CN1234798C - 研磨用组合物及使用了该组合物的存储硬盘的制造方法 - Google Patents
研磨用组合物及使用了该组合物的存储硬盘的制造方法 Download PDFInfo
- Publication number
- CN1234798C CN1234798C CN 02107700 CN02107700A CN1234798C CN 1234798 C CN1234798 C CN 1234798C CN 02107700 CN02107700 CN 02107700 CN 02107700 A CN02107700 A CN 02107700A CN 1234798 C CN1234798 C CN 1234798C
- Authority
- CN
- China
- Prior art keywords
- acid
- composition
- polishing
- hard disk
- storage hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001096699A JP4439755B2 (ja) | 2001-03-29 | 2001-03-29 | 研磨用組成物およびそれを用いたメモリーハードディスクの製造方法 |
JP096699/01 | 2001-03-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1379074A CN1379074A (zh) | 2002-11-13 |
CN1234798C true CN1234798C (zh) | 2006-01-04 |
Family
ID=18950586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02107700 Expired - Fee Related CN1234798C (zh) | 2001-03-29 | 2002-03-29 | 研磨用组合物及使用了该组合物的存储硬盘的制造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4439755B2 (ja) |
CN (1) | CN1234798C (ja) |
GB (1) | GB2375116B (ja) |
MY (1) | MY131997A (ja) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003170349A (ja) * | 2001-09-27 | 2003-06-17 | Fujimi Inc | 磁気ディスク用基板の研磨用組成物及びそれを用いた研磨方法 |
JP3997152B2 (ja) | 2002-12-26 | 2007-10-24 | 花王株式会社 | 研磨液組成物 |
TWI254741B (en) | 2003-02-05 | 2006-05-11 | Kao Corp | Polishing composition |
US6896591B2 (en) * | 2003-02-11 | 2005-05-24 | Cabot Microelectronics Corporation | Mixed-abrasive polishing composition and method for using the same |
JP4202157B2 (ja) * | 2003-02-28 | 2008-12-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
JP2006021259A (ja) * | 2004-07-06 | 2006-01-26 | Fuji Electric Device Technology Co Ltd | 磁気ディスク基板の研磨方法および磁気ディスク媒体 |
JP4954462B2 (ja) * | 2004-10-19 | 2012-06-13 | 株式会社フジミインコーポレーテッド | 窒化シリコン膜選択的研磨用組成物およびそれを用いる研磨方法 |
US7476620B2 (en) | 2005-03-25 | 2009-01-13 | Dupont Air Products Nanomaterials Llc | Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers |
JP4635694B2 (ja) * | 2005-04-15 | 2011-02-23 | 日立化成工業株式会社 | 磁性金属膜と絶縁材料膜とを含む複合膜を研磨するための研磨材および研磨方法 |
US7435162B2 (en) | 2005-10-24 | 2008-10-14 | 3M Innovative Properties Company | Polishing fluids and methods for CMP |
TWI411667B (zh) | 2006-04-28 | 2013-10-11 | Kao Corp | 磁碟基板用之研磨液組成物 |
JP4577296B2 (ja) * | 2006-10-27 | 2010-11-10 | 富士電機デバイステクノロジー株式会社 | 磁気記録媒体用非金属基板の再生方法 |
KR101538826B1 (ko) | 2008-10-20 | 2015-07-22 | 니타 하스 인코포레이티드 | 질화 규소 연마용 조성물 및 이것을 이용한 선택비의 제어 방법 |
JP4891304B2 (ja) * | 2008-10-23 | 2012-03-07 | 花王株式会社 | メモリーハードディスク基板の製造方法 |
US9076480B2 (en) | 2010-03-29 | 2015-07-07 | Hoya Corporation | Method of producing glass substrate for information recording medium |
CN102585707B (zh) * | 2012-02-28 | 2014-01-29 | 上海华明高纳稀土新材料有限公司 | 铈基混合稀土抛光粉的制备方法 |
CN103372809A (zh) * | 2012-04-12 | 2013-10-30 | 江西赛维Ldk太阳能高科技有限公司 | 一种改善硅块磨面质量的方法 |
CN106978087B (zh) * | 2017-03-20 | 2018-10-23 | 上海大学 | 一种偏钛酸包覆氧化铝核壳磨粒抛光液组合物及其制备方法 |
US11186748B2 (en) * | 2017-09-28 | 2021-11-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aqueous anionic functional silica slurry and amine carboxylic acid compositions for selective nitride removal in polishing and methods of using them |
US10584265B2 (en) * | 2017-09-28 | 2020-03-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Aqueous silica slurry and amine carboxylic acid compositions selective for nitride removal in polishing and methods of using them |
SG10201904669TA (en) | 2018-06-28 | 2020-01-30 | Kctech Co Ltd | Polishing Slurry Composition |
US20200303198A1 (en) * | 2019-03-22 | 2020-09-24 | Fujimi Incorporated | Polishing composition and polishing method |
CN111574927A (zh) * | 2020-06-22 | 2020-08-25 | 宁波日晟新材料有限公司 | 一种含还原剂的碳化硅抛光液及其制备方法和应用 |
CN114952437B (zh) * | 2022-05-27 | 2023-08-18 | 中国人民解放军国防科技大学 | NiP改性层的加工方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5858813A (en) * | 1996-05-10 | 1999-01-12 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers and films |
TW501197B (en) * | 1999-08-17 | 2002-09-01 | Hitachi Chemical Co Ltd | Polishing compound for chemical mechanical polishing and method for polishing substrate |
JP4238951B2 (ja) * | 1999-09-28 | 2009-03-18 | 株式会社フジミインコーポレーテッド | 研磨用組成物およびそれを用いたメモリーハードディスクの製造方法 |
JP2001187878A (ja) * | 1999-12-28 | 2001-07-10 | Nec Corp | 化学的機械的研磨用スラリー |
US6355075B1 (en) * | 2000-02-11 | 2002-03-12 | Fujimi Incorporated | Polishing composition |
-
2001
- 2001-03-29 JP JP2001096699A patent/JP4439755B2/ja not_active Expired - Lifetime
-
2002
- 2002-03-14 GB GB0206036A patent/GB2375116B/en not_active Expired - Fee Related
- 2002-03-22 MY MYPI20021016 patent/MY131997A/en unknown
- 2002-03-29 CN CN 02107700 patent/CN1234798C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1379074A (zh) | 2002-11-13 |
JP2002294225A (ja) | 2002-10-09 |
GB0206036D0 (en) | 2002-04-24 |
GB2375116A (en) | 2002-11-06 |
MY131997A (en) | 2007-09-28 |
JP4439755B2 (ja) | 2010-03-24 |
GB2375116B (en) | 2004-10-20 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060104 Termination date: 20150329 |
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EXPY | Termination of patent right or utility model |