DE69707559D1 - Draht aus Goldlegierung und Herstellungsverfahren eines Höckers - Google Patents

Draht aus Goldlegierung und Herstellungsverfahren eines Höckers

Info

Publication number
DE69707559D1
DE69707559D1 DE69707559T DE69707559T DE69707559D1 DE 69707559 D1 DE69707559 D1 DE 69707559D1 DE 69707559 T DE69707559 T DE 69707559T DE 69707559 T DE69707559 T DE 69707559T DE 69707559 D1 DE69707559 D1 DE 69707559D1
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DE
Germany
Prior art keywords
manufacturing process
alloy wire
gold alloy
bump manufacturing
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69707559T
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English (en)
Other versions
DE69707559T2 (de
Inventor
Akimoto Hideyuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
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Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Publication of DE69707559D1 publication Critical patent/DE69707559D1/de
Application granted granted Critical
Publication of DE69707559T2 publication Critical patent/DE69707559T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
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    • B23K35/3013—Au as the principal constituent
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    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/20—Parameters
    • H01L2924/207—Diameter ranges
    • H01L2924/20753—Diameter ranges larger or equal to 30 microns less than 40 microns

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
DE69707559T 1996-05-28 1997-05-28 Draht aus Goldlegierung und Herstellungsverfahren eines Höckers Expired - Lifetime DE69707559T2 (de)

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JP13354696A JP3328135B2 (ja) 1996-05-28 1996-05-28 バンプ形成用金合金線及びバンプ形成方法

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JP (1) JP3328135B2 (de)
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DE (1) DE69707559T2 (de)
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US6858943B1 (en) 2003-03-25 2005-02-22 Sandia Corporation Release resistant electrical interconnections for MEMS devices
EP1811555A4 (de) * 2004-09-30 2012-06-20 Tanaka Electronics Ind Au-legierungs-bonddraht
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US7595560B2 (en) * 2005-02-22 2009-09-29 Nec Electronics Corporation Semiconductor device
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JP3222054B2 (ja) 1996-02-06 2001-10-22 信越化学工業株式会社 ゴム組成物

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Publication number Publication date
EP0810293A1 (de) 1997-12-03
US6213382B1 (en) 2001-04-10
KR100275001B1 (ko) 2001-01-15
CN1065001C (zh) 2001-04-25
JPH09321076A (ja) 1997-12-12
CN1173546A (zh) 1998-02-18
EP0810293B1 (de) 2001-10-24
JP3328135B2 (ja) 2002-09-24
MY120121A (en) 2005-09-30
TW327697B (en) 1998-03-01
US6159420A (en) 2000-12-12
KR970077400A (ko) 1997-12-12
DE69707559T2 (de) 2002-05-16

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