CN1193932A - 抛光垫 - Google Patents

抛光垫 Download PDF

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Publication number
CN1193932A
CN1193932A CN96196447A CN96196447A CN1193932A CN 1193932 A CN1193932 A CN 1193932A CN 96196447 A CN96196447 A CN 96196447A CN 96196447 A CN96196447 A CN 96196447A CN 1193932 A CN1193932 A CN 1193932A
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sheet material
pad
uniform polymeric
polymeric sheet
described pad
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CN1068814C (zh
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约翰V·H·罗勃特斯
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Rohm and Haas Electronic Materials CMP Holdings Inc
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RODER CO Ltd
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/60—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of tools not covered by the preceding subgroups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block

Abstract

提供了一种用于抛光硅晶片用之机械的垫,当抛光晶片时,该垫可进行晶片表面状态之探测。这借由在不具有吸收或传送淤浆粒子能力之固态均匀聚合物片材上建构一完整或部分之垫,且其可为用光学方法探测晶片表面状态之光所通过来完成。适用于建构这种垫的聚合物系可为190至3500nm波长之光线所通过。

Description

抛光垫
本发明涉及用于玻璃、半导体、介电/金属复合材料及集成电路等物件上以产生一平滑超平坦之表面的垫，更具体地涉及这种垫之宏观结构和允许当抛光或整平过程中光学就地终端检测的能力。
在多层集成电路制造中，需要使为半导体晶片形态之集成电路结构整平。整平操作必须十分精确，以提供特定平面小如几分之一微米之晶片表面。其通常借由CMP(即化学机械抛光)来完成，在这装置上通常包含一通常为圆形之旋转桌，其上固定一抛光垫，一晶片载体以将晶片平坦地压至抛光垫上、以及一以淤浆形式供应至抛光垫之化学品及摩蚀剂的工件。抛光薄、平之半导体晶片的装置为本专业已知的。这类整平装置为IPECPlanar、Strausbaugh Manufacturing及SpeedFam Corporation所制造。
当在这类装置上将半导体晶片整平所遇到的特定问题在于决定晶片是否已抛光至所要之平坦程度。该专业中所示之大部分终端检测方法依靠当移除一重叠层时，晶片表面结构之变化。因此，无法测得平面度，只得退而考虑重叠层的移除。在US5,036,015中，系改变显示一端点之介于晶片与抛光垫之间之磨擦力。在US5,240,552中，借由反射音波之分析测量晶片的厚度。在US5,337,015中，沿在抛光垫下之专门电极和电气接地的抛光桌，以及导电淤浆之使用使得介电层之厚度得以被测量。这类供就地厚度测量之装置非常复杂，且依赖特定电子电路以完成测试。更通常，不使用复杂之就地方法，而将晶片自抛光装置移下，并使用一测量氧化物薄膜厚度之光谱设备以测量其平面度。通常，在达到预期之端点前，将晶片自抛光设备上移下，如此，不致产生多余之抛光，随后，将晶片重新插入抛光机械中以抛光至所需之程度。
US5,081,796显示一位于抛光机械之抛光边缘外以承载晶片之方式及装置，使得如一激光干涉计之测量氧化层的快速方法可用于晶片之下方。这方法有在任何特定时间由抛光过程去除部分晶片的缺点，使得晶片无法受到均匀之抛光。其对于示于US5,413,941中用于半导体整平抛光过程之光学端点探测方法同样合适。非常有必要有一种机器，晶片在整个连续抛光状态下可应用这类激光测量。
本发明提供了一种用于抛光硅晶片用之机械的垫，当抛光晶片时，该垫可进行晶片表面状态进行光学测量。其是借由在不具有吸收或传送淤浆粒子能力之固态均匀聚合物片材建构一完整或部分之垫，且其可为用光学方法探测晶片表面状态之光所通过来完成。适用于建构此种垫之聚合物系可为190至3500nm波长之光线所通过。
现在用于硅晶片抛光用之抛光垫系由固体均匀聚合物片材制成。在US5,489,233中有说明，其为本说明书部分之参考。固体均匀聚合物片材不具吸收或传送淤浆粒子之能力。这一无法吸收或传送淤浆粒子之能力可区分由固体均匀聚合物片材所制成抛光垫之宏观性质及任何已知的抛光垫之宏观性质。所有现有技术之垫的宏观结构为纤维所制成，含有填充以微小球体或制造中进气所造成之孔隙，或是填充有研磨料。尽管现有技术之垫可为固体聚合物所制成，但是它们的非均匀结构并会严重地散射任何照射于其上之光线，使它们具有不为光线通过之巨观结构。用于本发明之聚合物片材表面设有宏观及细微的沟槽以将固态均匀片材送入一良好之抛光垫中。如US5,489,233所指出，这种垫可为包含聚氨酯、聚丙烯、聚碳酸酯、尼龙及聚酯等之任何固体均匀聚合物所制成。由于它们为具190至3500nm之波长范围之光可通过的聚合物所制成，而制成可使用如干涉计之就地端点探测的光学方法之垫。
对制造聚合物片材方法如浇注或挤压方法的本专业技术人员可制成透光垫。聚合物可为热塑性材料，将其加热至一可流动之温度随后借由浇注或挤出等方法成形。垫材料可为与一反应成分一起混合而在模具中加热至其固化温度的热固性材料。当浇注之片材可到达说明书中所需之厚度时，片材可用于抛光操作，另外，垫片可由浇注之聚合物切成薄片。
若希望在不透明垫上获得一透光视窗，一种可能的制造方法为，以透光聚合物浇注成形为一棍或塞。当在模具中之不透明聚合物仍为流动态时，将成形件插入，可确保透光塞与不透光聚合物之间的完全接触。在不透光聚合物固化后，可加以除模，故具透光视窗的垫使用之片材可由成形件切成片。
如US5,489,233所示，用于集成电路晶片之化学机械抛光垫为一聚合物片材所制成，该片材不具吸收或传送淤浆粒子之能力，在使用时，该垫须具有含大小流道之表面纹理及图案。因此，当透过抛光垫之透明部分，进行就地光学检测时，这些流体槽上之少部分淤浆会造成某些干扰。这些干扰可以补偿。由于在流体槽之淤浆是相对固定，当测量晶片表面之变化时，可自信号中将其作用排除。
同样可以将视窗插入任何目前所用于集成电路晶片化学机械抛光之抛光垫。此种垫之实例如氨基甲酸乙酯浸渍之聚酯垫、市售之微孔氨基甲酸乙酯垫如Delaware州的Newark市，Rodel公司之Politex，及Delaware州Newark市，Rodel公司所制之如IC系列及MH系列的充填及/或吹制的复合氨基甲酸乙酯，此种垫非由本身不具吸收或传送淤浆粒子能力之固体聚合体片材所制成，它们借由含孔性可传送淤浆。此种垫及所插入之固体透光聚合体之塞可切出孔洞，以作为端点检测之视窗。最好，固体聚合物塞之表面具有如US5,489,233所述之表面纹理或图案，使得在其整个抛光垫表面之抛光作用接近均匀。
除以上所提及之聚合物(聚氨酯、丙烯、聚碳酸酯、尼龙及聚酯)外，可由聚氯乙烯、聚偏氟乙烯、聚醚嗍、聚苯乙烯、聚乙烯及聚四氯乙烯等制成透明视窗。此类视窗可借由聚合物之铸造或挤出，随后把聚合物切成所需厚度及尺寸。

Claims (8)

1.一种用于抛光集成电路晶片之垫，该垫具至少一部分由不具吸收或传送淤浆粒子之固体聚合物均匀片材所组成，所述的聚合物片材可为波长在190至3500nm范围间之光所通过。
2.按照权利要求1所述的垫，其特征在于所述的均匀聚合物片材具有包含大、小流体槽之表面纹理及图案，所述的槽允许含粒子之抛光淤浆通过该表面，所述的表面纹理及图案系单由作用于该固体均匀聚合物片材之表面的外部装置制成。
3.按照权利要求1所述的垫，其中特征在于所述的垫含一由所述的透光均匀聚合物片材所组成之第一部分，以及由微孔聚氨酯结构所组成之第二部分。
4.按照权利要求2所述的垫，其特征在于所述的垫含一由所述的透光均匀聚合物片材所组成之第一部分，以及由微孔聚氨酯结构所组成之第二部分。
5.按照权利要求1所述的垫，其特征在于所述的垫含一由所述的透光均匀聚合物片材所组成之第一部分，以及由充填或吹制的复合聚氨酯所组成之第二部分。
6.按照权利要求2所述的垫，其特征在于所述的垫含一由所述的透光均匀聚合物片材所组成之第一部分，以及由充填或吹制的复合聚氨酯所组成之第二部分。
7.按照权利要求1所述的垫，其特征在于所述的垫含一由所述的透光均匀聚合物片材所组成之第一部分，以及由不具吸收或传送淤浆粒子能力之固体均匀聚合物所组成的第二部分，所述的第二部分具有含大小流道之表面纹理及图案，所述的流槽可用以传送含粒子之抛光淤浆，所述的表面纹理系单由作用于所述的均匀聚合物片材之表面的外部装置所制成。
8.按照权利要求2所述的垫，其特征在于所述的垫含一由所述的透光均匀聚合物片材所组成之第一部分，以及由不具吸收或或传送淤浆粒子能力之固体均匀聚合物所组成的第二部分，所述的第二部分具有含大小流道之表面纹理及图案，所述的流槽可用以传送含粒子之抛光淤浆，所述的表面纹理系单由作用于所述的均匀聚合物片材之表面的外部装置所制成。
CN96196447A 1995-08-21 1996-08-20 抛光垫 Expired - Lifetime CN1068814C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/517,578 US5605760A (en) 1995-08-21 1995-08-21 Polishing pads
US08/517,578 1995-08-21

Publications (2)

Publication Number Publication Date
CN1193932A true CN1193932A (zh) 1998-09-23
CN1068814C CN1068814C (zh) 2001-07-25

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US (1) US5605760A (zh)
EP (2) EP0846040A4 (zh)
JP (5) JP3691852B2 (zh)
KR (1) KR100422603B1 (zh)
CN (1) CN1068814C (zh)
TW (1) TW340082B (zh)
WO (1) WO1997006921A1 (zh)

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TWI616277B (zh) * 2014-04-29 2018-03-01 羅門哈斯電子材料Ｃｍｐ控股公司 具終點偵測窗之化學機械硏磨墊

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TWI616277B (zh) * 2014-04-29 2018-03-01 羅門哈斯電子材料Ｃｍｐ控股公司 具終點偵測窗之化學機械硏磨墊
CN105711015A (zh) * 2014-12-19 2016-06-29 罗门哈斯电子材料Cmp控股股份有限公司 粘度受控的cmp浇注方法
CN105711015B (zh) * 2014-12-19 2018-06-15 罗门哈斯电子材料Cmp控股股份有限公司 粘度受控的cmp浇注方法

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EP0846040A1 (en) 1998-06-10
JP4714715B2 (ja) 2011-06-29
KR19990044003A (ko) 1999-06-25
TW340082B (en) 1998-09-11
WO1997006921A1 (en) 1997-02-27
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CN1068814C (zh) 2001-07-25

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