JPS5921094A - 基板の絶縁方法 - Google Patents
基板の絶縁方法Info
- Publication number
- JPS5921094A JPS5921094A JP57130645A JP13064582A JPS5921094A JP S5921094 A JPS5921094 A JP S5921094A JP 57130645 A JP57130645 A JP 57130645A JP 13064582 A JP13064582 A JP 13064582A JP S5921094 A JPS5921094 A JP S5921094A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- metal
- hole
- circuit board
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 title claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 37
- 239000002184 metal Substances 0.000 claims description 37
- 239000012212 insulator Substances 0.000 claims description 24
- 239000002952 polymeric resin Substances 0.000 claims description 9
- 229920001169 thermoplastic Polymers 0.000 claims description 9
- 238000001746 injection moulding Methods 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 12
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000004033 plastic Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229930182556 Polyacetal Natural products 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920006324 polyoxymethylene Polymers 0.000 description 2
- 229920005177 Duracon® POM Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57130645A JPS5921094A (ja) | 1982-07-27 | 1982-07-27 | 基板の絶縁方法 |
| KR1019830003208A KR880002218B1 (ko) | 1982-07-27 | 1983-07-14 | 기판의 절연방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57130645A JPS5921094A (ja) | 1982-07-27 | 1982-07-27 | 基板の絶縁方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5921094A true JPS5921094A (ja) | 1984-02-02 |
| JPH0377680B2 JPH0377680B2 (enExample) | 1991-12-11 |
Family
ID=15039203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57130645A Granted JPS5921094A (ja) | 1982-07-27 | 1982-07-27 | 基板の絶縁方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5921094A (enExample) |
| KR (1) | KR880002218B1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020104442A (ja) * | 2018-12-28 | 2020-07-09 | 株式会社マーレ フィルターシステムズ | 接合構造および接合構造の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50129965A (enExample) * | 1974-03-30 | 1975-10-14 |
-
1982
- 1982-07-27 JP JP57130645A patent/JPS5921094A/ja active Granted
-
1983
- 1983-07-14 KR KR1019830003208A patent/KR880002218B1/ko not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50129965A (enExample) * | 1974-03-30 | 1975-10-14 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020104442A (ja) * | 2018-12-28 | 2020-07-09 | 株式会社マーレ フィルターシステムズ | 接合構造および接合構造の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR840005798A (ko) | 1984-11-15 |
| KR880002218B1 (ko) | 1988-10-18 |
| JPH0377680B2 (enExample) | 1991-12-11 |
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