FR2717727B1 - Appareil de dressage pour plateau de polissage de plaquettes. - Google Patents

Appareil de dressage pour plateau de polissage de plaquettes.

Info

Publication number
FR2717727B1
FR2717727B1 FR9503353A FR9503353A FR2717727B1 FR 2717727 B1 FR2717727 B1 FR 2717727B1 FR 9503353 A FR9503353 A FR 9503353A FR 9503353 A FR9503353 A FR 9503353A FR 2717727 B1 FR2717727 B1 FR 2717727B1
Authority
FR
France
Prior art keywords
polishing plate
wafer polishing
dressing device
dressing
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9503353A
Other languages
English (en)
Other versions
FR2717727A1 (fr
Inventor
Katsumi Mogi
Osamu Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of FR2717727A1 publication Critical patent/FR2717727A1/fr
Application granted granted Critical
Publication of FR2717727B1 publication Critical patent/FR2717727B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
FR9503353A 1994-03-23 1995-03-22 Appareil de dressage pour plateau de polissage de plaquettes. Expired - Fee Related FR2717727B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5227594A JP3036348B2 (ja) 1994-03-23 1994-03-23 ウェーハ研磨パッドのツルーイング装置

Publications (2)

Publication Number Publication Date
FR2717727A1 FR2717727A1 (fr) 1995-09-29
FR2717727B1 true FR2717727B1 (fr) 1996-07-26

Family

ID=12910243

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9503353A Expired - Fee Related FR2717727B1 (fr) 1994-03-23 1995-03-22 Appareil de dressage pour plateau de polissage de plaquettes.

Country Status (4)

Country Link
US (1) US5531635A (fr)
JP (1) JP3036348B2 (fr)
KR (1) KR100252820B1 (fr)
FR (1) FR2717727B1 (fr)

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JPH08281550A (ja) * 1995-04-14 1996-10-29 Sony Corp 研磨装置及びその補正方法
JP3678468B2 (ja) * 1995-07-18 2005-08-03 株式会社荏原製作所 ポリッシング装置
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KR970023800A (ko) * 1995-10-19 1997-05-30 마에다 시게루 폴리싱포의 드레싱방법 및 장치
US5616069A (en) * 1995-12-19 1997-04-01 Micron Technology, Inc. Directional spray pad scrubber
US5718618A (en) * 1996-02-09 1998-02-17 Wisconsin Alumni Research Foundation Lapping and polishing method and apparatus for planarizing photoresist and metal microstructure layers
US5779526A (en) * 1996-02-27 1998-07-14 Gill; Gerald L. Pad conditioner
TW355153B (en) * 1996-05-21 1999-04-01 Toshiba Machine Co Ltd A method for leveling abrasive cloth and device for the same
US5683289A (en) * 1996-06-26 1997-11-04 Texas Instruments Incorporated CMP polishing pad conditioning apparatus
US5833519A (en) * 1996-08-06 1998-11-10 Micron Technology, Inc. Method and apparatus for mechanical polishing
JPH10128654A (ja) * 1996-10-31 1998-05-19 Toshiba Corp Ｃｍｐ装置及び該ｃｍｐ装置に用いることのできる研磨布
JPH10329012A (ja) * 1997-03-21 1998-12-15 Canon Inc 研磨装置および研磨方法
US5990010A (en) * 1997-04-08 1999-11-23 Lsi Logic Corporation Pre-conditioning polishing pads for chemical-mechanical polishing
US5938506A (en) * 1997-06-03 1999-08-17 Speedfam-Ipec Corporation Methods and apparatus for conditioning grinding stones
US5961373A (en) * 1997-06-16 1999-10-05 Motorola, Inc. Process for forming a semiconductor device
US6036583A (en) * 1997-07-11 2000-03-14 Applied Materials, Inc. Conditioner head in a substrate polisher and method
KR19990010191A (ko) * 1997-07-15 1999-02-05 윤종용 반도체장치
US5816900A (en) * 1997-07-17 1998-10-06 Lsi Logic Corporation Apparatus for polishing a substrate at radially varying polish rates
US6004193A (en) * 1997-07-17 1999-12-21 Lsi Logic Corporation Dual purpose retaining ring and polishing pad conditioner
US6095910A (en) * 1997-11-10 2000-08-01 3M Innovative Properties Company Surface treatment article having a quick release fastener
US6142858A (en) 1997-11-10 2000-11-07 3M Innovative Properties Company Backup pad for abrasive articles
US6042457A (en) 1998-07-10 2000-03-28 Aplex, Inc. Conditioner assembly for a chemical mechanical polishing apparatus
US6033290A (en) * 1998-09-29 2000-03-07 Applied Materials, Inc. Chemical mechanical polishing conditioner
US6358124B1 (en) 1998-11-02 2002-03-19 Applied Materials, Inc. Pad conditioner cleaning apparatus
US6217430B1 (en) 1998-11-02 2001-04-17 Applied Materials, Inc. Pad conditioner cleaning apparatus
US6086460A (en) * 1998-11-09 2000-07-11 Lam Research Corporation Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization
US6283836B1 (en) * 1999-03-08 2001-09-04 Speedfam-Ipec Corporation Non-abrasive conditioning for polishing pads
US6120350A (en) * 1999-03-31 2000-09-19 Memc Electronic Materials, Inc. Process for reconditioning polishing pads
US6302771B1 (en) * 1999-04-01 2001-10-16 Philips Semiconductor, Inc. CMP pad conditioner arrangement and method therefor
JP2000343407A (ja) 1999-06-08 2000-12-12 Ebara Corp ドレッシング装置
US6331135B1 (en) * 1999-08-31 2001-12-18 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates with metal compound abrasives
US6306019B1 (en) 1999-12-30 2001-10-23 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6517416B1 (en) * 2000-01-05 2003-02-11 Agere Systems Inc. Chemical mechanical polisher including a pad conditioner and a method of manufacturing an integrated circuit using the chemical mechanical polisher
US6331136B1 (en) * 2000-01-25 2001-12-18 Koninklijke Philips Electronics N.V. (Kpenv) CMP pad conditioner arrangement and method therefor
US6626743B1 (en) 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US6616801B1 (en) 2000-03-31 2003-09-09 Lam Research Corporation Method and apparatus for fixed-abrasive substrate manufacturing and wafer polishing in a single process path
KR100502330B1 (ko) * 2000-04-29 2005-07-20 삼성에스디아이 주식회사 격벽이 마련된 기판 및 이를 이용한 플라즈마 표시장치
KR20010107277A (ko) * 2000-05-26 2001-12-07 정용마 요홈을 갖는 연마패드
US6435952B1 (en) 2000-06-30 2002-08-20 Lam Research Corporation Apparatus and method for qualifying a chemical mechanical planarization process
US6361414B1 (en) 2000-06-30 2002-03-26 Lam Research Corporation Apparatus and method for conditioning a fixed abrasive polishing pad in a chemical mechanical planarization process
US6495464B1 (en) 2000-06-30 2002-12-17 Lam Research Corporation Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
US6572446B1 (en) * 2000-09-18 2003-06-03 Applied Materials Inc. Chemical mechanical polishing pad conditioning element with discrete points and compliant membrane
JP3797861B2 (ja) 2000-09-27 2006-07-19 株式会社荏原製作所 ポリッシング装置
US6875091B2 (en) 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6554688B2 (en) 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6752698B1 (en) 2001-03-19 2004-06-22 Lam Research Corporation Method and apparatus for conditioning fixed-abrasive polishing pads
JP3963661B2 (ja) * 2001-05-10 2007-08-22 株式会社荏原製作所 無電解めっき方法及び装置
US6767427B2 (en) * 2001-06-07 2004-07-27 Lam Research Corporation Apparatus and method for conditioning polishing pad in a chemical mechanical planarization process
KR100462868B1 (ko) * 2001-06-29 2004-12-17 삼성전자주식회사 반도체 폴리싱 장치의 패드 컨디셔너
US6508697B1 (en) * 2001-07-16 2003-01-21 Robert Lyle Benner Polishing pad conditioning system
US6722943B2 (en) * 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
US6645052B2 (en) 2001-10-26 2003-11-11 Lam Research Corporation Method and apparatus for controlling CMP pad surface finish
US6884152B2 (en) * 2003-02-11 2005-04-26 Micron Technology, Inc. Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces
US7367872B2 (en) * 2003-04-08 2008-05-06 Applied Materials, Inc. Conditioner disk for use in chemical mechanical polishing
US7001827B2 (en) * 2003-04-15 2006-02-21 International Business Machines Corporation Semiconductor wafer front side protection
US7052371B2 (en) * 2003-05-29 2006-05-30 Tbw Industries Inc. Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk
US7544113B1 (en) * 2003-05-29 2009-06-09 Tbw Industries, Inc. Apparatus for controlling the forces applied to a vacuum-assisted pad conditioning system
US7160178B2 (en) * 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
JP4771811B2 (ja) * 2004-02-18 2011-09-14 豊田バンモップス株式会社 両端面ツルーイング装置及び両端面ツルーイング工具
US7125324B2 (en) * 2004-03-09 2006-10-24 3M Innovative Properties Company Insulated pad conditioner and method of using same
US6951509B1 (en) * 2004-03-09 2005-10-04 3M Innovative Properties Company Undulated pad conditioner and method of using same
JP4763389B2 (ja) * 2005-09-05 2011-08-31 株式会社ディスコ 切削工具
JP5025200B2 (ja) * 2006-09-19 2012-09-12 株式会社ディスコ 研削加工時の厚さ測定方法
US7597608B2 (en) * 2006-10-30 2009-10-06 Applied Materials, Inc. Pad conditioning device with flexible media mount
US20100203811A1 (en) * 2009-02-09 2010-08-12 Araca Incorporated Method and apparatus for accelerated wear testing of aggressive diamonds on diamond conditioning discs in cmp
JP4960395B2 (ja) * 2009-03-17 2012-06-27 株式会社東芝 研磨装置とそれを用いた半導体装置の製造方法
JP5896625B2 (ja) 2011-06-02 2016-03-30 株式会社荏原製作所 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置
US20130017762A1 (en) * 2011-07-15 2013-01-17 Infineon Technologies Ag Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine
US10058976B2 (en) 2016-11-11 2018-08-28 Att Technology, Ltd. Hardbanding removal device and method
CN111975481B (zh) * 2020-08-31 2021-11-09 杭萧钢构（河北）建设有限公司 一种钢结构管件打磨设备
CN114012605B (zh) * 2022-01-05 2022-05-17 杭州众硅电子科技有限公司 一种抛光垫修整装置

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CH352587A (de) * 1954-03-25 1961-02-28 Crane Packing Co Verfahren zum Abrichten der stirnseitigen Läppfläche einer um ihre Mittelachse drehbaren Läppscheibe
JPS57149158A (en) * 1981-03-09 1982-09-14 Fujimi Kenmazai Kogyo Kk Method of removing choke in grinding pad and dresser
CH640766A5 (en) * 1981-07-16 1984-01-31 Raymond Ansermoz Lapping machine
US4839992A (en) * 1987-12-22 1989-06-20 Sintobrator, Ltd. Polishing device
JPH0435870A (ja) * 1990-05-30 1992-02-06 Showa Alum Corp 研磨装置における研磨布の清浄装置
US5081051A (en) * 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
JPH04363022A (ja) * 1991-06-06 1992-12-15 Enya Syst:Kk 貼付板洗浄装置
JPH04364730A (ja) * 1991-06-12 1992-12-17 Hitachi Ltd 自動ドレッシング装置
US5384986A (en) * 1992-09-24 1995-01-31 Ebara Corporation Polishing apparatus
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process

Also Published As

Publication number Publication date
KR100252820B1 (ko) 2000-04-15
US5531635A (en) 1996-07-02
JP3036348B2 (ja) 2000-04-24
FR2717727A1 (fr) 1995-09-29
KR950034565A (ko) 1995-12-28
JPH07256554A (ja) 1995-10-09

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse

Effective date: 20101130