CN101032012A - 引线接合隆起物材料 - Google Patents

引线接合隆起物材料 Download PDF

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Publication number
CN101032012A
CN101032012A CNA2005800331056A CN200580033105A CN101032012A CN 101032012 A CN101032012 A CN 101032012A CN A2005800331056 A CNA2005800331056 A CN A2005800331056A CN 200580033105 A CN200580033105 A CN 200580033105A CN 101032012 A CN101032012 A CN 101032012A
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China
Prior art keywords
alloy
quality
surplus
ppm
quality ppm
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CNA2005800331056A
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English (en)
Inventor
三上道孝
有川孝俊
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Tanaka Denshi Kogyo KK
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Tanaka Denshi Kogyo KK
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Publication of CN101032012A publication Critical patent/CN101032012A/zh
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3013—Au as the principal constituent
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Abstract

解决公知的Au引线接合隆起物材料所具的问题点而予完成，且以下述为目的。(1)需使接合(焊接)至Al焊垫的Au－Ag合金隆起物的焊球形状接近真圆。(2)需可使接合至Al焊垫的Au－Ag合金隆起物的可靠信提高。(3)需缩短Au－Ag合金隆起物的尾部长度。(4)需提高耐焊剂熔蚀性。(5)需减少由引线接合隆起物引起的毛细管压接工具尖端或尖端附近的孔洞被沾污的程度。本发明是以于由Au基体与微量添加元素所构成的纯度99.99质量％以上的Au合金内，使含有纯度99.99质量％以上的Ag 1～40质量％而成的Au－Ag合金为特征的引线接合隆起物材料。

Description

引线接合隆起物材料
技术领域
本发明是有关适于利用引线接合焊接技术形成金属突起的引线接合隆起物材料。
背景技术
至于连接IC芯片或晶体管等的集成电路组件上的电极焊垫与TAB(Tape Automated Bonding)的引线或引导框架或陶瓷基板上的外部端子的方法，已知有利用引线接合焊接方法形成金属突起的方法。这种引线接合隆起物方法，是介经隆起物直接连接IC芯片的电极焊垫与外部端子，和以焊接连线连接的情况相比，因可降低接合部分的高度，而有适于制造高密度封装体或薄型封装体的优点。例如在IC芯片的电极部上形成隆起物，使和对抗这一隆起物的印刷电路基板的导体电路上的溶融焊剂接合的倒装片(flip chip)法或使和已进行镀焊的Cu胶带熔融接合的输送用胶带法等。
在至今为止的此种引线接合隆起物材料，由所谓纯度99.99质量％以上的Au合金的必要条件，以高纯度的Au被使用作Au基体。但是，于已使用高纯度Au的引线接合隆起物材料，在超细线上形成焊球并进行IC芯片压焊后，以挟持器挟持引线接合部分并扯断引线接合时，则于经予残留在IC芯片上的焊球，即是隆起物一侧上，有尾部长长的残留焊球而成为连接不良的主要原因的问题存在。至于Au基体，已开发有Au：0.5～10重量％Pd合金(日本专利第2,737,953号公报)或Au：0.003～5重量％Pd合金(日本特开平9-321076号公报)或Au：0.001～5重量％的Pt、Pd或Ru合金(日本特开平10-287936号公报)等，已进行缩短尾部长度的研究。但是，Pd等的铂族金属是昂贵而且99.99％以上的高纯度者需要特殊设备，较Au亦需较高的费用，所以以99.9％的纯度较常被使用，所以含有大量杂质所致。另外，如果增加铂族金属的添加量时，会使毛细管压接工具(capillary)内部受沾污，这一沾污附着在引线接合上而形成非为真球状的焊球，产生焊球变硬且在Al焊垫正下方的Si芯片龟裂的问题，所以实用上以Au：1％Pd合金被使用着。
这种Au：1％Pd合金虽然有可使经予形成在Al焊垫和Au-Pd合金隆起物间的AuAl化合物的成长延迟的优点，但是仍然在扯断引线接合之际会经常使尾部长度生出较长。另外，最近软焊操作有在200℃～300℃高温进行的倾向，特别是无Pb的Sn系焊剂以在高温操作的倾向较显着。如果这一操作温度成为高温时，于Au-Pd合金隆起物方面，因有Au会迅速的溶化在焊剂内的焊剂熔蚀的现象生成，所以不得不在严格的温度管理下进行软焊操作。因此，已提高Pd浓度的Au：5％Pd合金也被考虑着，但是在大气中进行焊球焊接时因会形成硬质焊球，而有对焊垫生成芯片损伤变大的问题，又Pd有价格变动较大的问题，因有上述的毛细管压接装置受沾污或尾部长度的问题等，以至无法实用化。
专利文献1：日本专利第2,737,953号公报
专利文献2：日本特开平9-321076号公报
专利文献3：日本特开平10-287936号公报
本发明欲解决的课题
本发明是为了解决上述公知的Au引线接合隆起物材料所具的问题点，而予完成者。本发明是以下述者为目的。
(1)需使接合(焊接)至Al焊垫的Au-Ag合金隆起物的焊球形状接近真圆。
(2)需可使接合至Al焊垫的Au-Ag合金隆起物的可靠信提高。
(3)需缩短Au-Ag合金隆起物的尾部长度。
(4)需提高耐焊剂熔蚀性。
(5)需减少由引线接合隆起物引起的毛细管压接工具尖端或尖端附近的孔洞被沾污的程度。
本发明解决课题而采的手段
如果依照本发明时，是予以提供下示的引线接合隆起物材料。
(1)以在由Au基体与微量添加元素所构成的纯度99.99质量％以上的Au合金内，使含有纯度99.99质量％以上的Ag 1～40质量％而成的Au-Ag合金为特征的引线接合隆起物材料。
(2)以该微量添加元素是含有Ca 5～50质量ppm、Be 1～20质量ppm和/或稀土元素5～90质量ppm为特征的前述(1)记载的引线接合隆起物材料。
(3)以该微量添加元素是含有由Ge、Mg、Sr、Bi、Zn、Si、Ga、Sn、Sb、B和Li之中选出的至少一种10～90质量ppm为特征的前述(1)记载的引线接合隆起物材料。
(4)以该微量添加元素是含有Ca 5～50质量ppm、Be 1～20质量ppm和/或稀土元素3～90质量ppm，再含有由Ge、Mg、Sr、Bi、Zn、Si、Ga、Sn、Sb、B和Li之中选出的至少一种10～90质量ppm(但是，B和Li各自单独时，则是0.5～40质量ppm)为特征的前述(1)记载的引线接合隆起物材料。
(5)以使该Au基体含有Ag 5～25质量％而成的Au-Ag合金为特征的前述(1)～(4)记载的引线接合隆起物材料。
(6)以该稀土元素系Y、La、Ce、Eu、Nd，Gd和/或Sm为特征的前述(2)或(4)记载的引线接合隆起物材料。
(7)以该引线接合隆起物材料是使Pb系焊剂或Sn系焊剂接合为特征的前述(1)～(6)记载的引线接合隆起物材料。
(8)以该引线接合隆起物材料是使无Pb-Sn系焊剂与倒装片接合为特征的前述(1)～(6)记载的引线接合隆起物材料。
(9)以该引线接合隆起物材料是使熔点170℃～260℃的无Pb-Sn系焊剂和倒装片接合为特征的前述(1)～(6)记载的引线接合隆起物材料。
本发明的功效
以下就需使接合至Al焊垫的Au-Ag合金隆起物的软质焊球形状接近真圆，予以说明。
以本发明的Au-Ag合金，因在大气中形成焊球时可得软质的真圆球，所以不致损伤Al焊垫的芯片。另外，在大气中焊接至Al焊垫时，Ca、Be或稀土元素、或Ge、Mg、Sr、Bi、Zn、Si、Ga、Sn、Sb、B或Li的元素群组的微量添加元素受氧化而不成为异形的焊球。因此，即使焊垫面积变小也对已瞄准的位置以指定面积的真圆可准确的进行隆起物接线用的焊球焊接。
接着，就使Au-Ag合金隆起物的接合至Al焊垫的可靠性提高的功效，予以说明。
在本发明的高纯度的Au-Ag合金基体方面，因使在纯Al或Al合金的Al焊垫上的Al与Au间的金属间化合物迟缓形成，而于这一金属间化合物内不生成Au4Al，所以可使焊接至Al焊垫的可靠性提高。Al焊垫如果是纯Al或以Al为主成分的合金(例如，Al：80％Cu合金等)时即可。再者，在以树脂成形时，因不生成Al及Au间的金属间化合物，所以可防止封装树脂中的卤素元素引起的腐蚀。
接着，就可缩短Au-Ag合金隆起物的尾部长度引起的功效，予以说明。
在本发明的高纯度Au-Ag合金基体方面，即使微量添加元素较纯Au基体可更加奏效，使以微量添加元素和杂质元素的合计仅含最大100ppm时(但Ag成分除外)，也可缩小隆起物的尾部长度的分散性。如果使尾部长度的分散性越缩小时，越可制造出品质均匀的隆起物，所以即使制造多数个隆起物也可增大颈部强度差，且获得可使稳定的功效。
接着，就可使Au-Ag合金隆起物的耐焊剂熔蚀性提高的功效，予以说明。
在本发明的高纯度Au-Ag合金基体方面，为了使耐焊剂熔蚀性提高，即使焊接焊剂和倒装片，Au-Ag合金隆起物本身也不致消失焊剂中。因此对特定的焊剂材料可使用的温度范围较广，所以对焊接焊剂的操作管理就可较宽松。而且，因可缩小隆起物的尾部长度的分散性，可选择性地仅使Au-Ag合金隆起物的尾部部分消失，就成可渐渐缩小尾部长度的分散性。特别是Au-Ag合金基体中的Ag如果在5～25质量％的范围时，因可使高温下的耐焊剂熔蚀性再提高，所以可制出已稳定地倒装片构造。另外，因熔蚀在焊剂中的Au等元素减少，所以于焊剂中不致生成脆弱的化合物。
发明内容
本发明的引线接合隆起物材料是由Ag-Ag合金而成，且含有微量添加元素。此时，含Ag量为1～40质量％，优选为5～25质量％。Ag的纯度为99.99质量％的以上。
在本发明所用的微量添加元素的第1形态方面，是采用Ca、Be和/或稀土元素(也称作群组A之元素)。这些元素可单独或组合二种以上使用。这些元素的含量，如果是Ca时，采用5～50质量ppm，优选为8～35质量ppm。如果是Be时，采用1～20质量ppm，优选为3～18质量ppm。如果是稀土元素时，则采用5～90质量ppm。如果是采用复数的这些微量添加元素时，则它的合计量是90质量ppm以下，优选为50质量ppm以下。
至于稀土元素，优选为采用由Y、La、Ce、Eu、Nd、Gd和Sm之中选出的至少一种。
在本发明所用的微量添加元素的它的他形态方面，优选为可采用Ge、Mg、Sr、Bi、Zn、Si、Ga、Sn、Sb、B和Li中选出的至少一种。这些元素(也称作群组B之元素)的含量是10～90质量ppm。最优选被采用的元素是Ge、Bi、Si、Sn、Sb、B和/或Li。
在采用Ge、Bi、Si、Sn和/或Sb(也称作群组B1之元素)时，它的含量是10～90质量ppm，优选为15～60质量ppm。
如果是含有复数的前述群组B之元素时，则它的合计含量是90质量ppm以下，优选为50质量ppm以下。
在本发明所用的微量添加元素的再一其它形态方面，则采用群组A的元素和群组B的元素的组合。此时，群组A的元素的含量，如果是Ca时，采用5～50质量ppm，优选为8～35质量ppm。如果是Be时，采用1～20质量ppm，优选为3～18质量ppm。如果是稀土元素时，则采用3～90质量ppm。如果是采用复数的群组A的元素时，则它的合计含量是90质量ppm以下，优选为50质量ppm以下。
于群组B的元素方面，该元素仅是B和/或Li(也称作群组B2之元素)时，它的含量是0.5～40质量ppm，优选为0.5～15质量ppm。如果是采用复数的群组B2的元素时，则它的合计含量优选为15质量ppm以下。
在含有群组A、群组B1、群组B2时，该群组B2的元素含量是0.5～40质量ppm，优选为0.5～15质量ppm。另外，这时的合计含量是90质量ppm以下，优选为50质量ppm以下。
接着，就需使接合至Al焊垫的Au-Ag合金隆起物的焊球形状接近真圆的作用，予以说明。
通常，由Au及微量添加元素所构成的纯度99.99质量％以上的Au合金较易制得真球，Au-数％Pd合金也在大气中容易制得真球。如果是Au-Ag合金时，由Ag容易包住高温大气中的氧，如果含Ag量增多时，则微量添加元素受氧化而容易形成硬质的异形焊球，焊接时易对Al焊垫造成损伤。因此将含Ag量的上限设成40％以下，即使在大气中进行球焊也可在Al焊垫上制得真圆。再者，通过采用纯度99.99质量％以上的Ag，使可在Au内含有高浓度的Ag，也可制得软质的焊球，且将Ca设成5～50质量ppm，将Be设成1～20质量ppm和/或将稀土元素设成5～90质量ppm，或微量添加Ge、Mg、Sr、Bi、Zn、Si、Ga、Sn、Sb、B或Li的至少一种，共计10～90质量ppm(但是，B和Li各自单独时，0.5～40质量ppm)，就可得真圆。
前者的微量添加元素群组(群组A元素)对Au-Ag基体的功效较后者的群组B的元素有效。在此，前者的微量添加元素群组之中，选择Ca是5～50质量ppm的理由，是在未满5质量ppm时，Au-Ag合金隆起物较难于Al焊垫上使焊球形状形成接近真圆，而如果超过50质量ppm时，则焊球形状较易压扁所致。Be和稀土元素的上限.下限理由也是相同的。稀土元素之中，特别以Y、La、Ce、Eu或Nd的元素在10～90质量ppm的范围可较易制得稳定的真圆。另一方面，制作和后者的Au的共晶合金的元素群组在对Au-Ag基体的大气中，虽然也较前者的群组的元素较难获得真球的功效，但如果含有Ge、Mg、Sr、Bi、Zn、Si、Ga、Sn、Sb、B或Li的至少一种，共计10～90质量ppm(但是，B和Li各自单独时，0.5～40质量ppm)时，使已对应于小节距的Au-Ag合金隆起物的焊球形状可接近实用上不成问题的真圆，加上可满足纯度99.99质量％以上的Au合金(但是，Ag成分除外)。如果这些元素未达10质量ppm(但是，B和Li各自单独时，0.50质量ppm)时，就无法制得令人满意的真圆。
另外，如果超过90ppm时，就无法满足99.99质量％以上的Au合金(但是，Ag成分除外)。因此，除有无法以所谓「高纯度的Au」的表示的不方便外，于无法均匀的合金化时，就有Au-Ag合金隆起物较难在Al焊垫上使焊球形状形成接近真圆的情形。特别是，B和Li各自单独时，如果超过40质量ppm时，就较难将焊球形状形成真圆。
在纯度99.99质量％以上的Au合金内，因这些前者和后者的微量添加元素群组和不可避免的杂质(但是，Ag成分除外)即或最多仅含未满100质量ppm，故不论何时均可制得稳定的真圆。
接着，就需可使接合至Al焊垫的Au-Ag合金隆起物的可靠信提高的作用，予以说明。
Au-Ag合金基体较纯金基体或Au-Pd合金基体可使Al焊垫上的Al及Au间的金属间化合物的成长迟缓，且在这一金属间化合物内以焊接连线并不形成Au4Al是为人所知的。即使以本发明的已添加微量添加元素群组的隆起物用的Au-Ag合金基体，已知微量添加元素群组也停留在基体中而不生成与Al不反应的纯金基体或Au-Pd合金基体类Au4Al。如此一来，Au-Ag合金基体也较Au基体或Au-Pd合金基体可使Al及Au间的金属间化合物的成长迟缓。又，已添加指定量的上述微量添加元素群组的Au-Ag合金基体系形成真圆。而且，在微量添加元素最多仅含100ppm时，因可保持纯度99.99质量％以上的Au合金(但是，Ag成分除外)，与焊接连线情形同样的可使接合至Al焊垫的Au-Ag合金隆起物的可靠信提高。且，即使含有Ge、Mg、Sr、Bi、Zn、Si、Ga、Sn、Sb、B或Li的至少一种以上，共计0.009～0.3质量ppm，这些元素群组因于通常的熔解，铸造操作中会微细的分散于Au-Ag合金基体，可知并无对Al焊垫的芯片损伤问题。
它之次，就需缩短Au-Ag合金隆起物尾部长度的作用，予以说明。
本发明人等认为隆起物尾部长度的分散性在于隆起物引线接合本身的强度与热影响部的强度间的差异(称此为「颈部强度差异」)。于Au-Ag合金中的Ag未满1质量％方面，即使仅添加指定量的微量添加元素，Au-Ag合金基体本身也和纯Au基体同样的较易退火(annealing)。隆起物引线接合已退火时，引线接合强度变弱且颈部强度差异变小。结果，隆起物引线接合的被扯掉的位置即成为零零散散的，尾部长度容易形成参差不齐。因此通过采用指定比例的Au-Ag合金基体，亦可较纯金基体或Au-Pd合金基体增大颈部强度差异。另外，如果未添加指定量程度的微量添加元素于Au-Ag合金基体中时，则Au-Ag合金因由高纯度的Au和高纯度的Ag所构成，所以热影响部会变长。结果因会使尾部长度变得参差不齐，故须于Au-Ag合金基体中添加微量添加元素。由颈部强度差异的观点，于Au-Ag合金基体的较优选的含Ag量是在5～25质量％的范围。如果使含有Ca 5～50质量ppm、含有Be 1～20质量ppm或稀土元素5～90质量ppm的至少一种的元素群组时，即使微量也可缩短热影响部的功效，较纯金基体或Au-Pd合金基体大。特别是，稀土元素中的Y、La、Ce、Eu或Nd在缩短热影响部的功效是较大的。但是，这些元素如果未满下限时，即或纵然Au-Ag合金基体中的含Ag量在5～25质量％的范围，因热影响部变长，故需订出规定的下限量。
且，这些元素虽然即使超过上限也具有可缩短热影响部的功效，但如上述般，由焊球形状容易变形等的理由，需予限制上限。另一方面，Ge、Mg、Sr、Bi、Zn、Si、Ga、Sn、Sb、B或Li的元素群组如果无法添加较多量时，就无法显现出可缩短热影响部的功效，若这些元素未达10ppm质量时，纵或Au-Ag合金基体中的含Ag量在5～25质量％的范围，也无法获得缩短热影响部的令人满意的功效。另外，即使使含有超过90ppm至0.3质量，虽然也可得缩短热影响部的功效，如果超过90ppm时，就无法满足纯度99.99质量％以上的Au合金(但是，Ag成分除外)。在纯度99.99质量％以上的Au合金方面，这些的前者及后者的微量添加元素群组(但是，Ag成分除外)因最多仅含未满100ppm质量，故不论何时均可得缩短以稳定地热影响部的功效。特别是，在Au-Ag合金基体中的含Ag量如果在5～25质量％的范围时，可知最能获得使热影响部缩短的功效。
接着，就需提高耐焊剂熔蚀性的作用，予以说明。
至于焊剂材料，已知有以Pb为主成分的合金(Pb合金、Pb：0.3质量％Sn合金、Pb：5质量％Sn合金)或无Pb合金(Sn合金、Sn：3.5质量％Ag合金、Sn：0.8质量％Cu合金、Sn：0.5质量％Ni合金、Sn：1.0质量％Zn合金，Sn：3.5质量％Ag：0.5质量％Cu合金、Sn：20质量％In合金等)。Au-Ag合金基体是对这些焊剂材料较纯Au基体可提高焊剂熔蚀性，特别是可知提高焊剂在高温下的熔蚀性。特别是，Au-Ag合金基体中的含Ag量如果在5～25质量％范围时，则可更提高焊剂在高温下的熔蚀性。添加元素的添加量由于微量，故对Au-Ag合金基体中的耐焊剂熔蚀性的影响力较少，经予添加指定量程度的微量添加元素的Au-Ag合金基体，不论何者均较纯金基体或Au-Pd合金基体可使耐焊剂熔蚀性提高。
具体实施方式
实施例
在99.999质量％的高纯度金和99.999质量％的高纯度Ag(单位是质量％)内添加微量添加金属(单位是质量ppm)至配合成表内记载的数值的实施品的成分组成，以真空熔解炉进行熔解铸造。将这一熔液进行拉丝加工，最后热处理至线径成25μm。在大气中使用日本新川股份公司制造的引线接合焊接机(UTC-400型)，在放电时间0.3毫秒对这一极细线制作焊球于边长100μm的纯Al焊垫上，以通用条件进行引线接合焊接(焊球直径62μm、焊球的溃散直径80μm)时，所有的焊球是经予形成于边长100μm的Al焊垫内。它的结果示于表内。
在此，「焊球形成性」是制作100个焊球，表示出以400倍的实体显微镜观察该焊球的外观时的结果，良好者以◎表示，可使用作有小缩孔的焊球以○表示，缩孔或焊球变形且无法形成焊球者以×表示。另外，「焊接焊球直径」是使用奥林巴斯股份有限公司制造的测长显微镜(TM-MJS型)并各以100个在纵向(Y)和横向(X)测定焊球在Al焊垫上的大小，取它的平均值。因此，以最小二次方法求取这些平均值的偏差(以「焊接焊球稳定性」表示)，以该值在0.96以上判定为◎，在0.90～未满0.96判定为○，在未满0.90判定为×。另外，「剪切强度」是采用DAGE公司制造的剪切强度测试机(PC-2400)，各以100根于上侧方向(Z)拉伸时的断裂强度的平均值。以这时的隆起物的尾部长度为「颈部高度分散性(范围)」予以测定，并以平均值表示。因此，以这一「颈部高度分散性(范围)」未满20μm判定为◎，20μm～未满30μm判定为○，30μm以上判定为×。又，「芯片损伤」是将以400倍的实体显微镜观察各对100个观察焊球在Al焊垫上的周围所发生的龟裂的外观时的结果，以个数表示，未发生龟裂以◎表示，龟裂数自1个至4个以○表示，5个以上以×表示。
另外，「加热试验」是使100个Au合金隆起物与Sn：3.5质量％的Ag合金对向，以倒装片构造保持后，于250℃加热60秒钟进行平坦化热处理。因此，各对10个以400倍的实体显微镜观察平坦化热处理前的截面积的50％以上判定为◎，30～未满50％判定为○，10～未满30％判定为×。这时，平坦化热处理前的截面积的50％以上为◎，是不论何者扯掉时出现的须状尾部部分，由于熔解在Sn：3.5质量％的Ag合金中，所以隆起物高度在焊剂中可予均匀的对齐。另一方面，平坦化热处理前的截面积的10％以下是×，即使连隆起物本体也会熔解而消失在Sn：3.5质量％的Ag合金中，所以无法进行隆起物焊接。
表1-1
  Au   Ag％   Cappm   Beppm                      稀土类(ppm)                                  其它(ppm)
Y La Ce Nd Sm Eu Gd Ge Mg Sr Bi Zn Si Ga Sn Sb B Li
  比较例1   余量   0.3   20
  比较例2   余量   45   10   10
  比较例3   余量   15
  比较例4   余量   3   20
  比较例5   余量   30   10
  比较例6   余量   10   5
  比较例7   余量   15   60
  比较例8   余量   20   0.3
  比较例9   余量   10   30
  比较例10   余量   15   2
  比较例11   余量   20   20   20   20   20   20
  实施例1   余量   10   20
  实施例2   余量   15   10
  实施例3   余量   20   20
  实施例4   余量   10   20
  实施例5   余量   15   20
  实施例6   余量   20   20
  实施例7   余量   10   20
  实施例8   余量   15   20
  实施例9   余量   20   20
  实施例10   余量   10   50
  实施例11   余量   15   20
  实施例12   余量   20   50
  实施例13   余量   10   50
  实施例14   余量   15   50
  实施例15   余量   20   50
  实施例16   余量   10   50
表1-2
Au Ag％ Cappm Beppm 稀土类(ppm) 其它(ppm) Au Ag％ Cappm Beppm 稀土类(ppm) 其它(ppm) Au   Ag％   Cappm   Beppm   稀土类(ppm)   其它(ppm) Au
  实施例17   余量   15   50
  实施例18   余量   20   50
  实施例19   余量   10   1
  实施例20   余量   15   10
  实施例31   余量   15   20   10
  实施例32   余量   20   20   10   10
  实施例33   余量   10   10   10   10
  实施例34   余量   15   10   10   10
  实施例35   余量   20   10   10   1   10
  实施例39   余量   20   10   10   10   10
  实施例40   余量   5   20   20   20
  实施例41   余量   15   50   10   10   10
  实施例42   余量   20   10   10   10
  实施例43   余量   5   10   15   30   10
  实施例44   余量   15   10   30   10
  实施例45   余量   20   10   50   20
  实施例46   余量   5   10   15   10   10
  实施例47   余量   15   5   50   10
  实施例48   余量   20   10   10   20   10
  实施例49   余量   5   10   15   10   10
  实施例50   余量   15   10   5   50   10
  实施例51   余量   20   10   10   10   10   10   20   10
  实施例52   余量   5   10   15   10   10   10   10   10
  实施例53   余量   15   10   5   10   50
  实施例54   余量   15   30   5
  实施例55   余量   5   10   15   10
  实施例56   余量   15   5   30   10
[表2-1]
  焊球形成性   焊接焊球直径   焊接焊球稳定性   剪切强度   芯片损伤   颈部高度分散性            加热试验
  X   Y   X/Y   判定   龟裂数   判定   判定   隆起物数量   判定
       μm   kg/m2   μm   ％
  比较例1   ◎   73.0   75.0   0.973   ○   9.1   0   ◎   55   ×   1   ×
  比较例2   ×   28   ×
  比较例3   ◎   68.0   71.2   0.955   ×   10.5   0   ◎   36   ×   70   ◎
  比较例4   ◎   72.5   74.4   0.974   ○   9.2   0   ◎   51   ×   16   △
  比较例5   ◎   65.3   66.6   0.980   ○   11.7   2   ◎   38   ×   85   ◎
  比较例6   ◎   68.7   69.2   0.993   ◎   10.2   0   ◎   42   ×   60   ◎
  比较例7   ×
  比较例8   ◎   67.2   71.2   0.944   ×   11.0   0   ◎   40   ×   72   ◎
  比较例9   ×
  比较例10   ◎   68.1   71.7   0.950   ×   10.3   0   ◎   39   ×   64   ◎
  比较例11   ×
  实施例1   ◎   68.2   70.1   0.973   ○   11.2   0   ◎   20   ◎   71   ◎
  实施例2   ◎   68.5   70.5   0.972   ○   11.5   0   ◎   29   ○   76   ◎
  实施例3   ◎   67.5   69.3   0.974   ○   11.9   0   ◎   18   ◎   83   ◎
  实施例4   ◎   67.0   69.7   0.961   ○   11.2   0   ◎   19   ◎   70   ◎
  实施例5   ◎   67.4   70.3   0.959   ×   11.4   0   ◎   19   ◎   77   ◎
  实施例6   ◎   67.2   69.5   0.967   ○   11.9   0   ◎   17   ◎   81   ◎
  实施例7   ◎   68.5   70.0   0.979   ○   11.1   0   ◎   19   ◎   70   ◎
  实施例8   ◎   68.7   70.5   0.974   ○   11.4   0   ◎   20   ◎   75   ◎
  实施例9   ◎   67.6   69.4   0.974   ○   11.9   0   ◎   16   ◎   80   ◎
  实施例10   ◎   68.5   69.3   0.988   ○   11.1   0   ◎   18   ◎   70   ◎
  实施例11   ◎   67.6   69.1   0.978   ○   11.4   0   ◎   20   ◎   74   ◎
  实施例12   ◎   67.3   68.5   0.982   ○   11.8   0   ◎   18   ◎   82   ◎
  实施例13   ◎   68.5   69.3   0.988   ○   11.2   0   ◎   20   ◎   68   ◎
  实施例14   ◎   67.7   68.7   0.985   ○   11.4   0   ◎   19   ◎   74   ◎
实施例15 ◎ 67.2 68.6 0.980 ○ 11.9 0 ◎ 18 ◎ 82 ◎
  实施例16   ◎   68.5   69.8   0.981   ○   11.3   0   ◎   18   ◎   69   ◎
判定基准   ◎   良好   0.96   0   ＜20   50％
○   较小的缩孔 ＜0.96 ＜5 ＜30 30％
  △   10％＜
×   不能形成焊球 ＜0.90 5 30 10％
[表2-2]
  焊球形成性   焊接焊球直径   焊接焊球稳定性   剪切强度   芯片损伤   颈部高度分散性          加热试验
  X   Y   X/Y   判定   龟裂数   判定   判定   隆起物数量   判定
       μm   kg/mm2   μm   ％
  实施例17   ◎   67.8   68.5   0.990   ○   11.5   0   ◎   17   ◎   73   ◎
  实施例18   ◎   67.4   68.3   0.987   ○   11.9   0   ◎   18   ◎   81   ◎
  实施例19   ◎   68.4   69.5   0.984   ○   11.2   0   ◎   22   ○   62   ◎
  实施例20   ◎   67.6   68.5   0.987   ○   11.4   0   ◎   19   ◎   77   ◎
  实施例31   ◎   67.4   68.8   0.980   ○   11.6   0   ◎   16   ◎   76   ◎
  实施例32   ◎   67.4   68.4   0.985   ○   11.9   0   ◎   17   ◎   82   ◎
  实施例33   ◎   68.2   69.2   0.986   ○   10.2   0   ◎   18   ◎   81   ◎
  实施例34   ◎   67.5   68.1   0.991   ◎   10.3   0   ◎   17   ◎   77   ◎
  实施例35   ◎   67.4   68.3   0.987   ○   11.8   0   ◎   19   ◎   80   ◎
  实施例39   ◎   67.5   68.3   0.988   ○   11.5   0   ◎   19   ◎   67   ◎
  实施例40   ◎   68.2   69.7   0.978   ○   9.5   0   ◎   20   ◎   26   △
  实施例41   ○   67.9   68.9   0.986   ○   10.3   0   ◎   20   ◎   75   ◎
  实施例42   ◎   67.8   68.3   0.993   ◎   11.7   0   ◎   19   ◎   79   ◎
  实施例43   ○   68.7   70.1   0.980   ○   9.3   0   ◎   19   ◎   28   △
  实施例44   ◎   68.3   69.7   0.980   ○   10.1   0   ◎   20   ◎   74   ◎
  实施例45   ◎   67.6   68.2   0.991   ◎   11.3   0   ◎   18   ◎   81   ◎
  实施例46   ◎   68.5   68.8   0.995   ◎   9.5   0   ◎   23   ○   33   ○
  实施例47   ◎   68.1   69.3   0.982   ○   10.3   0   ◎   20   ◎   76   ◎
  实施例48   ◎   67.6   68.5   0.986   ○   11.2   0   ◎   18   ◎   81   ◎
  实施例49   ◎   68.7   69.3   0.991   ◎   9.5   0   ◎   20   ◎   27   △
  实施例50   ◎   68.3   69.3   0.985   ○   10.2   0   ◎   19   ◎   74   ◎
  实施例51   ◎   68.4   69.2   0.988   ○   11.2   0   ◎   20   ◎   80   ◎
  实施例52   ◎   68.8   69.4   0.991   ◎   9.3   0   ◎   24   ○   34   ○
  实施例53   ◎   68.2   69.2   0.986   ○   10.1   0   ◎   19   ◎   77   ◎
  实施例54   ◎   69.5   70.9   0.980   ○   10.1   0   ◎   19   ◎   77   ◎
  实施例55   ◎   68.8   70.6   0.975   ○   9.6   0   ◎   21   ○   32   ○
  实施例56   ◎   68.8   70.2   0.981   ○   10.5   0   ◎   20   ◎   74   ◎
判定基准   ◎   良好   0.96   0   ＜20   50％
○   较小的缩孔 ＜0.96 ＜5 ＜30 30％
  △   10％＜
×   不能形成焊球 ＜0.90 5 30 10％

Claims (9)

1、一种引线接合隆起物材料，其特征在于在由Au基体与微量添加元素所构成的纯度99.99质量％以上的Au合金内，使含有纯度99.99质量％以上的Ag 1～40质量％而成的Au-Ag合金而成。
2、如权利要求1所述的引线接合隆起物材料，其特征在于，其中前述微量添加元素是含有Ca 5～50质量ppm、Be 1～20质量ppm和/或稀土元素5～90质量ppm。
3、如权利要求1所述的引线接合隆起物材料，其特征在于，其中前述微量添加元素是含有由Ge、Mg、Sr、Bi、Zn、Si、Ga、Sn、Sb、B及Li之中选出的至少一种10～90质量ppm。
4、如权利要求1所述的引线接合隆起物材料，其特征在于，其中前述微量添加元素是含有Ca 5～50质量ppm、Be 1～20质量ppm及/或稀土元素3～90质量ppm，再含有由Ge、Mg、Sr、Bi、Zn、Si、Ga、Sn、Sb、B及Li中选出的至少一种10～90质量ppm(但是，B及Li各自单独时，则为0.5～40质量ppm)。
5、如权利要求1至4的任一项所述的引线接合隆起物材料，其中前述Au基体是含有Ag 5～25质量％而成的Au-Ag合金。
6、如权利要求2或4所述的引线接合隆起物材料，其特征在于，其中前述稀土元素是Y、La、Ce、Eu、Nd，Gd和/或Sm。
7、如权利要求1至4的任一项所述的引线接合隆起物材料，其特征在于，其中前述引线接合隆起物材料是使Pb系焊剂或Sn系焊剂接合。
8、如权利要求1至4的任一项所述的引线接合隆起物材料，其特征在于，其中前述引线接合隆起物材料是使无Pb-Sn系焊剂与倒装片接合。
9、如权利要求1至4的任一项所述的引线接合隆起物材料，其特征在于，其中前述引线接合隆起物材料是使熔点170℃～260℃的无Pb-Sn系焊剂与倒装片接合。
CNA2005800331056A 2004-09-30 2005-09-29 引线接合隆起物材料 Pending CN101032012A (zh)

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