JPH0377680B2 - - Google Patents

Info

Publication number
JPH0377680B2
JPH0377680B2 JP57130645A JP13064582A JPH0377680B2 JP H0377680 B2 JPH0377680 B2 JP H0377680B2 JP 57130645 A JP57130645 A JP 57130645A JP 13064582 A JP13064582 A JP 13064582A JP H0377680 B2 JPH0377680 B2 JP H0377680B2
Authority
JP
Japan
Prior art keywords
metal
printed circuit
circuit board
hole
thermoplastic polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57130645A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5921094A (ja
Inventor
Akio Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Priority to JP57130645A priority Critical patent/JPS5921094A/ja
Priority to KR1019830003208A priority patent/KR880002218B1/ko
Publication of JPS5921094A publication Critical patent/JPS5921094A/ja
Publication of JPH0377680B2 publication Critical patent/JPH0377680B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP57130645A 1982-07-27 1982-07-27 基板の絶縁方法 Granted JPS5921094A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP57130645A JPS5921094A (ja) 1982-07-27 1982-07-27 基板の絶縁方法
KR1019830003208A KR880002218B1 (ko) 1982-07-27 1983-07-14 기판의 절연방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57130645A JPS5921094A (ja) 1982-07-27 1982-07-27 基板の絶縁方法

Publications (2)

Publication Number Publication Date
JPS5921094A JPS5921094A (ja) 1984-02-02
JPH0377680B2 true JPH0377680B2 (enExample) 1991-12-11

Family

ID=15039203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57130645A Granted JPS5921094A (ja) 1982-07-27 1982-07-27 基板の絶縁方法

Country Status (2)

Country Link
JP (1) JPS5921094A (enExample)
KR (1) KR880002218B1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020104442A (ja) * 2018-12-28 2020-07-09 株式会社マーレ フィルターシステムズ 接合構造および接合構造の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS576276B2 (enExample) * 1974-03-30 1982-02-04

Also Published As

Publication number Publication date
KR840005798A (ko) 1984-11-15
KR880002218B1 (ko) 1988-10-18
JPS5921094A (ja) 1984-02-02

Similar Documents

Publication Publication Date Title
US4993148A (en) Method of manufacturing a circuit board
KR100307671B1 (ko) 배선구성체및그의제조방법및그의배선구성체를이용한회로기판
JP2784522B2 (ja) 電子部品搭載用基板及びその製造法
JPH0685461B2 (ja) 金属コアプリント配線板
JPH0377680B2 (enExample)
JPH08148782A (ja) 金属コア回路板
CN110521292A (zh) 印刷电路板及其制造方法
JP3346216B2 (ja) プリント配線板
JPH0330494A (ja) フレキシブル回路基板のスルーホール部の形成方法
JP2844584B2 (ja) 電磁シールドされた回路基板
JPS6286888A (ja) 金属ベ−ス基板
JP2784525B2 (ja) 電子部品搭載用基板
JPS6215840A (ja) 電子素子用チツプキヤリア
WO2002091810A2 (en) Printed circuit board
JPS6320859A (ja) ピングリツドアレイ
JPS6329391B2 (enExample)
JPH05327156A (ja) プリント回路基板
JPS62277797A (ja) 電気機器
JPS6245719B2 (enExample)
JP2580607B2 (ja) 回路基板及び回路基板の製造方法
JPH0514547Y2 (enExample)
JPH0316195A (ja) プリント配線板
JPH0722727A (ja) 電子部品搭載用基板
JPS6192848A (ja) 金属ベ−スプリント配線板用積層板の製造法
JPS60236280A (ja) 配線用板