Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
  • H05K9/0007—Casings
  • H05K9/002—Casings with localised screening
  • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
  • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
  • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/36—Assembling printed circuits with other printed circuits
  • H05K3/361—Assembling flexible printed circuits with other printed circuits
  • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making

Definitions

• shielding is used in the art when referring to such protection of electronic equipment.
• Suitable shielding materials are generally composed of materials with good electrical and/or magnetic conducting properties, and are consequently often composed of metal.
• Examples of such shielding are metal casings or plastic coverings provided with a thin metal layer and generally applied to the inside of a housing.
• a flowable electrically conducting fixing agent such as solder or conducting polymer, for example in solid form
• the flowable fixing agent can advantageously be applied in the form of a so-called microball grid array.
• the contact points are in communication with the printed circuit (network of electrical conductors) .
• the one or more electronic components are then placed, and the shield is subsequently placed over the top of the electronic components.
• the temperature is then increased to above the flow temperature of the fixing agent.
• soldering paste such a temperature increase can be carried out, for example, in an oven by heating to 260°C or more, depending on the type of soldering paste used.
• the plastic is advantageously resistant to chemicals, in particular to acids .
• the metal of the metallized plastic film is advantageously selected from Sn, Ni, Cu, Pb, alloys and mixtures thereof.
• a preferred material comprises tin or a tin alloy, on account of the good deformation properties, as already recognized in the earlier mentioned publication WO-A-98/40770.
• the properties mentioned in that publication such as thicknesses of the plastic film and the layer of tin deposited on it, if desired with the interposition of a thin intermediate layer which promotes adhesion, or with a corrosion- resistant top layer, are likewise usable in the case of the present invention.
• Fig. 5 is a cross-sectional view of a third embodiment of a PCB with a shield acting against interfering radiation;
• the metal layer 32 in this way is in direct contact with the earth track 13, as can be seen in greater detail from the cross section according to Figure 4.
• the embodiment illustrated in Figs. 3 and 4 is made as follows.
• the electrical components 14 are positioned on the contact points 15 on the board 11 with network of conductors 12 and a separate earth track 13 - for example, projecting contacts of the components 14 in corresponding recesses of the contact points - and soldered with solder 16.
• the shield 20 is then positioned over the top of the electrical components 14, and fixed with the single-sided adhesive tape 31 through the apertures 29.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
• Structure Of Printed Boards (AREA)

Priority Applications (8)

Applications Claiming Priority (4)

Publications (1)

Family

ID=26643249

Family Applications (1)

Country Status (12)

Cited By (5)

Families Citing this family (40)

Citations (6)

Family Cites Families (7)

• 2000
  • 2000-11-06 NL NL1016549A patent/NL1016549C2/nl not_active IP Right Cessation
• 2001
  • 2001-10-03 AT AT01979095T patent/ATE270491T1/de not_active IP Right Cessation
  • 2001-10-03 AU AU2002211084A patent/AU2002211084A1/en not_active Abandoned
  • 2001-10-03 CA CA002424885A patent/CA2424885C/en not_active Expired - Lifetime
  • 2001-10-03 EP EP01979095A patent/EP1323341B1/en not_active Expired - Lifetime
  • 2001-10-03 US US10/398,497 patent/US7089646B2/en not_active Expired - Lifetime
  • 2001-10-03 CN CNB018168582A patent/CN1213650C/zh not_active Expired - Fee Related
  • 2001-10-03 ES ES01979095T patent/ES2219569T3/es not_active Expired - Lifetime
  • 2001-10-03 KR KR10-2003-7004891A patent/KR20030057535A/ko not_active Ceased
  • 2001-10-03 JP JP2002533421A patent/JP2004511107A/ja active Pending
  • 2001-10-03 WO PCT/NL2001/000727 patent/WO2002030170A1/en not_active Ceased
  • 2001-10-03 DE DE60104140T patent/DE60104140T2/de not_active Expired - Lifetime

Patent Citations (6)

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