CN1284997C - 导电膜配线的形成方法、膜结构体、电光学装置以及电子仪器 - Google Patents

导电膜配线的形成方法、膜结构体、电光学装置以及电子仪器 Download PDF

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Publication number
CN1284997C
CN1284997C CNB031225268A CN03122526A CN1284997C CN 1284997 C CN1284997 C CN 1284997C CN B031225268 A CNB031225268 A CN B031225268A CN 03122526 A CN03122526 A CN 03122526A CN 1284997 C CN1284997 C CN 1284997C
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CN
China
Prior art keywords
substrate
conductive film
liquid material
liquid
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB031225268A
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English (en)
Chinese (zh)
Other versions
CN1453608A (zh
Inventor
古沢昌宏
平井利充
小田正明
岩重央
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AIHATSUSHINA Co Ltd
Seiko Epson Corp
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AIHATSUSHINA Co Ltd
Seiko Epson Corp
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Application filed by AIHATSUSHINA Co Ltd, Seiko Epson Corp filed Critical AIHATSUSHINA Co Ltd
Publication of CN1453608A publication Critical patent/CN1453608A/zh
Application granted granted Critical
Publication of CN1284997C publication Critical patent/CN1284997C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • G02F1/136295—Materials; Compositions; Manufacture processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2217/00—Gas-filled discharge tubes
    • H01J2217/38—Cold-cathode tubes
    • H01J2217/49—Display panels, e.g. not making use of alternating current
    • H01J2217/492—Details
    • H01J2217/49207—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
CNB031225268A 2002-04-22 2003-04-18 导电膜配线的形成方法、膜结构体、电光学装置以及电子仪器 Expired - Lifetime CN1284997C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002119448A JP4068883B2 (ja) 2002-04-22 2002-04-22 導電膜配線の形成方法、膜構造体の製造方法、電気光学装置の製造方法、及び電子機器の製造方法
JP2002119448 2002-04-22

Publications (2)

Publication Number Publication Date
CN1453608A CN1453608A (zh) 2003-11-05
CN1284997C true CN1284997C (zh) 2006-11-15

Family

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Family Applications (1)

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CNB031225268A Expired - Lifetime CN1284997C (zh) 2002-04-22 2003-04-18 导电膜配线的形成方法、膜结构体、电光学装置以及电子仪器

Country Status (6)

Country Link
US (1) US20030232128A1 (enExample)
EP (1) EP1357772B1 (enExample)
JP (1) JP4068883B2 (enExample)
KR (1) KR100484323B1 (enExample)
CN (1) CN1284997C (enExample)
TW (1) TW583903B (enExample)

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JP4051631B2 (ja) 2004-08-20 2008-02-27 セイコーエプソン株式会社 エッチング方法、微細構造体の製造方法、導電線の形成方法、薄膜トランジスタの製造方法及び電子機器の製造方法
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Publication number Priority date Publication date Assignee Title
CN105555424A (zh) * 2013-10-30 2016-05-04 株式会社尼康 薄膜的制造方法、透明导电膜
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CN110085370A (zh) * 2013-10-30 2019-08-02 株式会社尼康 薄膜的制造方法
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CN110085370B (zh) * 2013-10-30 2021-12-10 株式会社尼康 薄膜的制造方法

Also Published As

Publication number Publication date
EP1357772A2 (en) 2003-10-29
KR20030084608A (ko) 2003-11-01
JP2003315813A (ja) 2003-11-06
TW583903B (en) 2004-04-11
JP4068883B2 (ja) 2008-03-26
CN1453608A (zh) 2003-11-05
EP1357772A3 (en) 2005-01-19
KR100484323B1 (ko) 2005-04-20
EP1357772B1 (en) 2013-06-19
US20030232128A1 (en) 2003-12-18
TW200401594A (en) 2004-01-16

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