CN1165591C - 导电粘接剂、安装结构体、液晶装置、电子设备及其制造方法 - Google Patents

导电粘接剂、安装结构体、液晶装置、电子设备及其制造方法 Download PDF

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CN1165591C
CN1165591C CNB991243706A CN99124370A CN1165591C CN 1165591 C CN1165591 C CN 1165591C CN B991243706 A CNB991243706 A CN B991243706A CN 99124370 A CN99124370 A CN 99124370A CN 1165591 C CN1165591 C CN 1165591C
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mentioned
sole plate
electrically conducting
core
conducting adhesive
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CNB991243706A
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CN1254744A (zh
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内山宪治
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BOE Technology Group Co Ltd
BOE Technology HK Ltd
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Seiko Epson Corp
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • G—PHYSICS
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    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
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    • H05K3/341—Surface mounted components
CNB991243706A 1998-11-25 1999-11-24 导电粘接剂、安装结构体、液晶装置、电子设备及其制造方法 Expired - Lifetime CN1165591C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP334212/1998 1998-11-25
JP33421298 1998-11-25
JP30403499A JP3660175B2 (ja) 1998-11-25 1999-10-26 実装構造体及び液晶装置の製造方法
JP304034/1999 1999-10-26

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CN1254744A CN1254744A (zh) 2000-05-31
CN1165591C true CN1165591C (zh) 2004-09-08

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US (1) US6356333B1 (ja)
JP (1) JP3660175B2 (ja)
KR (1) KR100581243B1 (ja)
CN (1) CN1165591C (ja)
TW (1) TW507001B (ja)

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Publication number Priority date Publication date Assignee Title
US6377464B1 (en) * 1999-01-29 2002-04-23 Conexant Systems, Inc. Multiple chip module with integrated RF capabilities
TW487896B (en) * 2000-02-24 2002-05-21 Seiko Epson Corp Mounting structure for semiconductor device, electro-optical device, and electronic apparatus
US6614499B1 (en) * 2000-08-16 2003-09-02 Eastman Kodak Company Electrically addressable display system with alignment reference features and process for forming same
JP3767474B2 (ja) * 2001-01-15 2006-04-19 セイコーエプソン株式会社 表示装置及びその製造方法
JP3711873B2 (ja) * 2001-02-19 2005-11-02 ソニーケミカル株式会社 バンプレスｉｃチップの製造方法
JP2002299810A (ja) * 2001-04-02 2002-10-11 Matsushita Electric Ind Co Ltd 電子部品の実装方法
JP3603890B2 (ja) * 2002-03-06 2004-12-22 セイコーエプソン株式会社 電子デバイス及びその製造方法並びに電子機器
WO2003098338A1 (fr) * 2002-05-22 2003-11-27 Sharp Kabushiki Kaisha Materiau de transfert commun, ecran a cristaux liquides, procede de fabrication d'ecran a cristaux liquides
US6933221B1 (en) * 2002-06-24 2005-08-23 Micron Technology, Inc. Method for underfilling semiconductor components using no flow underfill
JP3722137B2 (ja) * 2002-08-21 2005-11-30 セイコーエプソン株式会社 半導体装置の実装方法、半導体装置の実装構造、電気光学装置、電気光学装置の製造方法及び電子機器
JP2004145129A (ja) * 2002-10-25 2004-05-20 Advanced Display Inc 表示装置およびその製造方法ならびに表示装置の製造装置
WO2005004286A2 (en) * 2003-07-02 2005-01-13 Integral Technologies, Inc. Low cost and versatile resistors manufactured from conductive loaded resin-based materials
CN1317752C (zh) * 2004-08-30 2007-05-23 友达光电股份有限公司 侦测各向异性导电胶导电粒子变形量的方法和结构
US7935892B2 (en) * 2005-04-14 2011-05-03 Panasonic Corporation Electronic circuit device and method for manufacturing same
JP4123251B2 (ja) * 2005-07-07 2008-07-23 セイコーエプソン株式会社 半導体装置製造用基板、半導体装置の製造方法
US20100321908A1 (en) * 2007-02-22 2010-12-23 Motoji Shiota Electronic circuit device, production method thereof, and display device
EP2397524B1 (en) * 2009-02-16 2019-10-02 Murata Manufacturing Co., Ltd. Connecting method using a conductive resin composition, connection structure, and electronic part
TWI503343B (zh) * 2009-09-30 2015-10-11 Sumitomo Bakelite Co 導電連接材料、端子間之連接方法及連接端子之製造方法
JP5134111B2 (ja) * 2011-05-20 2013-01-30 住友電気工業株式会社 接続方法、接続構造および電子機器
TWI467718B (zh) 2011-12-30 2015-01-01 Ind Tech Res Inst 凸塊結構以及電子封裝接點結構及其製造方法
CN105339768B (zh) * 2013-06-25 2018-09-04 日本特殊陶业株式会社 爆震传感器

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62244142A (ja) * 1986-04-16 1987-10-24 Matsushita Electric Ind Co Ltd 半導体素子の電気的接続方法
JPH01100993A (ja) * 1987-10-14 1989-04-19 Oki Electric Ind Co Ltd 混成集積回路の製造方法
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
JPH0442547A (ja) * 1990-06-08 1992-02-13 Sharp Corp プリント基板への部品搭載方法
JPH0682749A (ja) * 1992-09-01 1994-03-25 Seiko Epson Corp チップ実装方法、並びにチップ実装構造及びそれを用いた電気光学装置及び電子印字装置
JPH06196513A (ja) * 1992-12-22 1994-07-15 Hitachi Chem Co Ltd 接着剤および半導体装置
US5727310A (en) * 1993-01-08 1998-03-17 Sheldahl, Inc. Method of manufacturing a multilayer electronic circuit
JP3519100B2 (ja) * 1993-04-02 2004-04-12 サンスター技研株式会社 異方導電性接着剤組成物
JP3103956B2 (ja) * 1993-06-03 2000-10-30 ソニーケミカル株式会社 異方性導電膜
JP3159841B2 (ja) * 1993-08-26 2001-04-23 ポリプラスチックス株式会社 レーザーによる回路形成方法及び導電回路形成部品
US5822030A (en) * 1994-09-16 1998-10-13 Seiko Epson Corporation Liquid crystal display device, its mounting structure and electronic device
EP0747434B1 (en) * 1995-06-06 2000-08-16 Nisshinbo Industries, Inc. Epoxy resin composition and adhesive based thereon
US5861661A (en) * 1995-12-27 1999-01-19 Industrial Technology Research Institute Composite bump tape automated bonded structure
TW392179B (en) * 1996-02-08 2000-06-01 Asahi Chemical Ind Anisotropic conductive composition
MY128095A (en) * 1996-04-03 2007-01-31 Matsushita Electric Ind Co Ltd Electronic part and method for manufacturing the same
JP3328157B2 (ja) * 1997-03-06 2002-09-24 シャープ株式会社 液晶表示装置
JPH1178317A (ja) * 1997-09-10 1999-03-23 Hitachi Chem Co Ltd Ｉｃカード

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