CN118830068A - 半导体装置以及半导体装置的制造方法 - Google Patents

半导体装置以及半导体装置的制造方法 Download PDF

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Publication number
CN118830068A
CN118830068A CN202380025667.4A CN202380025667A CN118830068A CN 118830068 A CN118830068 A CN 118830068A CN 202380025667 A CN202380025667 A CN 202380025667A CN 118830068 A CN118830068 A CN 118830068A
Authority
CN
China
Prior art keywords
semiconductor element
semiconductor device
substrate
semiconductor
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380025667.4A
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English (en)
Chinese (zh)
Inventor
山田隆行
薮田康平
石井隆一
别芝范之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN118830068A publication Critical patent/CN118830068A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
CN202380025667.4A 2022-03-11 2023-03-01 半导体装置以及半导体装置的制造方法 Pending CN118830068A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-038352 2022-03-11
JP2022038352 2022-03-11
PCT/JP2023/007647 WO2023171505A1 (ja) 2022-03-11 2023-03-01 半導体装置及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN118830068A true CN118830068A (zh) 2024-10-22

Family

ID=87935277

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380025667.4A Pending CN118830068A (zh) 2022-03-11 2023-03-01 半导体装置以及半导体装置的制造方法

Country Status (5)

Country Link
US (1) US20250149413A1 (https=)
JP (1) JP7756786B2 (https=)
CN (1) CN118830068A (https=)
DE (1) DE112023001343T5 (https=)
WO (1) WO2023171505A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025182086A1 (https=) * 2024-03-01 2025-09-04

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007007239A2 (en) * 2005-07-08 2007-01-18 Nxp B.V. Semiconductor device
JP5112972B2 (ja) * 2008-06-30 2013-01-09 オンセミコンダクター・トレーディング・リミテッド 半導体装置およびその製造方法
JP5745238B2 (ja) * 2010-07-30 2015-07-08 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置およびその製造方法
JP6366766B2 (ja) * 2017-03-24 2018-08-01 三菱電機株式会社 半導体装置
JP7351134B2 (ja) * 2019-08-08 2023-09-27 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP7604779B2 (ja) * 2020-03-23 2024-12-24 富士電機株式会社 半導体製造装置及び半導体装置の製造方法
JP7494521B2 (ja) 2020-03-30 2024-06-04 富士電機株式会社 半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
DE112023001343T5 (de) 2024-12-19
JP7756786B2 (ja) 2025-10-20
US20250149413A1 (en) 2025-05-08
JPWO2023171505A1 (https=) 2023-09-14
WO2023171505A1 (ja) 2023-09-14

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