JP2007313645A - 研磨パッドの製造方法及び研磨パッド - Google Patents
研磨パッドの製造方法及び研磨パッド Download PDFInfo
- Publication number
- JP2007313645A JP2007313645A JP2007206070A JP2007206070A JP2007313645A JP 2007313645 A JP2007313645 A JP 2007313645A JP 2007206070 A JP2007206070 A JP 2007206070A JP 2007206070 A JP2007206070 A JP 2007206070A JP 2007313645 A JP2007313645 A JP 2007313645A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pad
- polishing
- wafer
- useful
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/60—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of tools not covered by the preceding subgroups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
【解決手段】パッドが、第一の樹脂からなる第一の部分と、第二の樹脂からなる第二の部分とを含み、前記第一の部分が、スラリー粒子の吸収、輸送という本質的な能力を持たず、かつ190〜3500nmの範囲の波長の光線が透過する、硬質均一樹脂シートからなるパッドであって、前記第一の部分と前記第二の部分とが同一の所望の厚さを有し、かつ第一の樹脂と第二の樹脂とをいずれか一方が液体である間に他方に完全に接触させ、次いで液体の樹脂を硬化させることにより、第一の部分と第二の部分とが接合された、パッドである。
【選択図】なし
Description
(1)前記第一の樹脂の棒又はプラグを準備する工程;
(2)前記第一の樹脂の棒又はプラグを液状の第二の樹脂の中に配置する工程;
(3)前記第二の樹脂を硬化させて成形物を得る工程;及び
(4)前記成形物をスライスする工程;
を含む、方法に関する。
前記パッドが、第一の樹脂からなる第一の部分と、第二の樹脂からなる第二の部分とを含み、
前記パッドが、第一の樹脂の棒又はプラグがその中に配置された液状の第二の樹脂を得て、次いで前記第二の樹脂を硬化させた成形物をスライスしたものであり、
前記第一の部分が、スラリー粒子の吸収、輸送という本質的な能力を持たず、かつ190〜3500nmの範囲の波長の光線が透過する、硬質均一樹脂シートからなり、
前記第二の部分がマイクロポーラスウレタン構造、又はマイクロバルーン充填合成ポウレタン構造若しくはエア注入合成ウレタン構造であり、前記パッドの表面で小孔が開口し、スラリー粒子の吸収、輸送が可能である、
パッドに関する。
(1)集積回路搭載ウエーハの研磨に有用なパッドであって、少なくともその一部分はスラリー粒子の吸収、輸送という本質的な能力を持たない硬質均一樹脂シートからなり、この樹脂シートは190−3500ナノメーターの範囲の波長の光線が透過するものであることを特徴とするパッドに関する。
(2)前記硬質均一樹脂シートが、大フロー溝と小フロー溝の両方がある表面テクスチャー又はパターンを持ち、これら溝が表面上を横切る粒子を含む研磨スラリーの輸送を可能にし、前記表面テクスチャー又はパターンは外部手段によってのみ硬質均一樹脂シートの表面に作られることを特徴とする(1)のパッド。
(3)前記パッドが、光が透過する硬質均一樹脂シートからなる第一部分と、マイクロポーラスポリウレタン構造からなる第二部分を有することを特徴とする(1)のパッド。
(4)前記パッドが、光が透過する硬質均一樹脂シートからなる第一部分と、マイクロポーラスポリウレタン構造からなる第二部分を有することを特徴とする(2)のパッド。
(5)前記パッドが、光が透過する硬質均一樹脂シートからなる第一部分と、充填またはエア注入合成ウレタン構造からなる第二部分を有することを特徴とする(1)のパッド。
(6)前記パッドが、光が透過する硬質均一樹脂シートからなる第一部分と、充填またはエア注入合成ウレタン構造からなる第二部分を有することを特徴とする(2)のパッド。
(7)前記パッドが、光が透過する硬質均一樹脂シートからなる第一部分と、スラリー粒子の吸収、輸送という本質的な能力を持たない硬質均一樹脂シートからなる第二部分を有し、この第二部分が大フロー溝と小フロー溝の両方がある表面テクスチャー又はパターンをその表面に持ち、これら溝が表面を横切る粒子を含む研磨スラリーの輸送を可能にし、前記表面テクスチャーは外部手段によってのみ硬質均一樹脂シートの表面上に作られることを特徴とする(1)のパッド。
(8)前記パッドが、光が透過する硬質均一樹脂シートからなる第一部分と、スラリー粒子の吸収、輸送という本質的な能力を持たない硬質均一樹脂シートからなる第二部分を有し、この第二部分が大フロー溝と小フロー溝の両方がある表面テクスチャー又はパターンをその表面に持ち、これら溝が表面を横切る粒子を含む研磨スラリーの輸送を可能にし、前記表面テクスチャーは外部手段によってのみ硬質均一樹脂シートの表面上に作られることを特徴とする(2)のパッド。
Claims (3)
- 光学的方法を用いるインシチュ終点検出に有用であり、かつ集積回路搭載ウェーハの研磨に有用なパッドであって、前記パッドが、第一の樹脂からなる第一の部分と、第二の樹脂からなる第二の部分とを含み、前記第一の部分が、スラリー粒子の吸収、輸送という本質的な能力を持たず、かつ190〜3500nmの範囲の波長の光線が透過する、硬質均一樹脂シートからなるパッドであって、
前記第一の部分と前記第二の部分とが同一の所望の厚さを有し、かつ第一の樹脂と第二の樹脂とをいずれか一方が液体である間に他方に完全に接触させ、次いで液体の樹脂を硬化させることにより、第一の部分と第二の部分とが接合された、パッド。 - 第二の樹脂が液体である間に、第一の樹脂の棒又はプラグと完全に接触させ、次いで液体の第二の樹脂を硬化させることにより、第一の部分と第二の部分とが接合された、請求項1記載のパッド。
- 前記第二の部分が表面と、その厚さ方向に対向する裏面とを有し、
前記第一の部分が上面と、その厚さ方向に対向する下面とを有し、かつ
前記第一の部分の上面が、前記第二の部分の表面と同一平面上に位置する、請求項1又は2記載のパッド。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/517,578 US5605760A (en) | 1995-08-21 | 1995-08-21 | Polishing pads |
US08/517,578 | 1995-08-21 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005112423A Division JP4019087B2 (ja) | 1995-08-21 | 2005-04-08 | 研磨パッドの製造方法及び研磨パッド |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009247447A Division JP5016655B2 (ja) | 1995-08-21 | 2009-10-28 | 研磨パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007313645A true JP2007313645A (ja) | 2007-12-06 |
JP4714715B2 JP4714715B2 (ja) | 2011-06-29 |
Family
ID=24060375
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50955797A Expired - Lifetime JP3691852B2 (ja) | 1995-08-21 | 1996-08-20 | 研磨パッド |
JP2005112423A Expired - Lifetime JP4019087B2 (ja) | 1995-08-21 | 2005-04-08 | 研磨パッドの製造方法及び研磨パッド |
JP2007206070A Expired - Lifetime JP4714715B2 (ja) | 1995-08-21 | 2007-08-08 | 研磨パッドの製造方法及び研磨パッド |
JP2009247447A Expired - Lifetime JP5016655B2 (ja) | 1995-08-21 | 2009-10-28 | 研磨パッド |
JP2012041145A Expired - Lifetime JP5461603B2 (ja) | 1995-08-21 | 2012-02-28 | 研磨パッド |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50955797A Expired - Lifetime JP3691852B2 (ja) | 1995-08-21 | 1996-08-20 | 研磨パッド |
JP2005112423A Expired - Lifetime JP4019087B2 (ja) | 1995-08-21 | 2005-04-08 | 研磨パッドの製造方法及び研磨パッド |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009247447A Expired - Lifetime JP5016655B2 (ja) | 1995-08-21 | 2009-10-28 | 研磨パッド |
JP2012041145A Expired - Lifetime JP5461603B2 (ja) | 1995-08-21 | 2012-02-28 | 研磨パッド |
Country Status (7)
Country | Link |
---|---|
US (1) | US5605760A (ja) |
EP (2) | EP0846040A4 (ja) |
JP (5) | JP3691852B2 (ja) |
KR (1) | KR100422603B1 (ja) |
CN (1) | CN1068814C (ja) |
TW (1) | TW340082B (ja) |
WO (1) | WO1997006921A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013542863A (ja) * | 2010-11-18 | 2013-11-28 | キャボット マイクロエレクトロニクス コーポレイション | 透過性領域を含む研磨パッド |
Families Citing this family (217)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5823853A (en) * | 1996-07-18 | 1998-10-20 | Speedfam Corporation | Apparatus for the in-process detection of workpieces with a monochromatic light source |
US5733171A (en) * | 1996-07-18 | 1998-03-31 | Speedfam Corporation | Apparatus for the in-process detection of workpieces in a CMP environment |
US7037403B1 (en) * | 1992-12-28 | 2006-05-02 | Applied Materials Inc. | In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization |
US6614529B1 (en) * | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
US6876454B1 (en) | 1995-03-28 | 2005-04-05 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
US6676717B1 (en) | 1995-03-28 | 2004-01-13 | Applied Materials Inc | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
US6537133B1 (en) | 1995-03-28 | 2003-03-25 | Applied Materials, Inc. | Method for in-situ endpoint detection for chemical mechanical polishing operations |
DE69632490T2 (de) | 1995-03-28 | 2005-05-12 | Applied Materials, Inc., Santa Clara | Verfahren und Vorrichtung zur In-Situ-Kontrolle und Bestimmung des Endes von chemisch-mechanischen Planiervorgängen |
US6719818B1 (en) | 1995-03-28 | 2004-04-13 | Applied Materials, Inc. | Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations |
JPH09254027A (ja) * | 1996-03-25 | 1997-09-30 | Chiyoda Kk | 研磨用マウンテン材 |
US6074287A (en) * | 1996-04-12 | 2000-06-13 | Nikon Corporation | Semiconductor wafer polishing apparatus |
US6328642B1 (en) | 1997-02-14 | 2001-12-11 | Lam Research Corporation | Integrated pad and belt for chemical mechanical polishing |
US6287185B1 (en) | 1997-04-04 | 2001-09-11 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
US6682402B1 (en) * | 1997-04-04 | 2004-01-27 | Rodel Holdings, Inc. | Polishing pads and methods relating thereto |
US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
US6108091A (en) * | 1997-05-28 | 2000-08-22 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing |
US6111634A (en) * | 1997-05-28 | 2000-08-29 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing |
US6146248A (en) * | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US6736714B2 (en) | 1997-07-30 | 2004-05-18 | Praxair S.T. Technology, Inc. | Polishing silicon wafers |
TW421620B (en) * | 1997-12-03 | 2001-02-11 | Siemens Ag | Device and method to control an end-point during polish of components (especially semiconductor components) |
US6332470B1 (en) | 1997-12-30 | 2001-12-25 | Boris Fishkin | Aerosol substrate cleaner |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6248000B1 (en) * | 1998-03-24 | 2001-06-19 | Nikon Research Corporation Of America | Polishing pad thinning to optically access a semiconductor wafer surface |
US7718102B2 (en) * | 1998-06-02 | 2010-05-18 | Praxair S.T. Technology, Inc. | Froth and method of producing froth |
US6514301B1 (en) | 1998-06-02 | 2003-02-04 | Peripheral Products Inc. | Foam semiconductor polishing belts and pads |
US6395130B1 (en) | 1998-06-08 | 2002-05-28 | Speedfam-Ipec Corporation | Hydrophobic optical endpoint light pipes for chemical mechanical polishing |
US6117000A (en) * | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
US6203407B1 (en) | 1998-09-03 | 2001-03-20 | Micron Technology, Inc. | Method and apparatus for increasing-chemical-polishing selectivity |
US6280289B1 (en) | 1998-11-02 | 2001-08-28 | Applied Materials, Inc. | Method and apparatus for detecting an end-point in chemical mechanical polishing of metal layers |
US6159073A (en) * | 1998-11-02 | 2000-12-12 | Applied Materials, Inc. | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing |
WO2000026613A1 (en) | 1998-11-02 | 2000-05-11 | Applied Materials, Inc. | Optical monitoring of radial ranges in chemical mechanical polishing a metal layer on a substrate |
US6908374B2 (en) | 1998-12-01 | 2005-06-21 | Nutool, Inc. | Chemical mechanical polishing endpoint detection |
US6190234B1 (en) | 1999-01-25 | 2001-02-20 | Applied Materials, Inc. | Endpoint detection with light beams of different wavelengths |
US6716085B2 (en) | 2001-12-28 | 2004-04-06 | Applied Materials Inc. | Polishing pad with transparent window |
US6247998B1 (en) | 1999-01-25 | 2001-06-19 | Applied Materials, Inc. | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing |
US6994607B2 (en) * | 2001-12-28 | 2006-02-07 | Applied Materials, Inc. | Polishing pad with window |
US20040082271A1 (en) * | 1999-01-25 | 2004-04-29 | Wiswesser Andreas Norbert | Polishing pad with window |
US6179709B1 (en) * | 1999-02-04 | 2001-01-30 | Applied Materials, Inc. | In-situ monitoring of linear substrate polishing operations |
CN1312742C (zh) | 1999-03-30 | 2007-04-25 | 株式会社尼康 | 抛光垫、抛光机及制造半导体器件的方法 |
WO2000060650A1 (fr) * | 1999-03-31 | 2000-10-12 | Nikon Corporation | Corps de polissage, dispositif de polissage, procede de reglage du dispositif de polissage, dispositif de mesure de l'epaisseur du film poli ou du point terminal de polissage, procede de fabrication d'un dispositif a semi-conducteur |
US6217426B1 (en) | 1999-04-06 | 2001-04-17 | Applied Materials, Inc. | CMP polishing pad |
US20040072518A1 (en) * | 1999-04-02 | 2004-04-15 | Applied Materials, Inc. | Platen with patterned surface for chemical mechanical polishing |
US20020077037A1 (en) * | 1999-05-03 | 2002-06-20 | Tietz James V. | Fixed abrasive articles |
US6146242A (en) * | 1999-06-11 | 2000-11-14 | Strasbaugh, Inc. | Optical view port for chemical mechanical planarization endpoint detection |
US6224460B1 (en) * | 1999-06-30 | 2001-05-01 | Vlsi Technology, Inc. | Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process |
US6171181B1 (en) | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
DE10084915C2 (de) * | 1999-08-27 | 2003-12-24 | Asahi Chemical Ind | Polierkissen und Poliervorrichtung |
US6406363B1 (en) | 1999-08-31 | 2002-06-18 | Lam Research Corporation | Unsupported chemical mechanical polishing belt |
US6524164B1 (en) * | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
US6671051B1 (en) | 1999-09-15 | 2003-12-30 | Kla-Tencor | Apparatus and methods for detecting killer particles during chemical mechanical polishing |
US6299516B1 (en) | 1999-09-28 | 2001-10-09 | Applied Materials, Inc. | Substrate polishing article |
US6399501B2 (en) * | 1999-12-13 | 2002-06-04 | Applied Materials, Inc. | Method and apparatus for detecting polishing endpoint with optical monitoring |
US20020068516A1 (en) * | 1999-12-13 | 2002-06-06 | Applied Materials, Inc | Apparatus and method for controlled delivery of slurry to a region of a polishing device |
US6241596B1 (en) | 2000-01-14 | 2001-06-05 | Applied Materials, Inc. | Method and apparatus for chemical mechanical polishing using a patterned pad |
US6623341B2 (en) | 2000-01-18 | 2003-09-23 | Applied Materials, Inc. | Substrate polishing apparatus |
US6506097B1 (en) | 2000-01-18 | 2003-01-14 | Applied Materials, Inc. | Optical monitoring in a two-step chemical mechanical polishing process |
US6607428B2 (en) | 2000-01-18 | 2003-08-19 | Applied Materials, Inc. | Material for use in carrier and polishing pads |
US6533645B2 (en) | 2000-01-18 | 2003-03-18 | Applied Materials, Inc. | Substrate polishing article |
US6383058B1 (en) | 2000-01-28 | 2002-05-07 | Applied Materials, Inc. | Adaptive endpoint detection for chemical mechanical polishing |
US6309276B1 (en) | 2000-02-01 | 2001-10-30 | Applied Materials, Inc. | Endpoint monitoring with polishing rate change |
US7059948B2 (en) * | 2000-12-22 | 2006-06-13 | Applied Materials | Articles for polishing semiconductor substrates |
JP2003524300A (ja) | 2000-02-25 | 2003-08-12 | ロデール ホールディングス インコーポレイテッド | 透明部分のある研磨パッド |
US6860793B2 (en) | 2000-03-15 | 2005-03-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Window portion with an adjusted rate of wear |
US6616513B1 (en) | 2000-04-07 | 2003-09-09 | Applied Materials, Inc. | Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile |
US8485862B2 (en) | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US6561891B2 (en) | 2000-05-23 | 2003-05-13 | Rodel Holdings, Inc. | Eliminating air pockets under a polished pad |
US6749485B1 (en) | 2000-05-27 | 2004-06-15 | Rodel Holdings, Inc. | Hydrolytically stable grooved polishing pads for chemical mechanical planarization |
US6736709B1 (en) | 2000-05-27 | 2004-05-18 | Rodel Holdings, Inc. | Grooved polishing pads for chemical mechanical planarization |
US6685537B1 (en) * | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
JP2002001647A (ja) * | 2000-06-19 | 2002-01-08 | Rodel Nitta Co | 研磨パッド |
US6495464B1 (en) | 2000-06-30 | 2002-12-17 | Lam Research Corporation | Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool |
EP1294536B1 (en) | 2000-06-30 | 2005-04-20 | Rohm and Haas Electronic Materials CMP Holdings, Inc. | Base-pad for a polishing pad |
US6878038B2 (en) * | 2000-07-10 | 2005-04-12 | Applied Materials Inc. | Combined eddy current sensing and optical monitoring for chemical mechanical polishing |
JP2002036129A (ja) * | 2000-07-25 | 2002-02-05 | Roki Techno Co Ltd | 研磨パッド及びその製造方法 |
US6602724B2 (en) * | 2000-07-27 | 2003-08-05 | Applied Materials, Inc. | Chemical mechanical polishing of a metal layer with polishing rate monitoring |
US20020190207A1 (en) * | 2000-09-20 | 2002-12-19 | Ady Levy | Methods and systems for determining a characteristic of micro defects on a specimen |
US6891627B1 (en) | 2000-09-20 | 2005-05-10 | Kla-Tencor Technologies Corp. | Methods and systems for determining a critical dimension and overlay of a specimen |
EP1324858A1 (en) | 2000-10-06 | 2003-07-09 | Cabot Microelectronics Corporation | Polishing pad comprising a filled translucent region |
US6688956B1 (en) * | 2000-11-29 | 2004-02-10 | Psiloquest Inc. | Substrate polishing device and method |
US20020072296A1 (en) | 2000-11-29 | 2002-06-13 | Muilenburg Michael J. | Abrasive article having a window system for polishing wafers, and methods |
US6609961B2 (en) | 2001-01-09 | 2003-08-26 | Lam Research Corporation | Chemical mechanical planarization belt assembly and method of assembly |
WO2002070200A1 (en) | 2001-03-01 | 2002-09-12 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
US6863774B2 (en) * | 2001-03-08 | 2005-03-08 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
US6608495B2 (en) | 2001-03-19 | 2003-08-19 | Applied Materials, Inc. | Eddy-optic sensor for object inspection |
DE60228784D1 (de) | 2001-04-25 | 2008-10-23 | Jsr Corp | Lichtduchlässiges Polierkissen für eine Halbleiterschleife |
US6966816B2 (en) * | 2001-05-02 | 2005-11-22 | Applied Materials, Inc. | Integrated endpoint detection system with optical and eddy current monitoring |
JP4131632B2 (ja) * | 2001-06-15 | 2008-08-13 | 株式会社荏原製作所 | ポリッシング装置及び研磨パッド |
WO2002102547A1 (en) * | 2001-06-15 | 2002-12-27 | Rodel Holdings, Inc. | Polishing apparatus that provides a window |
US6514775B2 (en) | 2001-06-29 | 2003-02-04 | Kla-Tencor Technologies Corporation | In-situ end point detection for semiconductor wafer polishing |
JP4570286B2 (ja) * | 2001-07-03 | 2010-10-27 | ニッタ・ハース株式会社 | 研磨パッド |
JP2003133270A (ja) | 2001-10-26 | 2003-05-09 | Jsr Corp | 化学機械研磨用窓材及び研磨パッド |
US6586337B2 (en) * | 2001-11-09 | 2003-07-01 | Speedfam-Ipec Corporation | Method and apparatus for endpoint detection during chemical mechanical polishing |
US6811466B1 (en) * | 2001-12-28 | 2004-11-02 | Applied Materials, Inc. | System and method for in-line metal profile measurement |
US6722946B2 (en) * | 2002-01-17 | 2004-04-20 | Nutool, Inc. | Advanced chemical mechanical polishing system with smart endpoint detection |
US6942546B2 (en) | 2002-01-17 | 2005-09-13 | Asm Nutool, Inc. | Endpoint detection for non-transparent polishing member |
US6878039B2 (en) | 2002-01-28 | 2005-04-12 | Speedfam-Ipec Corporation | Polishing pad window for a chemical-mechanical polishing tool |
WO2003066282A2 (en) * | 2002-02-04 | 2003-08-14 | Kla-Tencor Technologies Corp. | Systems and methods for characterizing a polishing process |
US7001242B2 (en) * | 2002-02-06 | 2006-02-21 | Applied Materials, Inc. | Method and apparatus of eddy current monitoring for chemical mechanical polishing |
US7037184B2 (en) * | 2003-01-22 | 2006-05-02 | Raytech Innovation Solutions, Llc | Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
US6852020B2 (en) * | 2003-01-22 | 2005-02-08 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical—mechanical planarization of semiconductor wafers and method of making same |
US20030194959A1 (en) * | 2002-04-15 | 2003-10-16 | Cabot Microelectronics Corporation | Sintered polishing pad with regions of contrasting density |
KR20030086655A (ko) * | 2002-05-06 | 2003-11-12 | 삼성전자주식회사 | 연마 종점을 검출하기 위한 장치 및 이를 갖는 화학적기계적 연마장치 |
US6913517B2 (en) | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
US20040171339A1 (en) * | 2002-10-28 | 2004-09-02 | Cabot Microelectronics Corporation | Microporous polishing pads |
US7040957B2 (en) * | 2002-08-14 | 2006-05-09 | Novellus Systems Inc. | Platen and manifold for polishing workpieces |
KR100465649B1 (ko) * | 2002-09-17 | 2005-01-13 | 한국포리올 주식회사 | 일체형 연마 패드 및 그 제조 방법 |
US7311862B2 (en) | 2002-10-28 | 2007-12-25 | Cabot Microelectronics Corporation | Method for manufacturing microporous CMP materials having controlled pore size |
US7435165B2 (en) | 2002-10-28 | 2008-10-14 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
US7267607B2 (en) | 2002-10-28 | 2007-09-11 | Cabot Microelectronics Corporation | Transparent microporous materials for CMP |
TWI220405B (en) * | 2002-11-19 | 2004-08-21 | Iv Technologies Co Ltd | Method of fabricating a polishing pad having a detection window thereon |
US8845852B2 (en) | 2002-11-27 | 2014-09-30 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and method of producing semiconductor device |
JP4620331B2 (ja) * | 2003-01-31 | 2011-01-26 | ニッタ・ハース株式会社 | 研磨パッド及び研磨パッドの製造方法 |
US7008295B2 (en) * | 2003-02-04 | 2006-03-07 | Applied Materials Inc. | Substrate monitoring during chemical mechanical polishing |
US6832947B2 (en) * | 2003-02-10 | 2004-12-21 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
US6960120B2 (en) | 2003-02-10 | 2005-11-01 | Cabot Microelectronics Corporation | CMP pad with composite transparent window |
WO2004073926A1 (en) * | 2003-02-18 | 2004-09-02 | Parker-Hannifin Corporation | Polishing article for electro-chemical mechanical polishing |
TW200530378A (en) | 2003-03-11 | 2005-09-16 | Toyo Tire & Rubber Co | Polishing pad and semiconductor device manufacturing method |
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
SG153668A1 (en) | 2003-03-25 | 2009-07-29 | Neopad Technologies Corp | Customized polish pads for chemical mechanical planarization |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
KR100771738B1 (ko) * | 2003-04-03 | 2007-10-30 | 히다치 가세고교 가부시끼가이샤 | 연마패드, 그 제조방법 및 그것을 이용한 연마방법 |
JP2004319584A (ja) * | 2003-04-11 | 2004-11-11 | Nihon Micro Coating Co Ltd | 研磨パッド及びその製造方法 |
US7238097B2 (en) * | 2003-04-11 | 2007-07-03 | Nihon Microcoating Co., Ltd. | Polishing pad and method of producing same |
US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
US7435161B2 (en) * | 2003-06-17 | 2008-10-14 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US6997777B2 (en) | 2003-06-17 | 2006-02-14 | Cabot Microelectronics Corporation | Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region |
US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
TWI290504B (en) | 2003-07-17 | 2007-12-01 | Jsr Corp | Chemical mechanical polishing pad and chemical mechanical polishing method |
US7097537B1 (en) | 2003-08-18 | 2006-08-29 | Applied Materials, Inc. | Determination of position of sensor measurements during polishing |
US7153185B1 (en) | 2003-08-18 | 2006-12-26 | Applied Materials, Inc. | Substrate edge detection |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7264536B2 (en) * | 2003-09-23 | 2007-09-04 | Applied Materials, Inc. | Polishing pad with window |
US20050173259A1 (en) * | 2004-02-06 | 2005-08-11 | Applied Materials, Inc. | Endpoint system for electro-chemical mechanical polishing |
US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
US7186651B2 (en) * | 2003-10-30 | 2007-03-06 | Texas Instruments Incorporated | Chemical mechanical polishing method and apparatus |
US6984163B2 (en) * | 2003-11-25 | 2006-01-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with high optical transmission window |
US7132033B2 (en) * | 2004-02-27 | 2006-11-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a layered polishing pad |
US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
WO2005104199A1 (ja) | 2004-04-23 | 2005-11-03 | Jsr Corporation | 半導体ウエハ用研磨パッド及びこれを備える半導体ウエハ用研磨複層体並びに半導体ウエハの研磨方法 |
US7018581B2 (en) * | 2004-06-10 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a polishing pad with reduced stress window |
US7252871B2 (en) * | 2004-06-16 | 2007-08-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a pressure relief channel |
US7120553B2 (en) * | 2004-07-22 | 2006-10-10 | Applied Materials, Inc. | Iso-reflectance wavelengths |
US8075372B2 (en) * | 2004-09-01 | 2011-12-13 | Cabot Microelectronics Corporation | Polishing pad with microporous regions |
WO2006062158A1 (ja) | 2004-12-10 | 2006-06-15 | Toyo Tire & Rubber Co., Ltd. | 研磨パッド及び研磨パッドの製造方法 |
US7182677B2 (en) * | 2005-01-14 | 2007-02-27 | Applied Materials, Inc. | Chemical mechanical polishing pad for controlling polishing slurry distribution |
TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
US20070037487A1 (en) * | 2005-08-10 | 2007-02-15 | Kuo Charles C | Polishing pad having a sealed pressure relief channel |
US7210980B2 (en) * | 2005-08-26 | 2007-05-01 | Applied Materials, Inc. | Sealed polishing pad, system and methods |
JP5223336B2 (ja) * | 2006-02-06 | 2013-06-26 | 東レ株式会社 | 研磨パッドおよび研磨装置 |
CN101058169A (zh) * | 2006-02-15 | 2007-10-24 | 应用材料股份有限公司 | 抛光表面 |
US20070212979A1 (en) * | 2006-03-09 | 2007-09-13 | Rimpad Tech Ltd. | Composite polishing pad |
CN101966697B (zh) | 2006-04-19 | 2015-04-22 | 东洋橡胶工业株式会社 | 抛光垫的制造方法 |
JP2007307639A (ja) * | 2006-05-17 | 2007-11-29 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
JP5110677B2 (ja) * | 2006-05-17 | 2012-12-26 | 東洋ゴム工業株式会社 | 研磨パッド |
JP4931133B2 (ja) * | 2007-03-15 | 2012-05-16 | 東洋ゴム工業株式会社 | 研磨パッド |
JP4971028B2 (ja) * | 2007-05-16 | 2012-07-11 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
JP4943233B2 (ja) * | 2007-05-31 | 2012-05-30 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
DE102008045216A1 (de) | 2007-08-23 | 2009-04-09 | Technische Universität Dresden | Verfahren und Anordnung zum Erkennen des Endpunktes beim Polieren von eingebetteten SiN-Strukturen auf Halbleiterwafern |
US8337278B2 (en) * | 2007-09-24 | 2012-12-25 | Applied Materials, Inc. | Wafer edge characterization by successive radius measurements |
US7985121B2 (en) * | 2007-11-30 | 2011-07-26 | Innopad, Inc. | Chemical-mechanical planarization pad having end point detection window |
US20090305610A1 (en) * | 2008-06-06 | 2009-12-10 | Applied Materials, Inc. | Multiple window pad assembly |
US7967661B2 (en) * | 2008-06-19 | 2011-06-28 | Micron Technology, Inc. | Systems and pads for planarizing microelectronic workpieces and associated methods of use and manufacture |
JP5142866B2 (ja) * | 2008-07-16 | 2013-02-13 | 富士紡ホールディングス株式会社 | 研磨パッド |
US8118644B2 (en) * | 2008-10-16 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having integral identification feature |
US8118641B2 (en) * | 2009-03-04 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having window with integral identification feature |
US8257544B2 (en) * | 2009-06-10 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having a low defect integral window |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US8697217B2 (en) | 2010-01-15 | 2014-04-15 | Rohm and Haas Electronics Materials CMP Holdings, Inc. | Creep-resistant polishing pad window |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
US8758659B2 (en) | 2010-09-29 | 2014-06-24 | Fns Tech Co., Ltd. | Method of grooving a chemical-mechanical planarization pad |
US8257545B2 (en) | 2010-09-29 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith |
US8657653B2 (en) | 2010-09-30 | 2014-02-25 | Nexplanar Corporation | Homogeneous polishing pad for eddy current end-point detection |
US8628384B2 (en) * | 2010-09-30 | 2014-01-14 | Nexplanar Corporation | Polishing pad for eddy current end-point detection |
US9133299B2 (en) | 2011-07-15 | 2015-09-15 | Lg Chem, Ltd. | Poly-urethane resin and poly-urethane absorbing pad using the same |
KR101277296B1 (ko) | 2011-07-15 | 2013-06-20 | 주식회사 엘지화학 | 폴리우레탄 수지 조성물 및 이를 이용한 폴리우레탄 흡착 패드 |
CN102248462A (zh) * | 2011-07-25 | 2011-11-23 | 成都光明光电股份有限公司 | 抛光磨具 |
US10722997B2 (en) | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
SG10201608125WA (en) | 2012-04-02 | 2016-11-29 | Thomas West Inc | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
US10022842B2 (en) | 2012-04-02 | 2018-07-17 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
US9156125B2 (en) | 2012-04-11 | 2015-10-13 | Cabot Microelectronics Corporation | Polishing pad with light-stable light-transmitting region |
US20140256231A1 (en) | 2013-03-07 | 2014-09-11 | Dow Global Technologies Llc | Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window |
US9186772B2 (en) | 2013-03-07 | 2015-11-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith |
US9259820B2 (en) | 2014-03-28 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with polishing layer and window |
US9064806B1 (en) | 2014-03-28 | 2015-06-23 | Rohm and Haas Electronics Materials CMP Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad with window |
US9216489B2 (en) | 2014-03-28 | 2015-12-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
US9333620B2 (en) | 2014-04-29 | 2016-05-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with clear endpoint detection window |
US9314897B2 (en) * | 2014-04-29 | 2016-04-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with endpoint detection window |
US9259821B2 (en) * | 2014-06-25 | 2016-02-16 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing layer formulation with conditioning tolerance |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
CN113579992A (zh) | 2014-10-17 | 2021-11-02 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US9452507B2 (en) * | 2014-12-19 | 2016-09-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Controlled-viscosity CMP casting method |
US9446498B1 (en) | 2015-03-13 | 2016-09-20 | rohm and Hass Electronic Materials CMP Holdings, Inc. | Chemical mechanical polishing pad with window |
US9475168B2 (en) | 2015-03-26 | 2016-10-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad window |
CN113103145B (zh) | 2015-10-30 | 2023-04-11 | 应用材料公司 | 形成具有期望ζ电位的抛光制品的设备与方法 |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
US20180304539A1 (en) | 2017-04-21 | 2018-10-25 | Applied Materials, Inc. | Energy delivery system with array of energy sources for an additive manufacturing apparatus |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
US10898986B2 (en) | 2017-09-15 | 2021-01-26 | Applied Materials, Inc. | Chattering correction for accurate sensor position determination on wafer |
KR20210042171A (ko) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | 진보한 폴리싱 패드들을 위한 제형들 |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
US11638979B2 (en) | 2020-06-09 | 2023-05-02 | Applied Materials, Inc. | Additive manufacturing of polishing pads |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
US11633830B2 (en) | 2020-06-24 | 2023-04-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP polishing pad with uniform window |
US20220203495A1 (en) | 2020-12-29 | 2022-06-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cmp polishing pad with window having transparency at low wavelengths and material useful in such window |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
WO2022202059A1 (ja) * | 2021-03-24 | 2022-09-29 | 富士紡ホールディングス株式会社 | 研磨パッドの製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05309558A (ja) * | 1992-05-08 | 1993-11-22 | Komatsu Denshi Kinzoku Kk | 貼り合わせウェーハの研磨方法 |
JPH0752032A (ja) * | 1993-08-10 | 1995-02-28 | Sumitomo Metal Mining Co Ltd | ウエハ研磨方法及びその装置 |
JPH097985A (ja) * | 1995-03-28 | 1997-01-10 | Applied Materials Inc | ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法 |
JP2003145414A (ja) * | 2001-11-13 | 2003-05-20 | Toyobo Co Ltd | 研磨パッド及びその製造方法 |
JP2006036909A (ja) * | 2004-07-27 | 2006-02-09 | Nicca Chemical Co Ltd | 研磨用シートの製造方法及び研磨用シート |
JP2007063323A (ja) * | 2005-08-29 | 2007-03-15 | Dainippon Ink & Chem Inc | 研磨パッド用ポリウレタン組成物及びそれを用いた研磨パッド |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4728552A (en) * | 1984-07-06 | 1988-03-01 | Rodel, Inc. | Substrate containing fibers of predetermined orientation and process of making the same |
US4927432A (en) * | 1986-03-25 | 1990-05-22 | Rodel, Inc. | Pad material for grinding, lapping and polishing |
JPH01193166A (ja) * | 1988-01-28 | 1989-08-03 | Showa Denko Kk | 半導体ウェハ鏡面研磨用パッド |
JP2734007B2 (ja) * | 1988-10-07 | 1998-03-30 | ソニー株式会社 | 研磨装置および研磨方法 |
JPH02218561A (ja) * | 1989-02-15 | 1990-08-31 | Fujimi Kenmazai Kogyo Kk | 研磨布の製造法 |
JPH03213265A (ja) * | 1990-01-12 | 1991-09-18 | Fujitsu Ltd | ラップ盤の定盤 |
US5177908A (en) * | 1990-01-22 | 1993-01-12 | Micron Technology, Inc. | Polishing pad |
US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
US5081796A (en) * | 1990-08-06 | 1992-01-21 | Micron Technology, Inc. | Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer |
US5036015A (en) * | 1990-09-24 | 1991-07-30 | Micron Technology, Inc. | Method of endpoint detection during chemical/mechanical planarization of semiconductor wafers |
US5240552A (en) * | 1991-12-11 | 1993-08-31 | Micron Technology, Inc. | Chemical mechanical planarization (CMP) of a semiconductor wafer using acoustical waves for in-situ end point detection |
CA2131526A1 (en) * | 1992-04-13 | 1993-10-28 | Gene O. Lindholm | Abrasive article |
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5216843A (en) * | 1992-09-24 | 1993-06-08 | Intel Corporation | Polishing pad conditioning apparatus for wafer planarization process |
US5337015A (en) * | 1993-06-14 | 1994-08-09 | International Business Machines Corporation | In-situ endpoint detection method and apparatus for chemical-mechanical polishing using low amplitude input voltage |
US5413941A (en) * | 1994-01-06 | 1995-05-09 | Micron Technology, Inc. | Optical end point detection methods in semiconductor planarizing polishing processes |
US5489233A (en) * | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
US5534106A (en) * | 1994-07-26 | 1996-07-09 | Kabushiki Kaisha Toshiba | Apparatus for processing semiconductor wafers |
JP4971028B2 (ja) * | 2007-05-16 | 2012-07-11 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
JP4943233B2 (ja) * | 2007-05-31 | 2012-05-30 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
-
1995
- 1995-08-21 US US08/517,578 patent/US5605760A/en not_active Expired - Lifetime
-
1996
- 1996-08-20 CN CN96196447A patent/CN1068814C/zh not_active Expired - Lifetime
- 1996-08-20 EP EP96928246A patent/EP0846040A4/en not_active Withdrawn
- 1996-08-20 EP EP02078539A patent/EP1281477A1/en not_active Withdrawn
- 1996-08-20 JP JP50955797A patent/JP3691852B2/ja not_active Expired - Lifetime
- 1996-08-20 KR KR10-1998-0701235A patent/KR100422603B1/ko not_active IP Right Cessation
- 1996-08-20 WO PCT/US1996/013443 patent/WO1997006921A1/en active IP Right Grant
- 1996-08-27 TW TW085110408A patent/TW340082B/zh not_active IP Right Cessation
-
2005
- 2005-04-08 JP JP2005112423A patent/JP4019087B2/ja not_active Expired - Lifetime
-
2007
- 2007-08-08 JP JP2007206070A patent/JP4714715B2/ja not_active Expired - Lifetime
-
2009
- 2009-10-28 JP JP2009247447A patent/JP5016655B2/ja not_active Expired - Lifetime
-
2012
- 2012-02-28 JP JP2012041145A patent/JP5461603B2/ja not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05309558A (ja) * | 1992-05-08 | 1993-11-22 | Komatsu Denshi Kinzoku Kk | 貼り合わせウェーハの研磨方法 |
JPH0752032A (ja) * | 1993-08-10 | 1995-02-28 | Sumitomo Metal Mining Co Ltd | ウエハ研磨方法及びその装置 |
JPH097985A (ja) * | 1995-03-28 | 1997-01-10 | Applied Materials Inc | ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法 |
JP2003145414A (ja) * | 2001-11-13 | 2003-05-20 | Toyobo Co Ltd | 研磨パッド及びその製造方法 |
JP2006036909A (ja) * | 2004-07-27 | 2006-02-09 | Nicca Chemical Co Ltd | 研磨用シートの製造方法及び研磨用シート |
JP2007063323A (ja) * | 2005-08-29 | 2007-03-15 | Dainippon Ink & Chem Inc | 研磨パッド用ポリウレタン組成物及びそれを用いた研磨パッド |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013542863A (ja) * | 2010-11-18 | 2013-11-28 | キャボット マイクロエレクトロニクス コーポレイション | 透過性領域を含む研磨パッド |
Also Published As
Publication number | Publication date |
---|---|
EP1281477A1 (en) | 2003-02-05 |
JP5461603B2 (ja) | 2014-04-02 |
CN1068814C (zh) | 2001-07-25 |
JP4714715B2 (ja) | 2011-06-29 |
JPH11512977A (ja) | 1999-11-09 |
JP2012109616A (ja) | 2012-06-07 |
KR100422603B1 (ko) | 2004-05-31 |
JP2005210143A (ja) | 2005-08-04 |
WO1997006921A1 (en) | 1997-02-27 |
JP5016655B2 (ja) | 2012-09-05 |
JP4019087B2 (ja) | 2007-12-05 |
CN1193932A (zh) | 1998-09-23 |
EP0846040A1 (en) | 1998-06-10 |
JP3691852B2 (ja) | 2005-09-07 |
US5605760A (en) | 1997-02-25 |
TW340082B (en) | 1998-09-11 |
JP2010017848A (ja) | 2010-01-28 |
KR19990044003A (ko) | 1999-06-25 |
EP0846040A4 (en) | 1998-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4714715B2 (ja) | 研磨パッドの製造方法及び研磨パッド | |
US11986922B2 (en) | Techniques for combining CMP process tracking data with 3D printed CMP consumables | |
US7942724B2 (en) | Polishing pad with window having multiple portions | |
KR100737879B1 (ko) | 반도체 웨이퍼의 제조방법 | |
US7081044B2 (en) | Polishing apparatus and polishing pad | |
US7553214B2 (en) | Polishing article with integrated window stripe | |
TWI554364B (zh) | 包含具有透明基準層上的隙縫或開孔之拋光表面層之拋光墊 | |
TWI470714B (zh) | 用於渦電流端點偵測之拋光墊 | |
US7537511B2 (en) | Embedded fiber acoustic sensor for CMP process endpoint | |
SG182327A1 (en) | Cmp pad with local area transparency | |
TW201505759A (zh) | 具有具錐狀側壁的連續突起之硏磨表面的硏磨墊 | |
JPH1034522A (ja) | Cmp用研磨装置及びcmp用装置システム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070907 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100525 |
|
RD13 | Notification of appointment of power of sub attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7433 Effective date: 20100602 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20100602 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101102 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20110201 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20110204 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110315 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110328 |
|
EXPY | Cancellation because of completion of term |