CN1213650C - 屏蔽干扰性辐射的印刷电路板的制造方法 - Google Patents

屏蔽干扰性辐射的印刷电路板的制造方法 Download PDF

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Publication number
CN1213650C
CN1213650C CNB018168582A CN01816858A CN1213650C CN 1213650 C CN1213650 C CN 1213650C CN B018168582 A CNB018168582 A CN B018168582A CN 01816858 A CN01816858 A CN 01816858A CN 1213650 C CN1213650 C CN 1213650C
Authority
CN
China
Prior art keywords
printed circuit
circuit board
shield
pcb
plastic film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB018168582A
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English (en)
Chinese (zh)
Other versions
CN1468503A (zh
Inventor
P·莱尔坎普
S·G·J·布兰肯博格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SPGPrints BV
Original Assignee
Stork Prints BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from NL1016354A external-priority patent/NL1016354C1/nl
Application filed by Stork Prints BV filed Critical Stork Prints BV
Publication of CN1468503A publication Critical patent/CN1468503A/zh
Application granted granted Critical
Publication of CN1213650C publication Critical patent/CN1213650C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/363Assembling flexible printed circuits with other printed circuits by soldering
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
CNB018168582A 2000-10-06 2001-10-03 屏蔽干扰性辐射的印刷电路板的制造方法 Expired - Fee Related CN1213650C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
NL1016354A NL1016354C1 (nl) 2000-10-06 2000-10-06 Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.
NL1016354 2000-10-06
NL1016549 2000-11-06
NL1016549A NL1016549C2 (nl) 2000-10-06 2000-11-06 Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling.

Publications (2)

Publication Number Publication Date
CN1468503A CN1468503A (zh) 2004-01-14
CN1213650C true CN1213650C (zh) 2005-08-03

Family

ID=26643249

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB018168582A Expired - Fee Related CN1213650C (zh) 2000-10-06 2001-10-03 屏蔽干扰性辐射的印刷电路板的制造方法

Country Status (12)

Country Link
US (1) US7089646B2 (enExample)
EP (1) EP1323341B1 (enExample)
JP (1) JP2004511107A (enExample)
KR (1) KR20030057535A (enExample)
CN (1) CN1213650C (enExample)
AT (1) ATE270491T1 (enExample)
AU (1) AU2002211084A1 (enExample)
CA (1) CA2424885C (enExample)
DE (1) DE60104140T2 (enExample)
ES (1) ES2219569T3 (enExample)
NL (1) NL1016549C2 (enExample)
WO (1) WO2002030170A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101964830A (zh) * 2010-10-29 2011-02-02 鸿富锦精密工业(深圳)有限公司 带有金属铰链的手机

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100618085B1 (ko) * 2003-09-22 2006-08-29 예원플라즈마 주식회사 전자제품의 보드내 부품들의 이엠아이 및 이에스디 차폐장치 및 그 제조방법
EP1692927A4 (en) * 2003-12-08 2009-04-01 Laird Technologies Inc REPLACEMENT COVER FOR AN ELECTROMAGNETIC SCREEN SYSTEM
FI117257B (fi) * 2003-12-15 2006-08-15 Nokia Corp Menetelmä ja järjestely komponentin suojaamiseksi sähköstaattisilta häiriöiltä
JP4689287B2 (ja) * 2005-02-03 2011-05-25 北川工業株式会社 シールドケース及び導電材同士の接触、固定方法
US7446265B2 (en) * 2005-04-15 2008-11-04 Parker Hannifin Corporation Board level shielding module
GB2426633A (en) * 2005-05-27 2006-11-29 Arka Technologies Ltd Component securing means
US8104474B2 (en) * 2005-08-23 2012-01-31 Portaero, Inc. Collateral ventilation bypass system with retention features
CN1972587B (zh) * 2005-11-25 2011-11-16 深圳富泰宏精密工业有限公司 电子装置的屏蔽构件及壳体组件
CN101452729A (zh) * 2007-11-29 2009-06-10 深圳易拓科技有限公司 一种移动硬盘的抗电磁干扰方法及移动硬盘
KR101056323B1 (ko) * 2009-09-15 2011-08-11 삼성모바일디스플레이주식회사 평판표시장치
DE102009047681A1 (de) * 2009-12-08 2011-06-09 Robert Bosch Gmbh Schaltungsmodul und Verfahren zur Herstellung eines solchen Schaltungsmoduls
JP5593714B2 (ja) 2010-01-29 2014-09-24 富士通株式会社 電子素子のシールド構造及びこれを備えた電子装置
DE102010026953B4 (de) * 2010-07-12 2015-02-26 Continental Automotive Gmbh Gehäuse einer elektronischen Schaltung für eine Kraftstoffpumpe
CN102340962A (zh) * 2010-07-28 2012-02-01 深圳富泰宏精密工业有限公司 固定结构及应用该固定结构的电子装置
US8340735B2 (en) 2010-08-06 2012-12-25 Research In Motion Limited Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device
EP2416544B1 (en) * 2010-08-06 2015-04-29 BlackBerry Limited Electromagnetic Shielding and an Acoustic Chamber for a Microphone in a Mobile Electronic Device
TW201218731A (en) * 2010-10-28 2012-05-01 Hon Hai Prec Ind Co Ltd Mobile phone with metal hinge
US8654537B2 (en) 2010-12-01 2014-02-18 Apple Inc. Printed circuit board with integral radio-frequency shields
US8279625B2 (en) 2010-12-14 2012-10-02 Apple Inc. Printed circuit board radio-frequency shielding structures
KR101052559B1 (ko) * 2011-02-25 2011-07-29 김선기 전자파 차폐 및 보호용 실드케이스
US9179538B2 (en) 2011-06-09 2015-11-03 Apple Inc. Electromagnetic shielding structures for selectively shielding components on a substrate
US9900988B1 (en) * 2011-11-28 2018-02-20 The United States Of America As Represented By The Secretary Of The Army Protective layering process for circuit board EMI sheilding and thermal management
US10631413B1 (en) * 2011-11-28 2020-04-21 The United States Of America As Represented By The Secretary Of The Army Enhanced protective layering process to accommodate circuit board heat dissipation
US9254588B1 (en) * 2011-11-28 2016-02-09 The United States Of America As Represented By The Secretary Of The Army Protective layering process for circuit boards
US10557061B2 (en) 2011-12-26 2020-02-11 Dic Corporation Adhesive tape
TWI468485B (zh) * 2012-05-21 2015-01-11 Dainippon Ink & Chemicals 黏膠帶
US9785185B2 (en) * 2012-09-11 2017-10-10 Apple Inc. Removable adhesive joint for computing device
WO2014055732A2 (en) * 2012-10-04 2014-04-10 Whaley Brian A Shieldings for metal detector heads and manufacturing methods thereof
KR20140143991A (ko) * 2013-06-10 2014-12-18 삼성전기주식회사 무선 전력 전송용 차폐 장치 및 그를 이용한 무선 전력 전송 시스템
JP2015065343A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法
JP2015065342A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、及び、電子機器
US9521741B1 (en) 2014-06-04 2016-12-13 Amazon Technologies, Inc. Side surface mounting of shields for a circuit board assembly
JP6413405B2 (ja) * 2014-07-07 2018-10-31 Agc株式会社 両面粘着フィルム、粘着層付き透明面材、および積層体
CN104837327A (zh) * 2015-05-21 2015-08-12 小米科技有限责任公司 电路保护结构及电子装置
CN105592679B (zh) * 2016-03-09 2018-07-13 深圳市华星光电技术有限公司 Pcb固定结构及液晶显示装置
CN106132182A (zh) * 2016-06-27 2016-11-16 努比亚技术有限公司 印制电路板、移动终端、移动终端屏蔽框及制备方法
CN106028627A (zh) * 2016-07-26 2016-10-12 深圳天珑无线科技有限公司 一种电路板总成
US20180084682A1 (en) * 2016-09-20 2018-03-22 Jones Tech (USA), Inc. Shielding structure for an electronic circuit
JP6691495B2 (ja) * 2017-03-06 2020-04-28 株式会社ソニー・インタラクティブエンタテインメント 電子機器
CN107411459A (zh) * 2017-07-17 2017-12-01 陈锋 一种防电磁辐射的被子
CN113543615B (zh) * 2021-06-29 2022-11-01 中国科学院长春光学精密机械与物理研究所 空间电子设备辐照防护方法
CN114203007B (zh) * 2021-12-14 2024-04-09 三门核电有限公司 一种棒位编码卡故障模拟系统及故障排查系统
CN220156708U (zh) * 2022-09-28 2023-12-08 荣耀终端有限公司 电路板组件及电子设备
US12053112B1 (en) * 2023-09-15 2024-08-06 Jade Taylor Pillow with internal RF shielding storage compartment

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838475A (en) * 1987-08-28 1989-06-13 Motorola, Inc. Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device
WO1992016095A1 (en) * 1991-03-04 1992-09-17 Motorola, Inc. Shielding apparatus for non-conductive electronic circuit package
JPH05136593A (ja) * 1991-03-19 1993-06-01 Fujitsu Ltd シールド構造
CA2151331A1 (en) * 1995-06-08 1996-12-09 Henry W. C. Mok Emi shield
DE29514398U1 (de) * 1995-09-07 1995-10-19 Siemens AG, 80333 München Abschirmung für Flachbaugruppen
DE69700126T2 (de) * 1996-05-08 1999-08-19 W.L. Gore & Associates Deckelkonstruktion zum Abschirmen von elektronischen Bauteile gegen elektromagnetische Störungen
US5761053A (en) * 1996-05-08 1998-06-02 W. L. Gore & Associates, Inc. Faraday cage
SE511926C2 (sv) * 1997-04-16 1999-12-20 Ericsson Telefon Ab L M Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje
JP2894325B2 (ja) * 1997-06-25 1999-05-24 日本電気株式会社 電子回路のシールド構造
JP3331362B2 (ja) * 1997-11-07 2002-10-07 エヌイーシートーキン株式会社 電磁継電器
NL1008197C2 (nl) * 1998-02-04 1999-08-05 Stork Screens Bv Werkwijze voor het vervaardigen van een drager met een afscherming voor stoorstraling, alsmede afschermingsmateriaal.
US6175077B1 (en) * 1999-02-09 2001-01-16 Ericsson Inc. Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same
BR0014718A (pt) * 1999-10-12 2003-07-15 Shielding For Electronics Inc Aparelho de confinamento de emi

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101964830A (zh) * 2010-10-29 2011-02-02 鸿富锦精密工业(深圳)有限公司 带有金属铰链的手机

Also Published As

Publication number Publication date
DE60104140D1 (de) 2004-08-05
CN1468503A (zh) 2004-01-14
WO2002030170A1 (en) 2002-04-11
DE60104140T2 (de) 2005-08-25
NL1016549C2 (nl) 2002-04-10
JP2004511107A (ja) 2004-04-08
ES2219569T3 (es) 2004-12-01
CA2424885C (en) 2009-12-15
CA2424885A1 (en) 2002-04-11
AU2002211084A1 (en) 2002-04-15
ATE270491T1 (de) 2004-07-15
EP1323341A1 (en) 2003-07-02
EP1323341B1 (en) 2004-06-30
KR20030057535A (ko) 2003-07-04
US7089646B2 (en) 2006-08-15
US20040022046A1 (en) 2004-02-05

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Granted publication date: 20050803

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CF01 Termination of patent right due to non-payment of annual fee