CN115461630B - 半导体试验装置、半导体试验方法以及半导体装置的制造方法 - Google Patents

半导体试验装置、半导体试验方法以及半导体装置的制造方法 Download PDF

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Publication number
CN115461630B
CN115461630B CN202180030989.9A CN202180030989A CN115461630B CN 115461630 B CN115461630 B CN 115461630B CN 202180030989 A CN202180030989 A CN 202180030989A CN 115461630 B CN115461630 B CN 115461630B
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semiconductor element
electrode
capacitor
semiconductor
input
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CN115461630A (zh
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中西学
水野高博
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/36—Overload-protection arrangements or circuits for electric measuring instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN202180030989.9A 2019-08-29 2021-02-25 半导体试验装置、半导体试验方法以及半导体装置的制造方法 Active CN115461630B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019156499 2019-08-29
JP2020-080885 2020-05-01
JP2020080885A JP2021039086A (ja) 2019-08-29 2020-05-01 半導体試験装置、半導体試験方法および半導体装置の製造方法
PCT/JP2021/007166 WO2021220602A1 (ja) 2019-08-29 2021-02-25 半導体試験装置、半導体試験方法および半導体装置の製造方法

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CN115461630A CN115461630A (zh) 2022-12-09
CN115461630B true CN115461630B (zh) 2025-05-09

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US (1) US12287355B2 (https=)
JP (2) JP2021039086A (https=)
CN (1) CN115461630B (https=)
WO (1) WO2021220602A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0836019A (ja) * 1994-07-22 1996-02-06 Sony Tektronix Corp 特性測定装置
JP2017020811A (ja) * 2015-07-07 2017-01-26 株式会社デンソー 半導体素子の検査回路および検査方法

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JPH09162255A (ja) * 1995-12-06 1997-06-20 Fuji Electric Co Ltd 半導体素子の試験装置
JPH10197594A (ja) * 1997-01-10 1998-07-31 Fuji Electric Co Ltd 半導体試験装置
JP2005124345A (ja) 2003-10-20 2005-05-12 Nissan Motor Co Ltd 電力変換装置
JP4687086B2 (ja) 2004-12-03 2011-05-25 トヨタ自動車株式会社 電力変換器の試験装置および試験方法
US7609080B2 (en) * 2005-03-22 2009-10-27 Formfactor, Inc. Voltage fault detection and protection
JP5320953B2 (ja) * 2008-10-02 2013-10-23 日産自動車株式会社 組電池の性能検出装置及び制御装置
JP5299089B2 (ja) * 2009-05-28 2013-09-25 富士電機株式会社 半導体チップの試験装置および試験方法
JP2011097799A (ja) * 2009-11-02 2011-05-12 Yokogawa Electric Corp 電源装置および半導体試験装置
JP2012229971A (ja) 2011-04-26 2012-11-22 Honda Motor Co Ltd 半導体検査装置、及び半導体検査方法
JP2013024794A (ja) * 2011-07-25 2013-02-04 Honda Motor Co Ltd 半導体検査装置及び半導体検査方法
JP5969941B2 (ja) * 2013-03-13 2016-08-17 シャープ株式会社 半導体トランジスタのテスト方法
JP6207265B2 (ja) * 2013-07-04 2017-10-04 三菱電機株式会社 半導体試験装置
US9316681B2 (en) * 2014-07-25 2016-04-19 Freescale Semiconductor, Inc. Systems and methods for test circuitry for insulated-gate bipolar transistors
US9917335B2 (en) * 2014-08-28 2018-03-13 Apple Inc. Methods for determining and controlling battery expansion
CN104538694B (zh) * 2014-12-12 2017-02-22 中国科学院电工研究所 基于电阻抗成像技术的锂电池组监测系统及监测方法
JP6332165B2 (ja) * 2015-06-25 2018-05-30 株式会社デンソー 半導体素子の検査装置および検査方法
CN211123134U (zh) * 2019-09-09 2020-07-28 国网山东省电力公司金乡县供电公司 一种igbt特性测试装置
CN217719732U (zh) * 2021-12-30 2022-11-01 无边界(苏州)新材料科技有限公司 一种电池安全监测装置及电池

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0836019A (ja) * 1994-07-22 1996-02-06 Sony Tektronix Corp 特性測定装置
JP2017020811A (ja) * 2015-07-07 2017-01-26 株式会社デンソー 半導体素子の検査回路および検査方法

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Publication number Publication date
CN115461630A (zh) 2022-12-09
JP2021039086A (ja) 2021-03-11
JPWO2021220602A1 (https=) 2021-11-04
US20230141552A1 (en) 2023-05-11
WO2021220602A1 (ja) 2021-11-04
JP7370459B2 (ja) 2023-10-27
US12287355B2 (en) 2025-04-29

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