TW340082B - Pad used for polishing IC wafers - Google Patents

Pad used for polishing IC wafers

Info

Publication number
TW340082B
TW340082B TW085110408A TW85110408A TW340082B TW 340082 B TW340082 B TW 340082B TW 085110408 A TW085110408 A TW 085110408A TW 85110408 A TW85110408 A TW 85110408A TW 340082 B TW340082 B TW 340082B
Authority
TW
Taiwan
Prior art keywords
wafers
polishing
pad used
pad
polymer plates
Prior art date
Application number
TW085110408A
Other languages
English (en)
Inventor
V H Roberts John
Original Assignee
Rodel Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24060375&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW340082(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rodel Inc filed Critical Rodel Inc
Application granted granted Critical
Publication of TW340082B publication Critical patent/TW340082B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
    • B24B3/60—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of tools not covered by the preceding subgroups
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31—Surface property or characteristic of web, sheet or block
TW085110408A 1995-08-21 1996-08-27 Pad used for polishing IC wafers TW340082B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/517,578 US5605760A (en) 1995-08-21 1995-08-21 Polishing pads

Publications (1)

Publication Number Publication Date
TW340082B true TW340082B (en) 1998-09-11

Family

ID=24060375

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085110408A TW340082B (en) 1995-08-21 1996-08-27 Pad used for polishing IC wafers

Country Status (7)

Country Link
US (1) US5605760A (zh)
EP (2) EP0846040A4 (zh)
JP (5) JP3691852B2 (zh)
KR (1) KR100422603B1 (zh)
CN (1) CN1068814C (zh)
TW (1) TW340082B (zh)
WO (1) WO1997006921A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US11090778B2 (en) 2012-04-02 2021-08-17 Thomas West, Inc. Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods

Families Citing this family (214)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5733171A (en) * 1996-07-18 1998-03-31 Speedfam Corporation Apparatus for the in-process detection of workpieces in a CMP environment
US5823853A (en) * 1996-07-18 1998-10-20 Speedfam Corporation Apparatus for the in-process detection of workpieces with a monochromatic light source
US6614529B1 (en) 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US7037403B1 (en) * 1992-12-28 2006-05-02 Applied Materials Inc. In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization
US6719818B1 (en) 1995-03-28 2004-04-13 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US6537133B1 (en) * 1995-03-28 2003-03-25 Applied Materials, Inc. Method for in-situ endpoint detection for chemical mechanical polishing operations
US6676717B1 (en) 1995-03-28 2004-01-13 Applied Materials Inc Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
DE69635816T2 (de) * 1995-03-28 2006-10-12 Applied Materials, Inc., Santa Clara Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
US6876454B1 (en) * 1995-03-28 2005-04-05 Applied Materials, Inc. Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations
US5893796A (en) * 1995-03-28 1999-04-13 Applied Materials, Inc. Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus
JPH09254027A (ja) * 1996-03-25 1997-09-30 Chiyoda Kk 研磨用マウンテン材
US6074287A (en) * 1996-04-12 2000-06-13 Nikon Corporation Semiconductor wafer polishing apparatus
US6328642B1 (en) 1997-02-14 2001-12-11 Lam Research Corporation Integrated pad and belt for chemical mechanical polishing
US6287185B1 (en) * 1997-04-04 2001-09-11 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6682402B1 (en) * 1997-04-04 2004-01-27 Rodel Holdings, Inc. Polishing pads and methods relating thereto
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
US6146248A (en) 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
US6108091A (en) 1997-05-28 2000-08-22 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
US6111634A (en) * 1997-05-28 2000-08-29 Lam Research Corporation Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
US6736714B2 (en) 1997-07-30 2004-05-18 Praxair S.T. Technology, Inc. Polishing silicon wafers
TW421620B (en) * 1997-12-03 2001-02-11 Siemens Ag Device and method to control an end-point during polish of components (especially semiconductor components)
US6332470B1 (en) 1997-12-30 2001-12-25 Boris Fishkin Aerosol substrate cleaner
US6068539A (en) * 1998-03-10 2000-05-30 Lam Research Corporation Wafer polishing device with movable window
US6248000B1 (en) * 1998-03-24 2001-06-19 Nikon Research Corporation Of America Polishing pad thinning to optically access a semiconductor wafer surface
US7718102B2 (en) * 1998-06-02 2010-05-18 Praxair S.T. Technology, Inc. Froth and method of producing froth
US6514301B1 (en) 1998-06-02 2003-02-04 Peripheral Products Inc. Foam semiconductor polishing belts and pads
US6395130B1 (en) 1998-06-08 2002-05-28 Speedfam-Ipec Corporation Hydrophobic optical endpoint light pipes for chemical mechanical polishing
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
US6203407B1 (en) 1998-09-03 2001-03-20 Micron Technology, Inc. Method and apparatus for increasing-chemical-polishing selectivity
US6159073A (en) * 1998-11-02 2000-12-12 Applied Materials, Inc. Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing
US6280289B1 (en) 1998-11-02 2001-08-28 Applied Materials, Inc. Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers
JP4484370B2 (ja) 1998-11-02 2010-06-16 アプライド マテリアルズ インコーポレイテッド 基板上のメタル層の化学機械研磨に関して終点を決定するための方法及び基板のメタル層を研磨するための装置
US6908374B2 (en) 1998-12-01 2005-06-21 Nutool, Inc. Chemical mechanical polishing endpoint detection
US6190234B1 (en) 1999-01-25 2001-02-20 Applied Materials, Inc. Endpoint detection with light beams of different wavelengths
US20040082271A1 (en) * 1999-01-25 2004-04-29 Wiswesser Andreas Norbert Polishing pad with window
US6247998B1 (en) 1999-01-25 2001-06-19 Applied Materials, Inc. Method and apparatus for determining substrate layer thickness during chemical mechanical polishing
US6716085B2 (en) 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
US6994607B2 (en) * 2001-12-28 2006-02-07 Applied Materials, Inc. Polishing pad with window
US6179709B1 (en) * 1999-02-04 2001-01-30 Applied Materials, Inc. In-situ monitoring of linear substrate polishing operations
DE60039054D1 (de) 1999-03-30 2008-07-10 Nikon Corp Gt-polierkörper, poliervorrichtung, polierverfahren und verfahren zum herstellen einer halbleitervorrichtung (2002/23)
WO2000060650A1 (fr) * 1999-03-31 2000-10-12 Nikon Corporation Corps de polissage, dispositif de polissage, procede de reglage du dispositif de polissage, dispositif de mesure de l'epaisseur du film poli ou du point terminal de polissage, procede de fabrication d'un dispositif a semi-conducteur
US6217426B1 (en) 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US20040072518A1 (en) * 1999-04-02 2004-04-15 Applied Materials, Inc. Platen with patterned surface for chemical mechanical polishing
US20020077037A1 (en) * 1999-05-03 2002-06-20 Tietz James V. Fixed abrasive articles
US6146242A (en) 1999-06-11 2000-11-14 Strasbaugh, Inc. Optical view port for chemical mechanical planarization endpoint detection
US6224460B1 (en) 1999-06-30 2001-05-01 Vlsi Technology, Inc. Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process
US6171181B1 (en) 1999-08-17 2001-01-09 Rodel Holdings, Inc. Molded polishing pad having integral window
DE10084915C2 (de) * 1999-08-27 2003-12-24 Asahi Chemical Ind Polierkissen und Poliervorrichtung
US6406363B1 (en) 1999-08-31 2002-06-18 Lam Research Corporation Unsupported chemical mechanical polishing belt
US6524164B1 (en) 1999-09-14 2003-02-25 Applied Materials, Inc. Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
US6671051B1 (en) 1999-09-15 2003-12-30 Kla-Tencor Apparatus and methods for detecting killer particles during chemical mechanical polishing
US6299516B1 (en) 1999-09-28 2001-10-09 Applied Materials, Inc. Substrate polishing article
US20020068516A1 (en) * 1999-12-13 2002-06-06 Applied Materials, Inc Apparatus and method for controlled delivery of slurry to a region of a polishing device
US6399501B2 (en) * 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
US6241596B1 (en) 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
US6607428B2 (en) 2000-01-18 2003-08-19 Applied Materials, Inc. Material for use in carrier and polishing pads
US6533645B2 (en) 2000-01-18 2003-03-18 Applied Materials, Inc. Substrate polishing article
US6623341B2 (en) 2000-01-18 2003-09-23 Applied Materials, Inc. Substrate polishing apparatus
US6506097B1 (en) 2000-01-18 2003-01-14 Applied Materials, Inc. Optical monitoring in a two-step chemical mechanical polishing process
US6383058B1 (en) 2000-01-28 2002-05-07 Applied Materials, Inc. Adaptive endpoint detection for chemical mechanical polishing
US6309276B1 (en) 2000-02-01 2001-10-30 Applied Materials, Inc. Endpoint monitoring with polishing rate change
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
KR20020084150A (ko) 2000-02-25 2002-11-04 로델 홀딩스 인코포레이티드 투명부를 갖는 연마 패드
US6860793B2 (en) 2000-03-15 2005-03-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Window portion with an adjusted rate of wear
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
US8485862B2 (en) 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US6561891B2 (en) 2000-05-23 2003-05-13 Rodel Holdings, Inc. Eliminating air pockets under a polished pad
US6749485B1 (en) 2000-05-27 2004-06-15 Rodel Holdings, Inc. Hydrolytically stable grooved polishing pads for chemical mechanical planarization
US6736709B1 (en) 2000-05-27 2004-05-18 Rodel Holdings, Inc. Grooved polishing pads for chemical mechanical planarization
US6685537B1 (en) * 2000-06-05 2004-02-03 Speedfam-Ipec Corporation Polishing pad window for a chemical mechanical polishing tool
JP2002001647A (ja) * 2000-06-19 2002-01-08 Rodel Nitta Co 研磨パッド
US6495464B1 (en) 2000-06-30 2002-12-17 Lam Research Corporation Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
WO2002002274A2 (en) 2000-06-30 2002-01-10 Rodel Holdings, Inc. Base-pad for a polishing pad
US6878038B2 (en) 2000-07-10 2005-04-12 Applied Materials Inc. Combined eddy current sensing and optical monitoring for chemical mechanical polishing
JP2002036129A (ja) * 2000-07-25 2002-02-05 Roki Techno Co Ltd 研磨パッド及びその製造方法
US6602724B2 (en) * 2000-07-27 2003-08-05 Applied Materials, Inc. Chemical mechanical polishing of a metal layer with polishing rate monitoring
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US7196782B2 (en) * 2000-09-20 2007-03-27 Kla-Tencor Technologies Corp. Methods and systems for determining a thin film characteristic and an electrical property of a specimen
EP1324858A1 (en) 2000-10-06 2003-07-09 Cabot Microelectronics Corporation Polishing pad comprising a filled translucent region
US6688956B1 (en) * 2000-11-29 2004-02-10 Psiloquest Inc. Substrate polishing device and method
US20020072296A1 (en) 2000-11-29 2002-06-13 Muilenburg Michael J. Abrasive article having a window system for polishing wafers, and methods
US6609961B2 (en) 2001-01-09 2003-08-26 Lam Research Corporation Chemical mechanical planarization belt assembly and method of assembly
WO2002070200A1 (en) 2001-03-01 2002-09-12 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US6863774B2 (en) * 2001-03-08 2005-03-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US6608495B2 (en) 2001-03-19 2003-08-19 Applied Materials, Inc. Eddy-optic sensor for object inspection
DE60228784D1 (de) 2001-04-25 2008-10-23 Jsr Corp Lichtduchlässiges Polierkissen für eine Halbleiterschleife
US6966816B2 (en) * 2001-05-02 2005-11-22 Applied Materials, Inc. Integrated endpoint detection system with optical and eddy current monitoring
JP4131632B2 (ja) * 2001-06-15 2008-08-13 株式会社荏原製作所 ポリッシング装置及び研磨パッド
US20020193058A1 (en) * 2001-06-15 2002-12-19 Carter Stephen P. Polishing apparatus that provides a window
US6514775B2 (en) 2001-06-29 2003-02-04 Kla-Tencor Technologies Corporation In-situ end point detection for semiconductor wafer polishing
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2003133270A (ja) 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
US6586337B2 (en) * 2001-11-09 2003-07-01 Speedfam-Ipec Corporation Method and apparatus for endpoint detection during chemical mechanical polishing
US6811466B1 (en) * 2001-12-28 2004-11-02 Applied Materials, Inc. System and method for in-line metal profile measurement
US6722946B2 (en) 2002-01-17 2004-04-20 Nutool, Inc. Advanced chemical mechanical polishing system with smart endpoint detection
US6942546B2 (en) 2002-01-17 2005-09-13 Asm Nutool, Inc. Endpoint detection for non-transparent polishing member
US6878039B2 (en) 2002-01-28 2005-04-12 Speedfam-Ipec Corporation Polishing pad window for a chemical-mechanical polishing tool
US7175503B2 (en) * 2002-02-04 2007-02-13 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
US7001242B2 (en) * 2002-02-06 2006-02-21 Applied Materials, Inc. Method and apparatus of eddy current monitoring for chemical mechanical polishing
US7037184B2 (en) * 2003-01-22 2006-05-02 Raytech Innovation Solutions, Llc Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same
US6852020B2 (en) * 2003-01-22 2005-02-08 Raytech Innovative Solutions, Inc. Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same
US20030194959A1 (en) * 2002-04-15 2003-10-16 Cabot Microelectronics Corporation Sintered polishing pad with regions of contrasting density
KR20030086655A (ko) * 2002-05-06 2003-11-12 삼성전자주식회사 연마 종점을 검출하기 위한 장치 및 이를 갖는 화학적기계적 연마장치
US20040171339A1 (en) * 2002-10-28 2004-09-02 Cabot Microelectronics Corporation Microporous polishing pads
US6913517B2 (en) 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US7040957B2 (en) * 2002-08-14 2006-05-09 Novellus Systems Inc. Platen and manifold for polishing workpieces
KR100465649B1 (ko) * 2002-09-17 2005-01-13 한국포리올 주식회사 일체형 연마 패드 및 그 제조 방법
US7267607B2 (en) 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
TWI220405B (en) * 2002-11-19 2004-08-21 Iv Technologies Co Ltd Method of fabricating a polishing pad having a detection window thereon
AU2003302299A1 (en) 2002-11-27 2004-06-18 Toyo Boseki Kabushiki Kaisha Polishing pad and method for manufacturing semiconductor device
JP4620331B2 (ja) * 2003-01-31 2011-01-26 ニッタ・ハース株式会社 研磨パッド及び研磨パッドの製造方法
US7008295B2 (en) * 2003-02-04 2006-03-07 Applied Materials Inc. Substrate monitoring during chemical mechanical polishing
US6960120B2 (en) 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
US7141155B2 (en) * 2003-02-18 2006-11-28 Parker-Hannifin Corporation Polishing article for electro-chemical mechanical polishing
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
AU2004225931A1 (en) 2003-03-25 2004-10-14 Neopad Technologies Corporation Chip customized polish pads for chemical mechanical planarization (CMP)
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US20060199473A1 (en) * 2003-04-03 2006-09-07 Masao Suzuki Polishing pad, process for producing the same and method of polishing therewith
JP2004319584A (ja) * 2003-04-11 2004-11-11 Nihon Micro Coating Co Ltd 研磨パッド及びその製造方法
US7238097B2 (en) * 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
US20040209066A1 (en) * 2003-04-17 2004-10-21 Swisher Robert G. Polishing pad with window for planarization
US6997777B2 (en) 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
EP1498222B1 (en) 2003-07-17 2014-12-17 JSR Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
US7097537B1 (en) 2003-08-18 2006-08-29 Applied Materials, Inc. Determination of position of sensor measurements during polishing
US7153185B1 (en) 2003-08-18 2006-12-26 Applied Materials, Inc. Substrate edge detection
US7195539B2 (en) * 2003-09-19 2007-03-27 Cabot Microelectronics Coporation Polishing pad with recessed window
US7264536B2 (en) * 2003-09-23 2007-09-04 Applied Materials, Inc. Polishing pad with window
US20050173259A1 (en) * 2004-02-06 2005-08-11 Applied Materials, Inc. Endpoint system for electro-chemical mechanical polishing
US8066552B2 (en) * 2003-10-03 2011-11-29 Applied Materials, Inc. Multi-layer polishing pad for low-pressure polishing
US7186651B2 (en) * 2003-10-30 2007-03-06 Texas Instruments Incorporated Chemical mechanical polishing method and apparatus
US6984163B2 (en) * 2003-11-25 2006-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with high optical transmission window
US7132033B2 (en) * 2004-02-27 2006-11-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a layered polishing pad
CN1926666A (zh) 2004-03-11 2007-03-07 东洋橡胶工业株式会社 研磨垫及半导体器件的制造方法
US7204742B2 (en) * 2004-03-25 2007-04-17 Cabot Microelectronics Corporation Polishing pad comprising hydrophobic region and endpoint detection port
CN100424830C (zh) 2004-04-23 2008-10-08 Jsr株式会社 用于抛光半导体晶片的抛光垫、层叠体和方法
US7018581B2 (en) * 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
US7252871B2 (en) * 2004-06-16 2007-08-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad having a pressure relief channel
US7120553B2 (en) * 2004-07-22 2006-10-10 Applied Materials, Inc. Iso-reflectance wavelengths
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7871309B2 (en) 2004-12-10 2011-01-18 Toyo Tire & Rubber Co., Ltd. Polishing pad
US7182677B2 (en) * 2005-01-14 2007-02-27 Applied Materials, Inc. Chemical mechanical polishing pad for controlling polishing slurry distribution
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US20070037487A1 (en) * 2005-08-10 2007-02-15 Kuo Charles C Polishing pad having a sealed pressure relief channel
US7210980B2 (en) 2005-08-26 2007-05-01 Applied Materials, Inc. Sealed polishing pad, system and methods
JP5223336B2 (ja) * 2006-02-06 2013-06-26 東レ株式会社 研磨パッドおよび研磨装置
US20070197145A1 (en) * 2006-02-15 2007-08-23 Applied Materials, Inc. Polishing article with window stripe
US20070212979A1 (en) * 2006-03-09 2007-09-13 Rimpad Tech Ltd. Composite polishing pad
KR101061145B1 (ko) 2006-04-19 2011-08-31 도요 고무 고교 가부시키가이샤 연마 패드의 제조 방법
JP2007307639A (ja) * 2006-05-17 2007-11-29 Toyo Tire & Rubber Co Ltd 研磨パッド
JP5110677B2 (ja) * 2006-05-17 2012-12-26 東洋ゴム工業株式会社 研磨パッド
JP4931133B2 (ja) * 2007-03-15 2012-05-16 東洋ゴム工業株式会社 研磨パッド
JP4971028B2 (ja) * 2007-05-16 2012-07-11 東洋ゴム工業株式会社 研磨パッドの製造方法
JP4943233B2 (ja) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法
DE102008045216A1 (de) 2007-08-23 2009-04-09 Technische Universität Dresden Verfahren und Anordnung zum Erkennen des Endpunktes beim Polieren von eingebetteten SiN-Strukturen auf Halbleiterwafern
US8337278B2 (en) * 2007-09-24 2012-12-25 Applied Materials, Inc. Wafer edge characterization by successive radius measurements
EP2227350A4 (en) * 2007-11-30 2011-01-12 Innopad Inc CUSHION WITH FINISHED MOUNTING WINDOW FOR CHEMICAL-MECHANICAL POLISHING
US20090305610A1 (en) * 2008-06-06 2009-12-10 Applied Materials, Inc. Multiple window pad assembly
US7967661B2 (en) * 2008-06-19 2011-06-28 Micron Technology, Inc. Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture
JP5142866B2 (ja) * 2008-07-16 2013-02-13 富士紡ホールディングス株式会社 研磨パッド
US8118644B2 (en) * 2008-10-16 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having integral identification feature
US8118641B2 (en) * 2009-03-04 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having window with integral identification feature
US8257544B2 (en) 2009-06-10 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having a low defect integral window
US9017140B2 (en) 2010-01-13 2015-04-28 Nexplanar Corporation CMP pad with local area transparency
US8697217B2 (en) 2010-01-15 2014-04-15 Rohm and Haas Electronics Materials CMP Holdings, Inc. Creep-resistant polishing pad window
US9156124B2 (en) 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8257545B2 (en) 2010-09-29 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith
US8758659B2 (en) 2010-09-29 2014-06-24 Fns Tech Co., Ltd. Method of grooving a chemical-mechanical planarization pad
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
WO2012068428A2 (en) * 2010-11-18 2012-05-24 Cabot Microelectronics Corporation Polishing pad comprising transmissive region
KR101277296B1 (ko) 2011-07-15 2013-06-20 주식회사 엘지화학 폴리우레탄 수지 조성물 및 이를 이용한 폴리우레탄 흡착 패드
US9133299B2 (en) 2011-07-15 2015-09-15 Lg Chem, Ltd. Poly-urethane resin and poly-urethane absorbing pad using the same
CN102248462A (zh) * 2011-07-25 2011-11-23 成都光明光电股份有限公司 抛光磨具
US9156125B2 (en) 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
US20140256231A1 (en) 2013-03-07 2014-09-11 Dow Global Technologies Llc Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window
US9186772B2 (en) 2013-03-07 2015-11-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith
US9216489B2 (en) 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9064806B1 (en) 2014-03-28 2015-06-23 Rohm and Haas Electronics Materials CMP Holdings, Inc. Soft and conditionable chemical mechanical polishing pad with window
US9259820B2 (en) 2014-03-28 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with polishing layer and window
US9333620B2 (en) 2014-04-29 2016-05-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with clear endpoint detection window
US9314897B2 (en) 2014-04-29 2016-04-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259821B2 (en) * 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
CN107078048B (zh) 2014-10-17 2021-08-13 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US9452507B2 (en) * 2014-12-19 2016-09-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled-viscosity CMP casting method
US9446498B1 (en) 2015-03-13 2016-09-20 rohm and Hass Electronic Materials CMP Holdings, Inc. Chemical mechanical polishing pad with window
US9475168B2 (en) 2015-03-26 2016-10-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad window
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10596763B2 (en) 2017-04-21 2020-03-24 Applied Materials, Inc. Additive manufacturing with array of energy sources
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US10898986B2 (en) 2017-09-15 2021-01-26 Applied Materials, Inc. Chattering correction for accurate sensor position determination on wafer
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11638979B2 (en) 2020-06-09 2023-05-02 Applied Materials, Inc. Additive manufacturing of polishing pads
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11633830B2 (en) 2020-06-24 2023-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. CMP polishing pad with uniform window
US20220203495A1 (en) 2020-12-29 2022-06-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cmp polishing pad with window having transparency at low wavelengths and material useful in such window
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
WO2022202059A1 (ja) * 2021-03-24 2022-09-29 富士紡ホールディングス株式会社 研磨パッドの製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
JPH01193166A (ja) * 1988-01-28 1989-08-03 Showa Denko Kk 半導体ウェハ鏡面研磨用パッド
JP2734007B2 (ja) * 1988-10-07 1998-03-30 ソニー株式会社 研磨装置および研磨方法
JPH02218561A (ja) * 1989-02-15 1990-08-31 Fujimi Kenmazai Kogyo Kk 研磨布の製造法
JPH03213265A (ja) * 1990-01-12 1991-09-18 Fujitsu Ltd ラップ盤の定盤
US5177908A (en) * 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5020283A (en) * 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5081796A (en) * 1990-08-06 1992-01-21 Micron Technology, Inc. Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer
US5036015A (en) * 1990-09-24 1991-07-30 Micron Technology, Inc. Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers
US5240552A (en) * 1991-12-11 1993-08-31 Micron Technology, Inc. Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection
WO1993020976A1 (en) * 1992-04-13 1993-10-28 Minnesota Mining And Manufacturing Company Abrasive article
JP2770101B2 (ja) * 1992-05-08 1998-06-25 コマツ電子金属株式会社 貼り合わせウェーハの研磨方法
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5337015A (en) * 1993-06-14 1994-08-09 International Business Machines Corporation In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage
JP3326443B2 (ja) * 1993-08-10 2002-09-24 株式会社ニコン ウエハ研磨方法及びその装置
US5413941A (en) * 1994-01-06 1995-05-09 Micron Technology, Inc. Optical end point detection methods in semiconductor planarizing polishing processes
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
DE69635816T2 (de) * 1995-03-28 2006-10-12 Applied Materials, Inc., Santa Clara Verfahren zum Herstellen einer Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen
JP2003145414A (ja) * 2001-11-13 2003-05-20 Toyobo Co Ltd 研磨パッド及びその製造方法
JP4420761B2 (ja) * 2004-07-27 2010-02-24 日華化学株式会社 研磨用シートの製造方法及び研磨用シート
JP2007063323A (ja) * 2005-08-29 2007-03-15 Dainippon Ink & Chem Inc 研磨パッド用ポリウレタン組成物及びそれを用いた研磨パッド
JP4971028B2 (ja) * 2007-05-16 2012-07-11 東洋ゴム工業株式会社 研磨パッドの製造方法
JP4943233B2 (ja) * 2007-05-31 2012-05-30 東洋ゴム工業株式会社 研磨パッドの製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10022842B2 (en) 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
US11090778B2 (en) 2012-04-02 2021-08-17 Thomas West, Inc. Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods
US11219982B2 (en) 2012-04-02 2022-01-11 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material

Also Published As

Publication number Publication date
KR100422603B1 (ko) 2004-05-31
JP4019087B2 (ja) 2007-12-05
EP0846040A4 (en) 1998-09-30
JP2012109616A (ja) 2012-06-07
JP5461603B2 (ja) 2014-04-02
JP2007313645A (ja) 2007-12-06
JP5016655B2 (ja) 2012-09-05
JP3691852B2 (ja) 2005-09-07
JP2010017848A (ja) 2010-01-28
EP1281477A1 (en) 2003-02-05
JP2005210143A (ja) 2005-08-04
EP0846040A1 (en) 1998-06-10
CN1193932A (zh) 1998-09-23
JP4714715B2 (ja) 2011-06-29
KR19990044003A (ko) 1999-06-25
WO1997006921A1 (en) 1997-02-27
US5605760A (en) 1997-02-25
JPH11512977A (ja) 1999-11-09
CN1068814C (zh) 2001-07-25

Similar Documents

Publication Publication Date Title
TW340082B (en) Pad used for polishing IC wafers
TW340257B (en) Semiconductor device and process thereof
TW350106B (en) Semiconductor elements and the manufacturing method
MY135955A (en) Polishing composition
TW350970B (en) Wafer transfer apparatus
EP0734065A3 (en) Semiconductor device having a chip size
MY105224A (en) Catalysts for the polymerization of olefins.
FR2717727B1 (fr) Appareil de dressage pour plateau de polissage de plaquettes.
TW324847B (en) The structure of composite bump
EP0723294A3 (en) Semiconductor device comprising a contact pad and method of manufacturing the device
SG87786A1 (en) Ethylene/alpha-olefin copolymer and process for preparing the same
ZA973117B (en) Reduced oil snack chip process.
GR3015108T3 (en) Device for sorting chips at game-tables.
FR2707194B1 (fr) Dispositif pour l'enlèvement de copeaux.
TW345726B (en) Semiconductor chip, semiconductor device having such semiconductor chip installed therein, and method for making the semiconductor device
MY129258A (en) Polyurethane elastomers
WO1999057140A3 (en) Growth-associated protease inhibitor heavy chain precursor
EP0739877A3 (en) Epoxy resin, resin composition and resin-encapsulated semiconductor device
MXPA03011306A (es) Metodos para la preparacion y uso de 1a,24 (s) - hidroxivitamina d2.
TW350101B (en) A semiconductor device grinding method
IL129182A0 (en) Slotline-mounted flip chip
EP0406211A3 (en) Fucosidase inhibitors
TW336321B (en) Fuse-refresh-circuit for semiconductor memory-arrangement
AU9007198A (en) A clay-containing mixture of dry solids to be used in forming a moisture resistant gel and method for treating surface
EP0697731A3 (en) Flat package for semiconductor integrated circuit

Legal Events

Date Code Title Description
MC4A Revocation of granted patent
MC4A Revocation of granted patent