JPH01160043A - 電子部品塔載用基板の製造方法 - Google Patents
電子部品塔載用基板の製造方法Info
- Publication number
- JPH01160043A JPH01160043A JP31995887A JP31995887A JPH01160043A JP H01160043 A JPH01160043 A JP H01160043A JP 31995887 A JP31995887 A JP 31995887A JP 31995887 A JP31995887 A JP 31995887A JP H01160043 A JPH01160043 A JP H01160043A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- metal
- insulating
- holes
- filling layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 title abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 94
- 239000002184 metal Substances 0.000 claims abstract description 94
- 239000004020 conductor Substances 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000005553 drilling Methods 0.000 claims abstract description 6
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims description 25
- 238000011049 filling Methods 0.000 claims description 23
- 238000006073 displacement reaction Methods 0.000 claims description 11
- 239000011810 insulating material Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 15
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052725 zinc Inorganic materials 0.000 abstract description 3
- 239000011701 zinc Substances 0.000 abstract description 3
- 239000011162 core material Substances 0.000 description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 239000010949 copper Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010828 elution Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012784 inorganic fiber Substances 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- -1 and Co. Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 208000031513 cyst Diseases 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011549 displacement method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31995887A JPH01160043A (ja) | 1987-12-16 | 1987-12-16 | 電子部品塔載用基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31995887A JPH01160043A (ja) | 1987-12-16 | 1987-12-16 | 電子部品塔載用基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01160043A true JPH01160043A (ja) | 1989-06-22 |
| JPH0548958B2 JPH0548958B2 (enExample) | 1993-07-22 |
Family
ID=18116147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31995887A Granted JPH01160043A (ja) | 1987-12-16 | 1987-12-16 | 電子部品塔載用基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01160043A (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52153160A (en) * | 1976-06-15 | 1977-12-20 | Nippon Electric Co | Method of producing circuit substrate |
| JPS6140047A (ja) * | 1984-07-31 | 1986-02-26 | Hitachi Chem Co Ltd | 半導体素子搭載用パツケ−ジ |
-
1987
- 1987-12-16 JP JP31995887A patent/JPH01160043A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52153160A (en) * | 1976-06-15 | 1977-12-20 | Nippon Electric Co | Method of producing circuit substrate |
| JPS6140047A (ja) * | 1984-07-31 | 1986-02-26 | Hitachi Chem Co Ltd | 半導体素子搭載用パツケ−ジ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0548958B2 (enExample) | 1993-07-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4993148A (en) | Method of manufacturing a circuit board | |
| CN1082332C (zh) | 多层印刷电路板 | |
| US3352730A (en) | Method of making multilayer circuit boards | |
| JP3297879B2 (ja) | 連続して形成した集積回路パッケージ | |
| US6555762B2 (en) | Electronic package having substrate with electrically conductive through holes filled with polymer and conductive composition | |
| US10818428B1 (en) | Inductor built-in substrate | |
| US11521786B2 (en) | Inductor built-in substrate | |
| US20210195748A1 (en) | Inductor built-in substrate | |
| JP2006339609A (ja) | 配線基板およびその製造方法 | |
| US11322301B2 (en) | Method for manufacturing inductor built-in substrate | |
| JP4863559B2 (ja) | プリント配線板及びプリント配線板の製造方法 | |
| US20200335257A1 (en) | Inductor built-in substrate | |
| JPH01160043A (ja) | 電子部品塔載用基板の製造方法 | |
| JPH0413874B2 (enExample) | ||
| TW201639089A (zh) | 晶片封裝結構的製作方法 | |
| JP3346216B2 (ja) | プリント配線板 | |
| JPH0883971A (ja) | プリント配線板用の穴埋めインク | |
| JP5311656B2 (ja) | 配線基板 | |
| CN115226304A (zh) | 电路板及其制造方法 | |
| JP3967989B2 (ja) | 半田バンプ付き配線基板の製造方法 | |
| JP3346215B2 (ja) | プリント配線板及びその製造方法 | |
| JPH01319995A (ja) | 電子部品搭載用基板及びその製造方法 | |
| JP2676107B2 (ja) | 電子部品搭載用基板 | |
| JP4614528B2 (ja) | 配線基板の製造方法 | |
| JP2006156879A (ja) | 端面電極を形成する配線基板 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080722 Year of fee payment: 15 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080722 Year of fee payment: 15 |