doc -2- 1280646 其中通中間層包括可選擇性地相對於該第一金屬層蝕 % 科且其中該第一金属層係位於該第一面上； 、Μ币二面上塗敷感光層並圖案化該感光層；以及 藉由電化學方法在該第一面及該第二面上提供用於 焊接之一黏接層。 11. 12. 申Θ專利範園第1 〇項之方法，其特徵在於在提供該黏 接曰之如，於該第一面上提供感光層，並隨後對其進行 圖案化。 如申請專利範園第^項之方法，其額外包括下列步帮： 按理想之圖案來圖案化該第一金屬層，在此步驟 中’該黏接層係充當一蝕刻遮罩，以及 使用相對於該第-及該第二金屬層具選擇性之㈣ 劑圖案化該中間層，導致相對於該第—金屬層發生的側 84901-960129.doc 3-
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WO2003085728A1 (en) 2003-10-16
US20050153483A1 (en) 2005-07-14
CN1647268A (zh) 2005-07-27
KR20040106338A (ko) 2004-12-17
US7247938B2 (en) 2007-07-24
JP4526823B2 (ja) 2010-08-18
AU2003219354A1 (en) 2003-10-20

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