JPH0548958B2 - - Google Patents

Info

Publication number
JPH0548958B2
JPH0548958B2 JP62319958A JP31995887A JPH0548958B2 JP H0548958 B2 JPH0548958 B2 JP H0548958B2 JP 62319958 A JP62319958 A JP 62319958A JP 31995887 A JP31995887 A JP 31995887A JP H0548958 B2 JPH0548958 B2 JP H0548958B2
Authority
JP
Japan
Prior art keywords
hole
forming
metal
metal core
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62319958A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01160043A (ja
Inventor
Takashi Nakabayashi
Tsukasa Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP31995887A priority Critical patent/JPH01160043A/ja
Publication of JPH01160043A publication Critical patent/JPH01160043A/ja
Publication of JPH0548958B2 publication Critical patent/JPH0548958B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP31995887A 1987-12-16 1987-12-16 電子部品塔載用基板の製造方法 Granted JPH01160043A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31995887A JPH01160043A (ja) 1987-12-16 1987-12-16 電子部品塔載用基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31995887A JPH01160043A (ja) 1987-12-16 1987-12-16 電子部品塔載用基板の製造方法

Publications (2)

Publication Number Publication Date
JPH01160043A JPH01160043A (ja) 1989-06-22
JPH0548958B2 true JPH0548958B2 (enExample) 1993-07-22

Family

ID=18116147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31995887A Granted JPH01160043A (ja) 1987-12-16 1987-12-16 電子部品塔載用基板の製造方法

Country Status (1)

Country Link
JP (1) JPH01160043A (enExample)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5932916B2 (ja) * 1976-06-15 1984-08-11 日本電気株式会社 回路基板の製造方法
JPS6140047A (ja) * 1984-07-31 1986-02-26 Hitachi Chem Co Ltd 半導体素子搭載用パツケ−ジ

Also Published As

Publication number Publication date
JPH01160043A (ja) 1989-06-22

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