DE112023001343T5 - Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung - Google Patents

Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung Download PDF

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Publication number
DE112023001343T5
DE112023001343T5 DE112023001343.8T DE112023001343T DE112023001343T5 DE 112023001343 T5 DE112023001343 T5 DE 112023001343T5 DE 112023001343 T DE112023001343 T DE 112023001343T DE 112023001343 T5 DE112023001343 T5 DE 112023001343T5
Authority
DE
Germany
Prior art keywords
semiconductor element
semiconductor device
substrate
semiconductor
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023001343.8T
Other languages
German (de)
English (en)
Inventor
Takayuki Yamada
Kohei Yabuta
Ryuichi Ishii
Noriyuki Besshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112023001343T5 publication Critical patent/DE112023001343T5/de
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Die Bonding (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
DE112023001343.8T 2022-03-11 2023-03-01 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung Pending DE112023001343T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-038352 2022-03-11
JP2022038352 2022-03-11
PCT/JP2023/007647 WO2023171505A1 (ja) 2022-03-11 2023-03-01 半導体装置及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
DE112023001343T5 true DE112023001343T5 (de) 2024-12-19

Family

ID=87935277

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023001343.8T Pending DE112023001343T5 (de) 2022-03-11 2023-03-01 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US20250149413A1 (https=)
JP (1) JP7756786B2 (https=)
CN (1) CN118830068A (https=)
DE (1) DE112023001343T5 (https=)
WO (1) WO2023171505A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2025182086A1 (https=) * 2024-03-01 2025-09-04

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021158304A (ja) 2020-03-30 2021-10-07 富士電機株式会社 半導体装置及び半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007007239A2 (en) * 2005-07-08 2007-01-18 Nxp B.V. Semiconductor device
JP5112972B2 (ja) * 2008-06-30 2013-01-09 オンセミコンダクター・トレーディング・リミテッド 半導体装置およびその製造方法
JP5745238B2 (ja) * 2010-07-30 2015-07-08 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置およびその製造方法
JP6366766B2 (ja) * 2017-03-24 2018-08-01 三菱電機株式会社 半導体装置
JP7351134B2 (ja) * 2019-08-08 2023-09-27 富士電機株式会社 半導体装置及び半導体装置の製造方法
JP7604779B2 (ja) * 2020-03-23 2024-12-24 富士電機株式会社 半導体製造装置及び半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021158304A (ja) 2020-03-30 2021-10-07 富士電機株式会社 半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
JP7756786B2 (ja) 2025-10-20
US20250149413A1 (en) 2025-05-08
JPWO2023171505A1 (https=) 2023-09-14
WO2023171505A1 (ja) 2023-09-14
CN118830068A (zh) 2024-10-22

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Free format text: PREVIOUS MAIN CLASS: H01L0023130000

Ipc: H10W0070680000