KR20030057535A - 방사 간섭에 대하여 차폐되는 인쇄회로기판의 생산 방법 - Google Patents
방사 간섭에 대하여 차폐되는 인쇄회로기판의 생산 방법 Download PDFInfo
- Publication number
- KR20030057535A KR20030057535A KR10-2003-7004891A KR20037004891A KR20030057535A KR 20030057535 A KR20030057535 A KR 20030057535A KR 20037004891 A KR20037004891 A KR 20037004891A KR 20030057535 A KR20030057535 A KR 20030057535A
- Authority
- KR
- South Korea
- Prior art keywords
- shield
- printed wiring
- electronic component
- substrate
- plastic film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims abstract description 47
- 230000005855 radiation Effects 0.000 title claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 title description 6
- 230000002452 interceptive effect Effects 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000002985 plastic film Substances 0.000 claims description 32
- 229920006255 plastic film Polymers 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000004033 plastic Substances 0.000 claims description 22
- 229920003023 plastic Polymers 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 239000002390 adhesive tape Substances 0.000 claims description 16
- 229920001721 polyimide Polymers 0.000 claims description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052718 tin Inorganic materials 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 230000009969 flowable effect Effects 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 239000004695 Polyether sulfone Substances 0.000 claims description 4
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 4
- 239000011133 lead Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920003208 poly(ethylene sulfide) Polymers 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 229920006393 polyether sulfone Polymers 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229920000058 polyacrylate Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000012994 photoredox catalyst Substances 0.000 claims 3
- 239000010410 layer Substances 0.000 description 14
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000004020 conductor Substances 0.000 description 13
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 10
- 238000005476 soldering Methods 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 3
- 229920001940 conductive polymer Polymers 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000004224 protection Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229920005830 Polyurethane Foam Polymers 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000002984 plastic foam Substances 0.000 description 2
- 239000011496 polyurethane foam Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000011806 microball Substances 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL1016354 | 2000-10-06 | ||
| NL1016354A NL1016354C1 (nl) | 2000-10-06 | 2000-10-06 | Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. |
| NL1016549 | 2000-11-06 | ||
| NL1016549A NL1016549C2 (nl) | 2000-10-06 | 2000-11-06 | Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. |
| PCT/NL2001/000727 WO2002030170A1 (en) | 2000-10-06 | 2001-10-03 | Methods of manufacturing a printed circuit board shielded against interfering radiation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20030057535A true KR20030057535A (ko) | 2003-07-04 |
Family
ID=26643249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-7004891A Ceased KR20030057535A (ko) | 2000-10-06 | 2001-10-03 | 방사 간섭에 대하여 차폐되는 인쇄회로기판의 생산 방법 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US7089646B2 (enExample) |
| EP (1) | EP1323341B1 (enExample) |
| JP (1) | JP2004511107A (enExample) |
| KR (1) | KR20030057535A (enExample) |
| CN (1) | CN1213650C (enExample) |
| AT (1) | ATE270491T1 (enExample) |
| AU (1) | AU2002211084A1 (enExample) |
| CA (1) | CA2424885C (enExample) |
| DE (1) | DE60104140T2 (enExample) |
| ES (1) | ES2219569T3 (enExample) |
| NL (1) | NL1016549C2 (enExample) |
| WO (1) | WO2002030170A1 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101300936B1 (ko) * | 2010-08-06 | 2013-08-27 | 리서치 인 모션 리미티드 | 이동 전자 디바이스의 마이크로폰을 위한 전자기 차폐 및 음향 챔버 |
| KR20130128368A (ko) * | 2010-07-12 | 2013-11-26 | 콘티넨탈 오토모티브 게엠베하 | 연료 펌프용 전자 회로를 위한 하우징 |
| US8797763B2 (en) | 2010-01-29 | 2014-08-05 | Fujitsu Limited | Shield structure for an electronic element and electronic device |
| KR20140143991A (ko) * | 2013-06-10 | 2014-12-18 | 삼성전기주식회사 | 무선 전력 전송용 차폐 장치 및 그를 이용한 무선 전력 전송 시스템 |
| KR20150060983A (ko) * | 2012-10-04 | 2015-06-03 | 니텍 인코포레이티드 | 금속 탐지기 헤드용 차폐체 및 그것의 제조 방법 |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100618085B1 (ko) * | 2003-09-22 | 2006-08-29 | 예원플라즈마 주식회사 | 전자제품의 보드내 부품들의 이엠아이 및 이에스디 차폐장치 및 그 제조방법 |
| EP1692927A4 (en) * | 2003-12-08 | 2009-04-01 | Laird Technologies Inc | REPLACEMENT COVER FOR AN ELECTROMAGNETIC SCREEN SYSTEM |
| FI117257B (fi) * | 2003-12-15 | 2006-08-15 | Nokia Corp | Menetelmä ja järjestely komponentin suojaamiseksi sähköstaattisilta häiriöiltä |
| JP4689287B2 (ja) * | 2005-02-03 | 2011-05-25 | 北川工業株式会社 | シールドケース及び導電材同士の接触、固定方法 |
| US7446265B2 (en) * | 2005-04-15 | 2008-11-04 | Parker Hannifin Corporation | Board level shielding module |
| GB2426633A (en) * | 2005-05-27 | 2006-11-29 | Arka Technologies Ltd | Component securing means |
| US8104474B2 (en) * | 2005-08-23 | 2012-01-31 | Portaero, Inc. | Collateral ventilation bypass system with retention features |
| CN1972587B (zh) * | 2005-11-25 | 2011-11-16 | 深圳富泰宏精密工业有限公司 | 电子装置的屏蔽构件及壳体组件 |
| CN101452729A (zh) * | 2007-11-29 | 2009-06-10 | 深圳易拓科技有限公司 | 一种移动硬盘的抗电磁干扰方法及移动硬盘 |
| KR101056323B1 (ko) * | 2009-09-15 | 2011-08-11 | 삼성모바일디스플레이주식회사 | 평판표시장치 |
| DE102009047681A1 (de) * | 2009-12-08 | 2011-06-09 | Robert Bosch Gmbh | Schaltungsmodul und Verfahren zur Herstellung eines solchen Schaltungsmoduls |
| CN102340962A (zh) * | 2010-07-28 | 2012-02-01 | 深圳富泰宏精密工业有限公司 | 固定结构及应用该固定结构的电子装置 |
| US8340735B2 (en) * | 2010-08-06 | 2012-12-25 | Research In Motion Limited | Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device |
| TW201218731A (en) * | 2010-10-28 | 2012-05-01 | Hon Hai Prec Ind Co Ltd | Mobile phone with metal hinge |
| CN101964830A (zh) * | 2010-10-29 | 2011-02-02 | 鸿富锦精密工业（深圳）有限公司 | 带有金属铰链的手机 |
| US8654537B2 (en) | 2010-12-01 | 2014-02-18 | Apple Inc. | Printed circuit board with integral radio-frequency shields |
| US8279625B2 (en) | 2010-12-14 | 2012-10-02 | Apple Inc. | Printed circuit board radio-frequency shielding structures |
| KR101052559B1 (ko) * | 2011-02-25 | 2011-07-29 | 김선기 | 전자파 차폐 및 보호용 실드케이스 |
| US9179538B2 (en) | 2011-06-09 | 2015-11-03 | Apple Inc. | Electromagnetic shielding structures for selectively shielding components on a substrate |
| US10631413B1 (en) * | 2011-11-28 | 2020-04-21 | The United States Of America As Represented By The Secretary Of The Army | Enhanced protective layering process to accommodate circuit board heat dissipation |
| US9900988B1 (en) * | 2011-11-28 | 2018-02-20 | The United States Of America As Represented By The Secretary Of The Army | Protective layering process for circuit board EMI sheilding and thermal management |
| US9254588B1 (en) * | 2011-11-28 | 2016-02-09 | The United States Of America As Represented By The Secretary Of The Army | Protective layering process for circuit boards |
| US10557061B2 (en) | 2011-12-26 | 2020-02-11 | Dic Corporation | Adhesive tape |
| TWI468485B (zh) * | 2012-05-21 | 2015-01-11 | Dainippon Ink & Chemicals | 黏膠帶 |
| US9785185B2 (en) * | 2012-09-11 | 2017-10-10 | Apple Inc. | Removable adhesive joint for computing device |
| JP2015065342A (ja) * | 2013-09-25 | 2015-04-09 | タツタ電線株式会社 | シールド収容体、プリント回路板、及び、電子機器 |
| JP2015065343A (ja) * | 2013-09-25 | 2015-04-09 | タツタ電線株式会社 | シールド収容体、プリント回路板、電子機器、及び、シールド収容体の製造方法 |
| US9521741B1 (en) | 2014-06-04 | 2016-12-13 | Amazon Technologies, Inc. | Side surface mounting of shields for a circuit board assembly |
| JP6413405B2 (ja) * | 2014-07-07 | 2018-10-31 | Ａｇｃ株式会社 | 両面粘着フィルム、粘着層付き透明面材、および積層体 |
| CN104837327A (zh) * | 2015-05-21 | 2015-08-12 | 小米科技有限责任公司 | 电路保护结构及电子装置 |
| CN105592679B (zh) * | 2016-03-09 | 2018-07-13 | 深圳市华星光电技术有限公司 | Pcb固定结构及液晶显示装置 |
| CN106132182A (zh) * | 2016-06-27 | 2016-11-16 | 努比亚技术有限公司 | 印制电路板、移动终端、移动终端屏蔽框及制备方法 |
| CN106028627A (zh) * | 2016-07-26 | 2016-10-12 | 深圳天珑无线科技有限公司 | 一种电路板总成 |
| US20180084682A1 (en) * | 2016-09-20 | 2018-03-22 | Jones Tech (USA), Inc. | Shielding structure for an electronic circuit |
| JP6691495B2 (ja) * | 2017-03-06 | 2020-04-28 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
| CN107411459A (zh) * | 2017-07-17 | 2017-12-01 | 陈锋 | 一种防电磁辐射的被子 |
| CN113543615B (zh) * | 2021-06-29 | 2022-11-01 | 中国科学院长春光学精密机械与物理研究所 | 空间电子设备辐照防护方法 |
| CN114203007B (zh) * | 2021-12-14 | 2024-04-09 | 三门核电有限公司 | 一种棒位编码卡故障模拟系统及故障排查系统 |
| CN219087379U (zh) * | 2022-09-28 | 2023-05-26 | 荣耀终端有限公司 | 电路板组件及电子设备 |
| US12053112B1 (en) * | 2023-09-15 | 2024-08-06 | Jade Taylor | Pillow with internal RF shielding storage compartment |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4838475A (en) * | 1987-08-28 | 1989-06-13 | Motorola, Inc. | Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device |
| WO1992016095A1 (en) * | 1991-03-04 | 1992-09-17 | Motorola, Inc. | Shielding apparatus for non-conductive electronic circuit package |
| JPH05136593A (ja) * | 1991-03-19 | 1993-06-01 | Fujitsu Ltd | シールド構造 |
| CA2151331A1 (en) * | 1995-06-08 | 1996-12-09 | Henry W. C. Mok | Emi shield |
| DE29514398U1 (de) * | 1995-09-07 | 1995-10-19 | Siemens AG, 80333 München | Abschirmung für Flachbaugruppen |
| US5761053A (en) * | 1996-05-08 | 1998-06-02 | W. L. Gore & Associates, Inc. | Faraday cage |
| EP0806891B1 (en) * | 1996-05-08 | 1999-03-10 | W.L. GORE & ASSOCIATES, INC. | A lid assembly for shielding electronic components from EMI/RFI interferences |
| SE511926C2 (sv) * | 1997-04-16 | 1999-12-20 | Ericsson Telefon Ab L M | Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje |
| JP2894325B2 (ja) * | 1997-06-25 | 1999-05-24 | 日本電気株式会社 | 電子回路のシールド構造 |
| JP3331362B2 (ja) * | 1997-11-07 | 2002-10-07 | エヌイーシートーキン株式会社 | 電磁継電器 |
| NL1008197C2 (nl) * | 1998-02-04 | 1999-08-05 | Stork Screens Bv | Werkwijze voor het vervaardigen van een drager met een afscherming voor stoorstraling, alsmede afschermingsmateriaal. |
| US6175077B1 (en) * | 1999-02-09 | 2001-01-16 | Ericsson Inc. | Shield can having tapered wall ends for surface mounting and radiotelephones incorporating same |
| WO2001028305A1 (en) * | 1999-10-12 | 2001-04-19 | Shielding For Electronics, Inc. | Emi containment apparatus |
-
2000
- 2000-11-06 NL NL1016549A patent/NL1016549C2/nl not_active IP Right Cessation
-
2001
- 2001-10-03 AT AT01979095T patent/ATE270491T1/de not_active IP Right Cessation
- 2001-10-03 AU AU2002211084A patent/AU2002211084A1/en not_active Abandoned
- 2001-10-03 CA CA002424885A patent/CA2424885C/en not_active Expired - Lifetime
- 2001-10-03 EP EP01979095A patent/EP1323341B1/en not_active Expired - Lifetime
- 2001-10-03 US US10/398,497 patent/US7089646B2/en not_active Expired - Lifetime
- 2001-10-03 CN CNB018168582A patent/CN1213650C/zh not_active Expired - Fee Related
- 2001-10-03 ES ES01979095T patent/ES2219569T3/es not_active Expired - Lifetime
- 2001-10-03 KR KR10-2003-7004891A patent/KR20030057535A/ko not_active Ceased
- 2001-10-03 JP JP2002533421A patent/JP2004511107A/ja active Pending
- 2001-10-03 WO PCT/NL2001/000727 patent/WO2002030170A1/en not_active Ceased
- 2001-10-03 DE DE60104140T patent/DE60104140T2/de not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8797763B2 (en) | 2010-01-29 | 2014-08-05 | Fujitsu Limited | Shield structure for an electronic element and electronic device |
| KR20130128368A (ko) * | 2010-07-12 | 2013-11-26 | 콘티넨탈 오토모티브 게엠베하 | 연료 펌프용 전자 회로를 위한 하우징 |
| KR101300936B1 (ko) * | 2010-08-06 | 2013-08-27 | 리서치 인 모션 리미티드 | 이동 전자 디바이스의 마이크로폰을 위한 전자기 차폐 및 음향 챔버 |
| KR20150060983A (ko) * | 2012-10-04 | 2015-06-03 | 니텍 인코포레이티드 | 금속 탐지기 헤드용 차폐체 및 그것의 제조 방법 |
| KR102159690B1 (ko) | 2012-10-04 | 2020-09-24 | 쳄링 센서스 앤드 일렉트로닉 시스템스 인코포레이트 | 금속 탐지기 헤드용 차폐체 및 그것의 제조 방법 |
| KR20140143991A (ko) * | 2013-06-10 | 2014-12-18 | 삼성전기주식회사 | 무선 전력 전송용 차폐 장치 및 그를 이용한 무선 전력 전송 시스템 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004511107A (ja) | 2004-04-08 |
| CN1468503A (zh) | 2004-01-14 |
| WO2002030170A1 (en) | 2002-04-11 |
| US20040022046A1 (en) | 2004-02-05 |
| EP1323341B1 (en) | 2004-06-30 |
| AU2002211084A1 (en) | 2002-04-15 |
| ES2219569T3 (es) | 2004-12-01 |
| CA2424885A1 (en) | 2002-04-11 |
| DE60104140T2 (de) | 2005-08-25 |
| NL1016549C2 (nl) | 2002-04-10 |
| EP1323341A1 (en) | 2003-07-02 |
| CA2424885C (en) | 2009-12-15 |
| DE60104140D1 (de) | 2004-08-05 |
| CN1213650C (zh) | 2005-08-03 |
| ATE270491T1 (de) | 2004-07-15 |
| US7089646B2 (en) | 2006-08-15 |
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