CN1173546A - 金合金引线及制造凸起的方法 - Google Patents

金合金引线及制造凸起的方法 Download PDF

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CN1173546A
CN1173546A CN97113568A CN97113568A CN1173546A CN 1173546 A CN1173546 A CN 1173546A CN 97113568 A CN97113568 A CN 97113568A CN 97113568 A CN97113568 A CN 97113568A CN 1173546 A CN1173546 A CN 1173546A
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weight
gold
wire
alloy wire
content
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CN1065001C (zh
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秋元英行
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Tanaka Denshi Kogyo KK
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Tanaka Denshi Kogyo KK
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • B23K20/007—Ball bonding
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    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
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Abstract

一种金合金引线,其中把按重量比为0.2到5.0%的Pd和按重量比为1到100ppm的Bi加入到按重量比至少为99.99%纯度的金中。最好,进一步把按重量比为3到250ppm含量的选自Y、La、Ca、Be组中的至少一种元素加入到所述的金中。金合金引线特别适于形成金凸起。

Description

金合金引线及制造凸起的方法
本发明涉及金合金引线，特别适合用在IC芯片的无引线焊接中形成金合金凸起，及形成金合金凸起的方法。
利用引线焊接方法，通过引线连接IC芯片电极焊盘和外端等等。
利用引线焊接方法获得的半导体器件表示在图5，其中，标号11表示半导体元件，12表示电极，13表示金合金引线，14表示引线框架，H表示从半导体元件的表面到曲线顶部的高度(下文称为环形高度)。一般，首先把引线13焊接到半导体元件11的电极12上面，然后把它拉成环形，再把引线用超声焊接方法焊接到引线框架14上面。
引线焊接的方法，需要一个难于减低半导体器件高度的高度。
因此希望所用引线焊接方法减少环形高度。
第二，为了克服引线焊接方法的上述缺点，利用公知的无引线焊接方法，其中把电路板的外部接点或电极焊接到形成在IC芯片电极焊盘上的突起上。利用这种无引线焊接方法，和引线焊接方法比较，能减少连接高度，因为利用它们之间的凸起，直接把电极焊盘焊接到外端等位置上。这样，无引线焊接，有利于用在较薄的封装。
日本未审查的专利公开48-7678和59-208751和其它的专利中公开了在电极焊盘上形成凸起的方法。这些方法包括，加热引线末端形成熔珠，利用压焊夹具把熔珠压焊到IC芯片的电极焊盘上，把带有引线的压焊夹具向上拉，在靠近熔珠的引线部分拉断引线，由此，在电极焊盘处形成凸起。这种方法，许可利用关于常规引线焊接方法的装置，不用任何变化，并且得到高的生产率，但是存在缺点，即在熔珠上残留引线，即所谓尾线不能被均匀地缩短。如果在连接步骤，线尾长度太长，则位于凸起上面的线尾弯曲横向伸出，可能引起短路。
为了解决上述问题，日本未审查的专利申请No、62-152143公开了一种方法，其中在把熔珠压焊到电极焊盘后，利用切割刀具在靠近熔珠的位置把引线切成凹槽，接着拉引线，以便稳定地获得具有短尾线的凸起，但是这增加了附加步骤，因而降低了生产率。
形成凸起的优选材料是金、形成电极焊盘的材料是铝。但是众所周知，当把通过加热金线末端形成的熔珠压焊到铝电极焊盘上时，则在金珠和铝电极焊盘之间的连接部分形成Au-Al金属间合金。当连接部分保持在高温时，会增加Au-Al金属间合金的数量，并且减少连接部分的焊接强度。因此，需要有改善焊接电极焊盘和外端用的凸起材料的措施。
本发明的目的是提供金合金线，即使把电极焊盘上凸起长时间地曝露在高温下，其也具有高焊接强度，(下文称为“高温焊接强度”)，还提供利用引线制造凸起的方法。
本发明的另一个目的是提供一种金合金引线，当在金属末端形成熔珠的方法中利用该引线时，金合金引线稳定地提供短的尾线，该熔珠被焊接到IC芯片的电极焊盘上，然后向上拉断引线，该引线上没有凹槽(下文称为“简单拉断的尾线”)。
本发明的又一目的是提供金合金引线，当进行焊接时，其允许减少环形高度。
本发明者努力研究发现，利用加入到高纯度金中的元素钯(Pd)和铋(Bi)的协同作用，能达到上述目的。
于是，通过提供其中在至少按重量达到99.99％纯度的金中加入按重量为0.2到5.0％的钯(Pd)和按重量为1到100ppm的铋(Bi)的金合金，达到本发明上述的和其它的目的，特征和优点。
最好，上述金合金引线至少还包括按重量含有3到250ppm的选自钇(Y)、镧(La)、钙(Ca)、铍(Be)中的至少一种元素。
本发明提供形成金合金凸起的方法，它包括下述步骤，通过毛细管在金合金引线末端形成珠，降低所述毛细管把所述珠压焊到IC芯片的电极上面，上拉金合金引线，从焊接到所述电极上的所述珠上拉断所述金合金引线，因此在所述IC芯片的所述电极上，形成金合金凸起，其中所述金合金线有下列组成，把按重量比为0.2到5.0％的钯，按重量为1到100ppm的铋，和最好按重量为3到250ppm的选自钇、镧、钙、铍中的至少一种元素加入到纯度至少按重量比为99.99％的金中。
本发明还提供一种形成金合金凸起的方法，包括下列步骤，通过毛细管在金合金引线末端形成熔珠，降低所述的毛细管把所述熔珠压焊到IC芯片的电极上，在上述熔珠上的所述金合金线上形成凹槽，拉所述金合金引线，从焊接到所述电极的所述上拉断所述合金线，由此，在所述IC芯片的所述电极上形成金合金凸起，其中金合金引线具有下列组成，其中，把按重量为0.2到5％的钯，按重量为1到100ppm的铋和最好为按重量3到250ppm的选自钇、镧、钙、铍中的至少一种元素加入到按重量至少为99.99％的金中。
本发明的金合金引线不仅用在无引线焊接中也用在有引线焊接中。
图1A到图1C表示利用简单的拉引线形成凸起的方法；
图2A、2B、2B’、2C表示利用拉带凹槽的引线形成凸起的方法；
图3是图1C凸起部分的扩大剖视图。
图4是图2B’中凹槽部分的扩大剖视图。
图5是表示其中制成引线焊接的半导体器件。
本发明金合金引线的特征在于，具有如下的组成，把预定量的Pd和Bi(下文称作为第1组元素)，最好把预定量的Y、La、Ca和Be中的至少一种元素(下文称为第2组元素)一起加入到高纯度金中。
本发明使用的高纯度金是具有下述纯度的高纯度金，其纯度按重量至少为99.99％，优选为按重量至少为99.995.％，最好为按重量为99.999％。
(1)按照本发明把预定量的Pd和Bi加入到上述的纯金中，获得协同效果，以致于保持高的高温焊接强度，可以使简单拉断的尾线长度稳定地缩短。
外加Pd与Bi共存，则提供优良的效果，以致于保持高的高温焊接强度，并使简单拉断的尾线的长度均匀地缩短。如果Pd含量小于按重量比0.2％，和当Pd含量按重量比是0.2％或以上的情况相比，即使共同存在Bi的规定数量，其高温焊接强度降低、简单拉断的尾线长度增长。如果按重量比Pd含量大于5.0％，和当按重量比Pd含量是5.0％以下，即使共存Bi的所述规定含量，所得到的情况相比，则简单地拉断的尾线的长度增长。所以，规定Pd按重量比为0.2到5.0％的含量，并且共存Bi的规定含量。
外加Bi与Pd共存，提供优良效果，以致于保持高的高温焊接强度，使简单拉断的尾线的长度均匀地缩短。如果Bi的含量按重量比小于1ppm，和当Bi的含量按重量比是1ppm以上，即使共存Pd所述规定的含量所获得的情况相比，则简单的拉断的尾线的长度较长和均匀性差。如果Bi的含量按重比大于100ppm，即使共存Pd的所述规定含量，在形成凸起之前，在形成珠的阶段，在珠的表面出现针孔、和Bi的含量按重量比是100ppm以下的情况相比出现的次数更多。所以，规定Bi的含量按重量比为1到100ppm，并且共存Pd的规定含量。
在共存Pd规定含量的情况，Bi优选的含量，按重量比是1到40ppm。
于是，按照本发明，能获得保持高温焊接强度的效果和稳定地形成简短的拉断的尾线。
(2)在上述合金引线中，即使还加入其它元素到合金线中，基本上能获得上述效果。通常，如果加入到线中的除了Pd和Bi以外的其它元素的总量、按重量比不大于250ppm，则不损坏通过加入Pd和Bi规定量所获得的效果。
于是，即使加入除Pd、Bi以外的其它元素，通常保持本发明的效果，但具体地的说，按重量比加入3到250ppm含量的Y、La、Ca和Be中的至少一种元素、则获得简短拉断的尾线稳定效果是相等的，但改善了高温焊接强度。通过加入Y、La、Ca、Be中任一种元素，可能获得附加效果，因此，这些元素中的每一种元素是优选的附加元素。特别是，要加入这些元素中的至少3种元素。更具体地说，加入至少包括Y、La、Ca3种元素。这种情况则进一步改善了高温焊接强度。至少第2组元素中的一种元素的优选含量按重量比是3到70ppm。
即使加入第2组中一种或多种元素，但是不加入第1组中元素规定的含量，则改善简单拉断的尾线的长度和高温焊接强度。但是，如果在存在第1组元素的规定含量情况下，把第2组中一种或者多种元素加入到金合金引线中，则简单拉断的尾线的均匀性和高温焊接强度是更优良。如果加入第2组中一种或多种元素和第1组元素中的Bi元素的规定含量，但不加入第1组元素中的Pd元素的规定含量，则改善高温焊接强度和缩短简单拉断的尾线长度的效果不充分。因此，如果加入Bi的规定含量，则应该存在Pd的规定含量。于是，按照本发明，一般认为，第2组含量、即Y、La、Ca和Be中的至少一种元素应当和Pd、Bi的规定含量共存，而且它的含量按重量比应当是3到250ppm，优选为按重量比为3到70ppm。
应当注意，本发明金合金引线可以包括下列元素，重量比为0.2到5.0％的Pd，重量比为1到100ppm的Bi，还有重量比优选为3到250ppm的至少选自Y、La、Ca、Be组中的一种元素，其余的是金和不可避免的杂质。
按照本发明，也提供了利用如上所述的金合金形成凸起的方法。
(3)简单拉断方法
参见图1A到图1C叙述简单拉断方法。
如图1A所示，本发明的金合金引线2通过毛细管1、电焊枪3面对引线2的末端，在电焊枪和引线2的末端之间通过放电加热引线的末端、形成熔珠4。
如图1B所示，降低毛细管1，把熔珠压焊到IC芯片6上的电极5。虽然没用图表示，由于同时把超声波通过毛细管1加到珠4上和利用较热的块加热IC芯片6，则热焊接珠4，使珠4变形成有2个台阶的扁平形状4’。
如图1C所示，上拉毛细管1，同时夹持器夹住金合金引线2。结果，拉断引线2，分开变形珠4’，留下凸起4’，即把珠压焊到IC芯片6的电极5上面。
此后，把凸起4’的顶部连到外部引线端(没表示)。
此处，如图1C所示，部分线保留在凸起4’的顶部。图3是该凸起4’的扩大图。本发明利用的尾线长度指的是线段8的长度L，残留在凸起4’上。
当利用这种简单拉断方法形成凸起时，按照本发明利用的金合金引线，可能均匀地缩短尾线(简单拉断的尾线)的长度。
(4)利用凹槽拉断方法。
参见图2A、2B、2B’、2C叙述利用凹槽的拉断方法。
如图2A-图2B所示，把珠4压焊到IC芯片6的电极5上面，使其变形为具有2个台阶的扁平状或山丘状，与前述图1A和图1B所述的情况相同。
如图2B’所示，形成凹槽刀具7的一尖锐刀口从一侧接近位于具有2个台阶的扁平片或山丘状部分4’上面的金合金引线2，形成凹槽或者凹口。图4是这段扩大的剖视图，表示凹槽或者凹口。凹槽或凹口9的形状不限于V-形状。
如图2C所示，以和图1C所示相同的方法上拉引线2，把引线2从焊珠4’处拉断或切断，于是，在IC芯片6的电极上形成凸起4’。
把凸起4’的顶部和外引线端相连，但对此没有表示。
这种情况，在凸起4’处留下引线残留部分8。
利用凹槽的拉断方法是较好的，因为通过设定凹槽部位，可以把线尾长度控制到所要求的长度。
可能利用导电材料连接凸起4’和外引线端。
                              例1
按重量比含量为99.99％的高纯度金，和有预定含量的Pd、Bi的混合物，在真空炉中熔化，浇注获得如表1所示组分的金合金锭，即按重量比为0.2％的Pd和按重量比为20ppm的Bi。利用槽形辊压拉断机冷加工合金锭、中间进行退火、以便获得直径为25μm的细线。最后退火该线，使其具有2％到3％的延伸率。
利用如图1A到图1C所示的超声热压焊接方法，由引线焊接机把金合金引线焊接到IC芯片的电极上面。然后简单向上拉引线焊接，形成10个凸起。
通过测量尾线长度，进行高温焊接试验，观察凸起或珠的外部特性、来检测获得的凸起。表1表示检查的结果。
例2到41和比较例1到9
进行和例1相同的工序和检测、除了如表1到表3所示的制造线的组成以外。
(测量方法)
(1)尾线长度
利用长度测量显微镜、测量各例和比较例样品的尾线长度。然后计算平均长度和标准偏差。
(2)高温焊接强度
把各例和比较例样品放入300℃的恒温炉中经过500小时，接着用剪切强度测量机测量剪切强度。取剪切强度的平均值作为高温焊接强度。
(3)珠的外部特性
当珠形成时用显微镜观察球的外部特性，确定珠的外表面上是否有针孔。当看见针孔时，认为结果是坏的。当没看见针孔时，认为是好的。在表中，是○表示“好的”，用×表示“坏的”。
           (试验和测试结果)
(1)把Pd和Bi(第1组元素)按规定量加入金中的例1到例6中，获得下述优良效果。
(i)平均尾线长是33.4到39.6μm，非均匀尾线长度的标准偏差为5.0到8.8μm。尾线长度短而且均匀。
(ii)高温焊接强度在42.1到56.2gf。
(iii)在任何例中没有观察到针孔。
(2)除了Pd和Bi(第1组元素)规定量以外，还加入Y、La、Ca、Be(第2组元素)中至少一种元素的规定量到金中，则显示出优良的下述效果。特别是高温焊接强度比只加入第1组元素的情况有更好的效果。
(i)平均尾线长度是31.1到37.6μm，具有尾线长度非均匀性的尾线长度标准偏差是4.4到4.9μm。尾线长度短而且均匀。
(ii)高温焊接强度是42.8到67.4gf。
(iii)通过加入第2组元素，进一步改善了高温焊接强度。
(a)把例1和把第2组元素的一种或多种进一步加入到例1的金中时的例7、13、19进行比较，则改善高温焊接强度，从42.1gf变到42.8到43.3gf。
(b)当比较例2-6和进一步把第2组中一个或多个元素加入到例2-6中的相对应例时，同样地改善了高温焊接强度。
(IV)在任何例中都没有观察到针孔。
(V)在加入第2组中的三种以上的元素的例40到41中，高温焊接强度是最好的，为67.2到67.4gf。
(3)在没加入第1组或第2组元素的比较例1中，平均尾线长度是75.2μm，尾线长度的标准偏差是32.3μm。高温焊接强度是5.2gf。这些结果是坏的。
(4)在比较例2、3、7和8中，加入Bi的规定含量，按重量比以小于0.2％的含量加入Pd，则平均尾线长度为46.0到50.9μm，尾线长度标准偏差是8.3到12.7μm，高温焊接强度是13.5到16.4gf。这些结果是坏的。
(5)在比较例4中，加入Bi的规定含量，按重量比以超过5％含量的加入Pd，则尾线的平均长度是58.9μm，尾线长度的标准偏差是14.4μm。这些结果是坏的。
(6)在比较例5和9中，加入Pd的规定含量，而没有加入Bi，则尾线长度的标准偏差是坏的，长度为19.5到21.4μm。高温焊接强度是33.2到36.8gf，和比较例1比较得到改善，但次于本发明的各例。
(7)在比较例6中，加入Pd的规定含量，按重量比以大于100ppm的含量加入Bi，结果观察到针孔。高温焊接强度是低的，偏差是大的，因此，其数值未列于表中。
                            表1
 重量                                测试条件                             测试结果
                                组成            尾线长度(μm) 高温焊接强度(gf) 珠的外部特性
重量％ 重量ppm 平均值   标准偏差
 Pd  Bi  Y  La  Ca  Be   Au
例1例2例3例4例5  0.20.51.05.01.0  202020201   -----   -----    -----  -----   残残残残残  38.233.433.536.339.6   6.65.25.05.08.8  42.155.856.255.046.8  ○○○○○
例6例7例8例9例10  1.00.20.51.05.0  10020202020   -10-1010   -----    -----  -----   残残残残残  37.434.334.931.133.6   5.26.66.86.24.7  47.342.857.257.756.0  ○○○○○
例11例12例13例14例15  1.01.00.20.51.0  1100202020   1010---   --10-10  -----   残残残残残  37.137.136.736.534.9   7.15.87.27.26.3  47.254.443.155.858.4  ○○○○○
例16例17例18例19例20  5.01.01.00.20.5  2011002020   -----   101010--    ---10-  -----   残残残残残  33.637.136.334.934.5   5.59.47.06.36.6  56.950.251.843.357.1  ○○○○○
                                 表2
  重量                            测试条件                           测试结果
                             组成         尾线长度(μm)   高温焊接强度(gf)  珠的外部特性
   重量％ 重量ppm 平均值   标准偏差
 Pd  Bi  Y   La     Ca   Be     Au
例21例22例23例24例25  1.05.01.01.01.0  2020110020  ----3   -----     10101010-   -----     残残残残残   32.134.135.835.935.6   5.75.78.45.37.3  57.458.149.253.761.2  ○○○○○
例26例27例28例29例30  1.01.01.01.01.0  2020202020  250----   -3250--     ---3250   -----     残残残残残  32.234.434.236.134.9   5.89.97.16.74.4  57.962.059.361.860.7  ○○○○○
例31例32例33例34例35  1.01.01.01.01.0  2020202020  ---1010   ---10-     ----10   310250--     残残残残残  36.334.132.134.833.2   8.16.15.85.75.1  61.260.458.059.862.0  ○○○○○
例36例37例38例39例40  1.01.01.01.01.0  2020202020  10---10   -1010-10     -10-1010   10-1010-     残残残残残  33.535.237.635.733.9   5.85.86.15.06.0  59.259.858.760.267.4  ○○○○○
例41  1.0  20  10   10     10   10     残  32.7   4.6   67.2  ○
                              表3
  重量                               测试条件                        测试结果
                                组成          尾线长度(μ m) 高温焊接强度(gf) 珠的外部特性
重量％ 重量ppm 平均值   标准偏差
  Pd   Bi   Y     La   Ca     Be Au
比较例1比较例2比较例3比较例4比较例5   --0.17.01.0  -202020   -----     -----   -----     ----- 残残残残残   75.248.146.058.956.1   32.312.71 1.014.421.4   5.214.816.444.133.2  ○○○○○
比较例6比较例7比较例8比较例9   1.0--3.5  2002020-   -10--     ---10   ----     --10- 残残残残   38.146.450.939.1   6.78.79.520.1   -13.515.833.4  ×○○○
按照本发明，提供了加入Pd和Bi规定含量的新金合金、特别适合形成IC芯片的凸起，获得下述效果。
(1)可以用短的长度稳定地形成简单的拉断的尾线。结果，利用简单拉断方法可能稳定地形成凸起，并且有利用改善半导体器件的可靠性。
(2)能改善高温焊接强度，有利于增加半导体器件的可靠性。如果进一步加入至少一种Y、La、Ca、Be中的元素的规定含量，则能进一步改善高温焊接强度，进一步有利于增加半导体器件的可靠性。
此外，利用上述金合金引线和简单的拉断方法形成凸起。
(1)利用简单的拉断操作能够稳定地形成具有均匀尾线长度的金凸起，其有利于改善合格率。
(2)能够改善高温焊接强度，有利于增加半导体器件的可靠性。
此外，利用上述金合金引线和利用凹槽式拉断方法形成凸起。
(1)能把尾线长度设置成所希望的长度，因此能更均匀地和简短地制造尾线长度，
(2)能够改善高温焊接强度，有利于增加半导体器件的可靠性。
                      例42到例47
在真空炉中熔化按重量比为99.999％的高纯度金和Pd、Bi的规定含量的混合物，浇注获得如表4所示成分的金合金锭，即，按重量比为1.0％Pd和按重量比为30ppm Bi。利用槽状辊拉断机冷加工合金锭，中间进行退火，获得直径为30μm的细线。最后退火引线，具有4％的延伸率。
利用自动引线焊接机(UTC-50型，Shinkawa  K、K)，利用超声热压焊接方法，由上述获得的金合金线，把焊接线连到IC芯片100铝电极和引线框架之间。
利用测量显微镜(STM-MJS型、olympus k、K)测量上述样品的环形高度。如图4所示，环形高度是由IC芯片11的顶面到环形最高点的高度H。对每个例子测量100样品，利用100样品环形高度的平均高度作为表4的环形高度。
对于每个例子把几百个样品放置在200℃下，经过500小时，利用剪切试验机测量剪切强度。在表4中，利用50样品的平均值作为高温焊接强度。
                   表4实施                   组成                 结果例号                                               高温焊
  pd     Bi  Y  La   Ca  Be  Au    环形高度    接强度
 (wt％)    (重量比ppm)              (μ m)      (gf)42    1.0    30  -   -   -   -   余      84         6743    1.0    1   -   -   -   -   余      110        6144    1.0    30  50  -   -   -   余      88         6845    1.0    30  -   50  -   -   余      87         6846    1.0    30  -   -   50  -   余      92         6547    1.0    30  20  -   -   10  余      90         68
注意，  当使用常规的金合金线时，通常环形高度大于170μm，高温焊接强度通常小于30gf。
于是，当利用本发明的金合金引线时，能够基本上减少环形高度，改善高温焊接强度。

Claims (22)

1、金合金引线，其特征是，把按重量比为0.2到5.0％的Pd，按重量比为1到100ppm的Bi加入到按重量比至少为99.99％纯度的金中。
2、按照权利要求1的金合金引线，其特征是，所述金的所述纯度按重量比至少为99.999％。
3、按照权利要求1的金合金引线，其特征是，Pd的所述含量按重量比是0.5到5.0％。
4、按照权利要求1的金合金引线，其特征是，按重量比，Bi的所述含量是1到40ppm。
5、按照权利要求1的金合金引线，其特征是，把按重量比为3到250ppm含量的选自Y、La、Ca、Be中的至少一种元素加入到所述的金中。
6、按照权利要求5的金合金引线，其特征是，所述的至少一种元素的所述含量按重量比是3到70ppm。
7、按照权利要求5的金合金引线，其特征是，把选自Y、La、Ca、Be中的至少三种元素加入到金中。
8、按照权利要求5的金合金引线，其特征是，把至少Y、La、Ca三种元素加入到所述的金中。
9、按照权利要求1的金合金引线，其特征是，所述的引线特别适合形成凸起。
10、按照权利要求1的金合金引线，其特征是，所述的引线特别适合于引线焊接。
11、形成金合金凸起的方法，包括下列步骤：
通过毛细管在金合金引线的末端形成熔珠，
降低所述的毛细管，把所述的熔珠压焊到IC芯片的电极上，
上拉所述的合金引线，从焊接到所述电极上的熔珠上面，拉断所述的合金引线，因此在所述IC芯片的所述电极上形成金合金凸起，
其中所述金合金引线有下述组成，把按重量比为0.2到5.0％的Pd，和按重量比为1到100ppm的Bi加入到按重量比至少为99.99％纯度的金中。
12、按照权利要求11的方法，其特征是，所述金的所述纯度按重量比是99.999％。
13、按照权利要求11的方法，其特征是，所述Pd的含量按重量比是在0.5到5.0％。
14、按照权利要求11的方法，其特征是，进一步把按重量比为3到250ppm含量的选自Y、La、Ca、Be组中的至少一种元素加入到所述的金中。
15、按照权利要求14的方法，其特征是，把至少Y、La、Ca三种元素加入到所述金中。
16、形金合金凸起的方法，包括下列步骤：
通过毛细管在金合金引线的末端形成球，
降低所述毛细管把所述球压焊到IC芯片的电极上，
把所述球上面的所述金引线切出凹槽，
上拉所述金合金引线，从焊接到所述电极上的所述凸起上面拉断所述金合金引线，因此形成位于所述IC芯片所述电极上的金合金凸起，
其中所述合金引线具有下面的组成，把按重量比为0.2到5.0％的Pd和按重量比为1到100ppm的Bi加入到按重量比为至少99.99％纯度的金中。
17、按照权利要求16的方法，其特征是，所述金的所述纯度按重量比是99.999％。
18、按照权利要求16的方法，其特征是，所述Pd的含量按重量比是在0.5到5.0％。
19、按照权利要求16的方法，其特征是，进一步把按重量比为3到250ppm的选自Y、La、Ca、Be组中至少一种元素加入到所述金中。
20、按照权利要求19的方法，其特征是，把至少Y、La、Ca三种元素加入到所述的金中。
21、引线焊接方法，其特征是，所用引线具有下述组成，把按重量比为0.2到5.0％的Pd和按重量比为1到100ppm的Bi加入到按重量比至少为99.99％纯度的金中。
22、按照权利要求21的方法，其特征是，进一步把按重量比为3到250ppm含量的选自Y、La、Ca、Be组中的至少一种元素加入到所述的金中。
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