JPWO2021220602A1 - - Google Patents
Info
- Publication number
- JPWO2021220602A1 JPWO2021220602A1 JP2022518626A JP2022518626A JPWO2021220602A1 JP WO2021220602 A1 JPWO2021220602 A1 JP WO2021220602A1 JP 2022518626 A JP2022518626 A JP 2022518626A JP 2022518626 A JP2022518626 A JP 2022518626A JP WO2021220602 A1 JPWO2021220602 A1 JP WO2021220602A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/36—Overload-protection arrangements or circuits for electric measuring instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019156499 | 2019-08-29 | ||
| JP2020080885 | 2020-05-01 | ||
| JP2020080885A JP2021039086A (ja) | 2019-08-29 | 2020-05-01 | 半導体試験装置、半導体試験方法および半導体装置の製造方法 |
| PCT/JP2021/007166 WO2021220602A1 (ja) | 2019-08-29 | 2021-02-25 | 半導体試験装置、半導体試験方法および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021220602A1 true JPWO2021220602A1 (https=) | 2021-11-04 |
| JP7370459B2 JP7370459B2 (ja) | 2023-10-27 |
Family
ID=74846987
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020080885A Pending JP2021039086A (ja) | 2019-08-29 | 2020-05-01 | 半導体試験装置、半導体試験方法および半導体装置の製造方法 |
| JP2022518626A Active JP7370459B2 (ja) | 2019-08-29 | 2021-02-25 | 半導体試験装置、半導体試験方法および半導体装置の製造方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020080885A Pending JP2021039086A (ja) | 2019-08-29 | 2020-05-01 | 半導体試験装置、半導体試験方法および半導体装置の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12287355B2 (https=) |
| JP (2) | JP2021039086A (https=) |
| CN (1) | CN115461630B (https=) |
| WO (1) | WO2021220602A1 (https=) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0836019A (ja) * | 1994-07-22 | 1996-02-06 | Sony Tektronix Corp | 特性測定装置 |
| JP2008545949A (ja) * | 2005-03-22 | 2008-12-18 | フォームファクター， インコーポレイテッド | 電圧故障検出保護 |
| JP2010276477A (ja) * | 2009-05-28 | 2010-12-09 | Fuji Electric Systems Co Ltd | 半導体チップの試験装置および試験方法 |
| JP2013024794A (ja) * | 2011-07-25 | 2013-02-04 | Honda Motor Co Ltd | 半導体検査装置及び半導体検査方法 |
| JP2014175643A (ja) * | 2013-03-13 | 2014-09-22 | Sharp Corp | 半導体トランジスタのテスト方法 |
| US20160025802A1 (en) * | 2014-07-25 | 2016-01-28 | Thierry Sicard | Systems and methods for test circuitry for insulated-gate bipolar transistors |
| WO2016208141A1 (ja) * | 2015-06-25 | 2016-12-29 | 株式会社デンソー | 半導体素子の検査装置および検査方法 |
| JP2017020811A (ja) * | 2015-07-07 | 2017-01-26 | 株式会社デンソー | 半導体素子の検査回路および検査方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09162255A (ja) * | 1995-12-06 | 1997-06-20 | Fuji Electric Co Ltd | 半導体素子の試験装置 |
| JPH10197594A (ja) * | 1997-01-10 | 1998-07-31 | Fuji Electric Co Ltd | 半導体試験装置 |
| JP2005124345A (ja) | 2003-10-20 | 2005-05-12 | Nissan Motor Co Ltd | 電力変換装置 |
| JP4687086B2 (ja) | 2004-12-03 | 2011-05-25 | トヨタ自動車株式会社 | 電力変換器の試験装置および試験方法 |
| JP5320953B2 (ja) * | 2008-10-02 | 2013-10-23 | 日産自動車株式会社 | 組電池の性能検出装置及び制御装置 |
| JP2011097799A (ja) * | 2009-11-02 | 2011-05-12 | Yokogawa Electric Corp | 電源装置および半導体試験装置 |
| JP2012229971A (ja) | 2011-04-26 | 2012-11-22 | Honda Motor Co Ltd | 半導体検査装置、及び半導体検査方法 |
| JP6207265B2 (ja) * | 2013-07-04 | 2017-10-04 | 三菱電機株式会社 | 半導体試験装置 |
| US9917335B2 (en) * | 2014-08-28 | 2018-03-13 | Apple Inc. | Methods for determining and controlling battery expansion |
| CN104538694B (zh) * | 2014-12-12 | 2017-02-22 | 中国科学院电工研究所 | 基于电阻抗成像技术的锂电池组监测系统及监测方法 |
| CN211123134U (zh) * | 2019-09-09 | 2020-07-28 | 国网山东省电力公司金乡县供电公司 | 一种igbt特性测试装置 |
| CN217719732U (zh) * | 2021-12-30 | 2022-11-01 | 无边界(苏州)新材料科技有限公司 | 一种电池安全监测装置及电池 |
-
2020
- 2020-05-01 JP JP2020080885A patent/JP2021039086A/ja active Pending
-
2021
- 2021-02-25 CN CN202180030989.9A patent/CN115461630B/zh active Active
- 2021-02-25 US US17/912,880 patent/US12287355B2/en active Active
- 2021-02-25 WO PCT/JP2021/007166 patent/WO2021220602A1/ja not_active Ceased
- 2021-02-25 JP JP2022518626A patent/JP7370459B2/ja active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0836019A (ja) * | 1994-07-22 | 1996-02-06 | Sony Tektronix Corp | 特性測定装置 |
| JP2008545949A (ja) * | 2005-03-22 | 2008-12-18 | フォームファクター， インコーポレイテッド | 電圧故障検出保護 |
| JP2010276477A (ja) * | 2009-05-28 | 2010-12-09 | Fuji Electric Systems Co Ltd | 半導体チップの試験装置および試験方法 |
| JP2013024794A (ja) * | 2011-07-25 | 2013-02-04 | Honda Motor Co Ltd | 半導体検査装置及び半導体検査方法 |
| JP2014175643A (ja) * | 2013-03-13 | 2014-09-22 | Sharp Corp | 半導体トランジスタのテスト方法 |
| US20160025802A1 (en) * | 2014-07-25 | 2016-01-28 | Thierry Sicard | Systems and methods for test circuitry for insulated-gate bipolar transistors |
| WO2016208141A1 (ja) * | 2015-06-25 | 2016-12-29 | 株式会社デンソー | 半導体素子の検査装置および検査方法 |
| JP2017020811A (ja) * | 2015-07-07 | 2017-01-26 | 株式会社デンソー | 半導体素子の検査回路および検査方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115461630A (zh) | 2022-12-09 |
| JP2021039086A (ja) | 2021-03-11 |
| US20230141552A1 (en) | 2023-05-11 |
| CN115461630B (zh) | 2025-05-09 |
| WO2021220602A1 (ja) | 2021-11-04 |
| JP7370459B2 (ja) | 2023-10-27 |
| US12287355B2 (en) | 2025-04-29 |
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