CN116148335A - 工艺系统 - Google Patents
工艺系统 Download PDFInfo
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- CN116148335A CN116148335A CN202310042814.0A CN202310042814A CN116148335A CN 116148335 A CN116148335 A CN 116148335A CN 202310042814 A CN202310042814 A CN 202310042814A CN 116148335 A CN116148335 A CN 116148335A
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- plasma
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- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 3
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- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical class [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 229910004014 SiF4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- CHBIYWIUHAZZNR-UHFFFAOYSA-N [Y].FOF Chemical compound [Y].FOF CHBIYWIUHAZZNR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000001485 argon Chemical class 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
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- VZGDMQKNWNREIO-UHFFFAOYSA-N carbon tetrachloride Substances ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
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- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910001055 inconels 600 Inorganic materials 0.000 description 1
- 238000005040 ion trap Methods 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
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- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- YOUIDGQAIILFBW-UHFFFAOYSA-J tetrachlorotungsten Chemical compound Cl[W](Cl)(Cl)Cl YOUIDGQAIILFBW-UHFFFAOYSA-J 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- NXHILIPIEUBEPD-UHFFFAOYSA-H tungsten hexafluoride Chemical compound F[W](F)(F)(F)(F)F NXHILIPIEUBEPD-UHFFFAOYSA-H 0.000 description 1
- 229940105963 yttrium fluoride Drugs 0.000 description 1
- RBORBHYCVONNJH-UHFFFAOYSA-K yttrium(iii) fluoride Chemical compound F[Y](F)F RBORBHYCVONNJH-UHFFFAOYSA-K 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J49/00—Particle spectrometers or separator tubes
- H01J49/02—Details
- H01J49/10—Ion sources; Ion guns
- H01J49/105—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation, Inductively Coupled Plasma [ICP]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/62—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode
- G01N27/626—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the ionisation of gases, e.g. aerosols; by investigating electric discharges, e.g. emission of cathode using heat to ionise a gas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32348—Dielectric barrier discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
- H01J37/32963—End-point detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
- H01J37/32981—Gas analysis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J49/00—Particle spectrometers or separator tubes
- H01J49/02—Details
- H01J49/04—Arrangements for introducing or extracting samples to be analysed, e.g. vacuum locks; Arrangements for external adjustment of electron- or ion-optical components
- H01J49/0422—Arrangements for introducing or extracting samples to be analysed, e.g. vacuum locks; Arrangements for external adjustment of electron- or ion-optical components for gaseous samples
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J49/00—Particle spectrometers or separator tubes
- H01J49/26—Mass spectrometers or separator tubes
- H01J49/34—Dynamic spectrometers
- H01J49/42—Stability-of-path spectrometers, e.g. monopole, quadrupole, multipole, farvitrons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/05—Arrangements for energy or mass analysis
- H01J2237/057—Energy or mass filtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/334—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/335—Cleaning
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electrochemistry (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Sampling And Sample Adjustment (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-057148 | 2019-03-25 | ||
| JP2019057148 | 2019-03-25 | ||
| PCT/JP2020/012839 WO2020196452A1 (ja) | 2019-03-25 | 2020-03-24 | ガス分析装置 |
| CN202080024324.2A CN113678228A (zh) | 2019-03-25 | 2020-03-24 | 气体分析装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080024324.2A Division CN113678228A (zh) | 2019-03-25 | 2020-03-24 | 气体分析装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116148335A true CN116148335A (zh) | 2023-05-23 |
Family
ID=72610978
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310042814.0A Pending CN116148335A (zh) | 2019-03-25 | 2020-03-24 | 工艺系统 |
| CN202410174530.1A Pending CN118116790A (zh) | 2019-03-25 | 2020-03-24 | 气体分析装置、工艺监视装置、工艺系统、控制方法和监视方法 |
| CN202080024324.2A Pending CN113678228A (zh) | 2019-03-25 | 2020-03-24 | 气体分析装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410174530.1A Pending CN118116790A (zh) | 2019-03-25 | 2020-03-24 | 气体分析装置、工艺监视装置、工艺系统、控制方法和监视方法 |
| CN202080024324.2A Pending CN113678228A (zh) | 2019-03-25 | 2020-03-24 | 气体分析装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US11557469B2 (https=) |
| JP (4) | JP6783496B1 (https=) |
| KR (4) | KR20250061862A (https=) |
| CN (3) | CN116148335A (https=) |
| TW (3) | TWI888050B (https=) |
| WO (1) | WO2020196452A1 (https=) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI888050B (zh) * | 2019-03-25 | 2025-06-21 | 日商亞多納富有限公司 | 製程系統 |
| GB2583897A (en) * | 2019-04-05 | 2020-11-18 | Servomex Group Ltd | Glow plasma stabilisation |
| US11081315B2 (en) * | 2019-06-14 | 2021-08-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Ion impantation gas supply system |
| CN112326772A (zh) * | 2020-11-09 | 2021-02-05 | 上海裕达实业有限公司 | 用于固体材料直接测试的等离子质谱仪系统及测试方法 |
| CN117256038A (zh) * | 2021-03-31 | 2023-12-19 | 英福康有限公司 | 用于在大的压力范围内产生等离子体的设备和方法以及用于借助于这样的设备进行光学气体分析/检测的系统和方法 |
| US12469751B2 (en) | 2021-06-03 | 2025-11-11 | Applied Materials, Inc. | Apparatus to detect and quantify radical concentration in semiconductor processing systems |
| JP7725306B2 (ja) * | 2021-09-14 | 2025-08-19 | 東京エレクトロン株式会社 | 基板処理システム及びガス計測方法 |
| KR20240088888A (ko) * | 2021-10-29 | 2024-06-20 | 아토나프 가부시키가이샤 | 가스 분석 장치 및 제어 방법 |
| WO2024019479A1 (ko) * | 2022-07-18 | 2024-01-25 | 차동호 | 가스분석장치 및 이를 포함하는 기판처리시스템 |
| KR102734665B1 (ko) * | 2022-07-18 | 2024-11-27 | 차동호 | 가스분석장치 및 이를 포함하는 기판처리시스템 |
| KR102667398B1 (ko) * | 2022-07-18 | 2024-05-20 | 차동호 | 가스분석장치 및 이를 포함하는 기판처리시스템 |
| KR102734657B1 (ko) * | 2022-07-18 | 2024-11-27 | 차동호 | 가스분석장치 및 이를 포함하는 기판처리시스템 |
| TW202501613A (zh) * | 2023-04-25 | 2025-01-01 | 日商亞多納富有限公司 | 氣體分析器設備 |
| US20250138429A1 (en) * | 2023-10-31 | 2025-05-01 | Tokyo Electron Limited | Endpoint detection in dry development of photoresist |
| US20250308867A1 (en) * | 2024-03-29 | 2025-10-02 | Tokyo Electron Limited | High-performance adaptable sampling system |
Family Cites Families (60)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4692630A (en) * | 1986-05-27 | 1987-09-08 | Inficon Leybold-Heraeus | Wavelength specific detection system for measuring the partial pressure of a gas excited by an electron beam |
| JP2952894B2 (ja) * | 1989-07-03 | 1999-09-27 | 富士通株式会社 | 真空装置およびプロセスチャンバ内のガス分析方法 |
| US5342580A (en) * | 1990-04-17 | 1994-08-30 | Alan Brenner | Apparatus and method for measuring the amount of gas adsorbed on or desorbed from a solid and reactions of a gas with a solid |
| JPH0737821A (ja) * | 1993-07-20 | 1995-02-07 | Hitachi Ltd | 薄膜製造装置及び半導体装置の製造方法 |
| JPH07122536A (ja) * | 1993-10-21 | 1995-05-12 | Hitachi Ltd | 半導体装置の製造装置 |
| JP2872637B2 (ja) * | 1995-07-10 | 1999-03-17 | アプライド マテリアルズ インコーポレイテッド | マイクロ波プラズマベースアプリケータ |
| JP3550457B2 (ja) | 1996-03-29 | 2004-08-04 | 株式会社アルバック | 浮遊電位基板入射イオンのエネルギー及び質量の分析法及び装置 |
| US5641546A (en) * | 1996-05-06 | 1997-06-24 | Hughes Aircraft Company | Passivation of electronic modules using high density plasmas |
| US6534007B1 (en) * | 1997-08-01 | 2003-03-18 | Applied Komatsu Technology, Inc. | Method and apparatus for detecting the endpoint of a chamber cleaning |
| US6748334B1 (en) * | 1999-12-06 | 2004-06-08 | Jorge E. Perez | Specialty gas analysis system |
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