CN1306263A - 信息记录标记 - Google Patents
信息记录标记 Download PDFInfo
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- CN1306263A CN1306263A CN01108973A CN01108973A CN1306263A CN 1306263 A CN1306263 A CN 1306263A CN 01108973 A CN01108973 A CN 01108973A CN 01108973 A CN01108973 A CN 01108973A CN 1306263 A CN1306263 A CN 1306263A
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Abstract
在粘贴于所定的覆盖体上而使用的信息记录标记中,为了防止信息记录标记的不正当使用,当把信息记录标记粘贴于覆盖体上之后,并从其覆盖体上剥离,可破坏信息记录标记。在由组装了IC芯片3以及由基体1中的天线线圈2和薄膜电容器5形成的共振电路的IC模块和为了把该IC模块粘贴于覆盖体上而设置在IC微模块粘接剂17共同构成的信息记录标记10A中,在粘结剂17设计了非存在部位18,以便区分包含薄型膜容器5的IC模块上的领域与其它IC模块上的领域。
Description
本发明涉及粘贴在覆盖体上而被使用的记录其覆盖体产品信息并内装有IC模块的信息记录标记。
对于各种产品,就有内装IC模块并粘贴在所定或产品上使用的信息记录标记,作为记录制造厂商品、产品名称、制造年月日、说明书、现在使用次数等。
如图7所示,这样的信息记录标记10一般在绝缘薄膜组成的基体1上装有共振电路及IC芯片3,其共振电路是由天线线圈2及薄膜电容器5组成,并用由环氧树脂等热硬化树脂或聚酯等热熔树脂构成密封树脂11进行密封,在其基体1的侧面上通过丙稀系树脂等粘着剂12层叠聚酯薄膜等外层薄膜13,在相反的表面上通过粘着剂14层叠剥离纸15。这一剥离纸15在信息记录标记10对成为覆盖体的制品作为标记被粘贴时被剥离,同时将树脂密封的IC模块由粘结剂14粘贴在所确定的覆盖体上。其结果,在外层薄膜13上形成所定制品的标记等。
当把信息记录标记粘贴在所定的覆盖体上之后,为了防止信息记录卡不正确地被剥离,与本来应粘贴的覆盖体不同的制品使用的信息记录标记不正确使用。一旦信息记录标记粘贴在所定的覆盖体上之后,当因信息记录标记卡不正确被剥离时,最好信息记录标记自己能被破坏。
本发明的目的是要解决上述已有技术的问题的。一旦把信息记录标记粘贴于所定的覆盖体之后,当将该信息记录标记从其覆盖体剥下时,信息记录标记中内芷的共振电路部容易被破坏,从而防止了信息记录标记的不正当使用。
本发明者不使用密封树脂密封信息记录标记中内芷的IC模块,而是在IC模块上设置粘结剂,而且,将该粘着剂的形成图形便区分为含有IC模块上的薄膜电容器的领域和其它领域时,能看出含有IC模块上的薄膜电容器的领域容易被破坏,也就完成了本发明。
本发明是在基体上由IC模块和粘结剂共同构成的信息记录标记,此IC模块组装有IC芯片以及由天线线圈和薄膜电容器构成的共振电路,该粘结剂是用于将该IC模块粘结在被覆盖体而在IC模块上设置的,其特征在于,形成不存在粘结剂的部分,以便区分含有薄膜电容器的IC模块上的领域和其它IC模块上的领域。
图1是本发明的信息记录标记的平面图(同图(a))以及剖面图(同图(b)。
图2是本发明的信息记录标记的防止不正确使用的说明图。
图3是本发明的信息记录标记制造方法说的图。
图4是本发明的信息记录标记的制造方法说明图。
图5是本发明的信息记录标记中的粘结剂非存在部形成状态的说明图。
图6是本发明的信息记录标记中的粘结剂非存在部形成状态的说明图。
图7是已有的信息记录标记的平面图(同图a)以及剖面图(同图b)。
以下根据附图对本发明进行详细说明。在图中,同一符号表示相同或同等的构成部分。
图1是粘贴在记录器纸带及电视影片等各种制品上并记录该制品信息的本发明的信息记录标记10A的平面图(同图a)以及同图(同图b)。
该信息记录标记10A在由PET、聚酰胺等绝缘薄膜组成的基体1上组装有天线线圈2、IC芯片3以及薄膜电容器5,从而形成IC膜块,在其IC模块的薄膜电容器5侧面上通过兼作充填剂的粘结剂17层叠剥离纸15,在其反面上通过粘结剂17层叠聚酯薄膜的外层薄膜13。其剥离纸15在信息记录标记10A被粘贴于所定的覆盖体上时被剥离,IC模块由粘结剂17被粘贴于覆盖体上。
此信息记录标记10A的特征在于,在IC模块上的粘结剂17上设置非存在部18,以便区分包含有薄膜电容器5的IC模块的领域及其它IC模块的领域。由此,如图2(a)所示,把剥离纸15剥离掉,当再把信息记录标记10A粘贴于所定的覆盖体S上之后,当想要将该信息标记卡10A从覆盖体被剥离时,如同图(b)所示,信息记录标记10A在粘结剂17的非存在部位18产生较大的弯曲,也直接使薄膜电容器5产生很大的歪曲。从而,容易地破坏薄膜电容器5或者其周围的共振电路,从而可以防止信息记录标记在剥离之后再利用。
作为这样的粘结剂17的非存在部18的形成方法,如图3所示,在剥离纸15上形成粘结剂17的印刷图形,以便形成非存在部位18,再把这一图形覆盖并压着在和外层薄膜13相连接的IC模块上。在该场合下,作为粘结外层薄膜13和IC模块的粘结剂,能够使用和印刷在剥离纸15上的粘结剂17同样的粘结剂。
或者如图4(a)所示,在剥离纸15上把粘结剂17作为一样的层进行涂敷,然后,如图(b)所示,通过把粘结剂层半切断,形成粘结剂的非存在部位18,也可以把比非存在部位18覆盖并压着在和外层薄膜13相连接的IC模块上。
作为粘结剂17,从半切断等加工性的观点考虑最好使用薄膜状粘结剂。
另外,在该信息记录标记10A中天线线圈2可对由构成基体1的绝缘薄膜及铜箔组成层叠体的该铜箔进行蚀刻而形成。IC芯片3通过各向异性导电性粘结剂4以表面向下方式安装在基体1上。
作为薄膜电容器5,虽然可以使用各种薄膜状的电容器,但是最好使用云母片6及其两面上形成的电极7a、7b共同构成的云母电容器。由于云母片6的吸水率比较低,所以通过使用云母电容器5能够防止因吸湿造成的IC模块的共振频率的差错。在一般情况下,云母片6及其两面上的电极7a、7b之间的粘结界面和电极7a、7b与粘结剂17之间的粘结界面相比较,粘接强度较低,一旦想把粘贴于覆盖体上的信息记录标记10A从其覆盖体剥离开时,由于容易引起因云母片6及该电极电极7a、7b的剥离而产生的云母电容器5的破坏,所以可以更确实地防止信息记录标记10A的不正确使用。
云母电容器5虽然可以借助各向异性导电性粘结剂4使其电极部和基体1连接,然而电极部以外的云母电容器5却不能借助于各向异性导电性粘结剂4跟基体1连接,再有,云母电容器5的周边部位借助粘结剂17跟基体1连接,但云母电容器5中央部位对基体1的对向面5a不存在粘结剂17,所以最好是使云母电容器5的中央部位和基体1成非结状态。若专门使云母电容器5仅在该电极部和基体1连接,当把信息记录标记10A粘贴于覆盖体上以后,当想剥离时,容易破坏云母电容器5,对基体1的接续部,可以确实地防止信息记录标记10A的不正确使用。
本发明中的信息记录标记不限于上述信息记录标记10A这一例子,它可以得到多种不同的形态。只要形成粘结剂17的非存在部18,以便区分包含有薄膜电容器5的IC模块的领域和其它IC模块的领域,构成IC模块的天线线圈2、IC芯片3、薄膜电容器5的各自种类、形状、配置等都可以适当地确定。这种场合下的粘结剂17的非存在部18形成的状态如图5所示,包含有薄膜电容器5的IC模块上的领域也可以被粘接剂17的非存在部18包围,或者如图6所示,包含有薄膜电容器5的IC模块上的领域也可以不被粘结剂17的非存在部位18包围。
若使用本发明信息记录标记,一旦把它粘贴于所定的覆盖体上以后,想要将该信息记录标记从其覆盖体剥离时,容易破坏内装于信息记录标记的薄膜电容器或薄型电容周围的共振电路部,就可以防止信息记录标记的不正确使用。
Claims (4)
1.一种信息记录标记,它是由IC模块与粘接剂组成,其中IC模块在基体1上组装有IC芯片以及由天线线圈和薄膜电容器组成的共振电路,粘接剂是为了将上述IC模块粘贴于覆盖体上而在IC模块上设置的,其特征是形成一个粘结剂的非存在部位,以便把包含薄膜电容器的IC模块上的领域和其它IC模块上的领域区分开来。
2.如权利要求1所述的信息记录标记,其特征是薄膜电容器是云母电容器。
3.如权利要求1或权利要求2所述的信息记录标记,基特征是粘接剂的非存在部位是由粘接剂的印刷图形形成的。
4.如权利要求1或权利要求2所述的信息记录标记,基特征是粘接剂的非存在部位是通过半切断粘贴于IC模块上的粘结剂层而形成的。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10258/2000 | 2000-01-17 | ||
JP2000010258A JP3557981B2 (ja) | 2000-01-17 | 2000-01-17 | 情報記録タグ |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1306263A true CN1306263A (zh) | 2001-08-01 |
CN1222917C CN1222917C (zh) | 2005-10-12 |
Family
ID=18538290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB011089733A Expired - Fee Related CN1222917C (zh) | 2000-01-17 | 2001-01-17 | 信息记录标签 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6572022B2 (zh) |
EP (1) | EP1120739B1 (zh) |
JP (1) | JP3557981B2 (zh) |
KR (1) | KR100473228B1 (zh) |
CN (1) | CN1222917C (zh) |
DE (1) | DE60109658T2 (zh) |
TW (1) | TW502221B (zh) |
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US7273183B2 (en) | 2003-02-19 | 2007-09-25 | Softbankbb Corp. | Wireless tag |
CN101000659B (zh) * | 2006-12-26 | 2010-08-11 | 上海复旦天臣新技术有限公司 | 具有防伪及防转移功能的非接触式电子标签及其制备方法 |
CN101874252A (zh) * | 2007-07-31 | 2010-10-27 | 意法半导体鲁塞有限公司 | 抗撕裂电路 |
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JP3557990B2 (ja) * | 2000-03-09 | 2004-08-25 | ソニーケミカル株式会社 | 情報記録タグ |
ES2351549T3 (es) * | 2000-03-21 | 2011-02-07 | Mikoh Corporation | Una etiqueta de identificación por radiofrecuencia con indicación de manipulación indebida. |
US7095324B2 (en) * | 2001-03-06 | 2006-08-22 | Intermec Ip Corp | Tamper evident smart label with RF transponder |
JP2003006603A (ja) * | 2001-06-26 | 2003-01-10 | Toshiba Corp | Icカードおよびこのicカードを有する情報処理装置 |
JP2003058053A (ja) * | 2001-08-09 | 2003-02-28 | Hitachi Electronics Service Co Ltd | Idチップ付き商品ラベル |
JP2003108950A (ja) * | 2001-09-28 | 2003-04-11 | Toppan Forms Co Ltd | 非接触型データ送受信体とその製造方法 |
JP2003108960A (ja) * | 2001-09-28 | 2003-04-11 | Toppan Forms Co Ltd | 非接触型データ送受信体 |
US6894615B2 (en) * | 2001-10-09 | 2005-05-17 | 3M Innovative Properties Company | Article with retroreflective and radio frequency-responsive features |
US6758405B2 (en) | 2001-12-19 | 2004-07-06 | 3M Innovative Properties Company | Article with retroreflective and radio frequency-responsive features |
JP4342771B2 (ja) * | 2002-05-15 | 2009-10-14 | リンテック株式会社 | Icタグ |
ITMI20022121A1 (it) * | 2002-10-04 | 2004-04-05 | Fidereveuropa | Carta elettronica con almeno una superficie adesiva. |
US7595727B2 (en) * | 2003-05-16 | 2009-09-29 | Information Systems Laboratories, Inc. | Frangible electronic sealing security system |
US7034689B2 (en) * | 2004-01-28 | 2006-04-25 | Bertrand Teplitxky | Secure product packaging system |
JP4792560B2 (ja) * | 2004-03-31 | 2011-10-12 | 株式会社サトーゴーセー | 情報記録体樹脂封入タグ |
KR101147581B1 (ko) * | 2004-07-01 | 2012-06-04 | 린텍 가부시키가이샤 | 안테나 회로, ic 인렛 및 ic 태그 |
US7274297B2 (en) * | 2004-07-01 | 2007-09-25 | Intermec Ip Corp. | RFID tag and method of manufacture |
KR100918031B1 (ko) * | 2009-04-10 | 2009-09-18 | (주)코아게이트 | 교통카드용 인레이층 구조 및 그 제조방법 |
EP2418608A1 (fr) * | 2010-07-23 | 2012-02-15 | Gemalto SA | Module électronique sécurisé, dispositif à module électronique sécurisé et procédé de fabrication |
JP5928170B2 (ja) * | 2012-06-11 | 2016-06-01 | 凸版印刷株式会社 | 封緘鍵及び封緘装置 |
JP6673022B2 (ja) * | 2016-05-31 | 2020-03-25 | 富士通株式会社 | 電子機器及びビーコン |
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JPS62214998A (ja) * | 1986-03-17 | 1987-09-21 | 三菱電機株式会社 | 薄型半導体カ−ド |
CA2125786C (fr) | 1991-12-19 | 2007-07-31 | Ake Gustafson | Dispositif de scellement de securite |
GB9206974D0 (en) | 1992-03-31 | 1992-05-13 | Lawson Mardon Group Uk Ltd | Improvements in or relating to bags |
JPH07276870A (ja) * | 1993-08-02 | 1995-10-24 | Dainippon Printing Co Ltd | 板状枠体付きicキャリア、その製造方法およびicキャリアケース |
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JPH07179088A (ja) * | 1993-12-22 | 1995-07-18 | Ibiden Co Ltd | Icカード及びその製造方法 |
JPH089977A (ja) * | 1994-07-04 | 1996-01-16 | Kirin Brewery Co Ltd | 酵母プロモーター |
JP3827741B2 (ja) * | 1994-07-26 | 2006-09-27 | 大日本印刷株式会社 | Icカード |
JPH10261062A (ja) * | 1997-03-18 | 1998-09-29 | Toshiba Corp | シート状媒体 |
US5884425A (en) * | 1997-05-23 | 1999-03-23 | Avery Dennison Corporation | Anti-tamper tag with theft protection |
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JP3561117B2 (ja) * | 1997-08-28 | 2004-09-02 | 株式会社東芝 | 無線モジュール及び無線カード |
US5898370A (en) | 1997-12-16 | 1999-04-27 | At&T Corp | Security monitoring system and method |
JPH11328341A (ja) * | 1998-05-13 | 1999-11-30 | Toppan Printing Co Ltd | 複合icカード |
JPH11353443A (ja) * | 1998-06-04 | 1999-12-24 | Waimu Up Kk | Icタッグの破壊型構造 |
JP4046167B2 (ja) * | 1998-08-12 | 2008-02-13 | リンテック株式会社 | 非接触データキャリアラベル |
JP2001024568A (ja) * | 1999-07-07 | 2001-01-26 | Sony Corp | 電子装置 |
US6215400B1 (en) * | 1999-11-02 | 2001-04-10 | Protex International Corp. | Electronic security tag system |
-
2000
- 2000-01-17 JP JP2000010258A patent/JP3557981B2/ja not_active Expired - Fee Related
-
2001
- 2001-01-03 TW TW090100101A patent/TW502221B/zh not_active IP Right Cessation
- 2001-01-10 US US09/756,847 patent/US6572022B2/en not_active Expired - Lifetime
- 2001-01-16 DE DE60109658T patent/DE60109658T2/de not_active Expired - Lifetime
- 2001-01-16 EP EP01100924A patent/EP1120739B1/en not_active Expired - Lifetime
- 2001-01-17 KR KR10-2001-0002568A patent/KR100473228B1/ko not_active IP Right Cessation
- 2001-01-17 CN CNB011089733A patent/CN1222917C/zh not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US7273183B2 (en) | 2003-02-19 | 2007-09-25 | Softbankbb Corp. | Wireless tag |
CN100354885C (zh) * | 2003-02-19 | 2007-12-12 | 索福帮Bb株式会社 | 无线识别卡 |
CN101000659B (zh) * | 2006-12-26 | 2010-08-11 | 上海复旦天臣新技术有限公司 | 具有防伪及防转移功能的非接触式电子标签及其制备方法 |
CN101874252A (zh) * | 2007-07-31 | 2010-10-27 | 意法半导体鲁塞有限公司 | 抗撕裂电路 |
CN101874252B (zh) * | 2007-07-31 | 2014-06-04 | 意法半导体鲁塞有限公司 | 抗撕裂电路 |
Also Published As
Publication number | Publication date |
---|---|
JP2001202492A (ja) | 2001-07-27 |
DE60109658T2 (de) | 2006-06-08 |
EP1120739B1 (en) | 2005-03-30 |
EP1120739A3 (en) | 2002-08-21 |
JP3557981B2 (ja) | 2004-08-25 |
EP1120739A2 (en) | 2001-08-01 |
US20010008684A1 (en) | 2001-07-19 |
TW502221B (en) | 2002-09-11 |
DE60109658D1 (de) | 2005-05-04 |
KR100473228B1 (ko) | 2005-03-08 |
KR20010076299A (ko) | 2001-08-11 |
CN1222917C (zh) | 2005-10-12 |
US6572022B2 (en) | 2003-06-03 |
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