JPWO2021220602A1 - - Google Patents

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Publication number
JPWO2021220602A1
JPWO2021220602A1 JP2022518626A JP2022518626A JPWO2021220602A1 JP WO2021220602 A1 JPWO2021220602 A1 JP WO2021220602A1 JP 2022518626 A JP2022518626 A JP 2022518626A JP 2022518626 A JP2022518626 A JP 2022518626A JP WO2021220602 A1 JPWO2021220602 A1 JP WO2021220602A1
Authority
JP
Japan
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Application number
JP2022518626A
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JP7370459B2 (ja
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Publication of JPWO2021220602A1 publication Critical patent/JPWO2021220602A1/ja
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Publication of JP7370459B2 publication Critical patent/JP7370459B2/ja
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/36—Overload-protection arrangements or circuits for electric measuring instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2607—Circuits therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2022518626A 2019-08-29 2021-02-25 半導体試験装置、半導体試験方法および半導体装置の製造方法 Active JP7370459B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019156499 2019-08-29
JP2020080885A JP2021039086A (ja) 2019-08-29 2020-05-01 半導体試験装置、半導体試験方法および半導体装置の製造方法
JP2020080885 2020-05-01
PCT/JP2021/007166 WO2021220602A1 (ja) 2019-08-29 2021-02-25 半導体試験装置、半導体試験方法および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021220602A1 true JPWO2021220602A1 (ja) 2021-11-04
JP7370459B2 JP7370459B2 (ja) 2023-10-27

Family

ID=74846987

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020080885A Pending JP2021039086A (ja) 2019-08-29 2020-05-01 半導体試験装置、半導体試験方法および半導体装置の製造方法
JP2022518626A Active JP7370459B2 (ja) 2019-08-29 2021-02-25 半導体試験装置、半導体試験方法および半導体装置の製造方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2020080885A Pending JP2021039086A (ja) 2019-08-29 2020-05-01 半導体試験装置、半導体試験方法および半導体装置の製造方法

Country Status (4)

Country Link
US (1) US20230141552A1 (ja)
JP (2) JP2021039086A (ja)
CN (1) CN115461630A (ja)
WO (1) WO2021220602A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0836019A (ja) * 1994-07-22 1996-02-06 Sony Tektronix Corp 特性測定装置
JP2008545949A (ja) * 2005-03-22 2008-12-18 フォームファクター， インコーポレイテッド 電圧故障検出保護
JP2010276477A (ja) * 2009-05-28 2010-12-09 Fuji Electric Systems Co Ltd 半導体チップの試験装置および試験方法
JP2013024794A (ja) * 2011-07-25 2013-02-04 Honda Motor Co Ltd 半導体検査装置及び半導体検査方法
JP2014175643A (ja) * 2013-03-13 2014-09-22 Sharp Corp 半導体トランジスタのテスト方法
US20160025802A1 (en) * 2014-07-25 2016-01-28 Thierry Sicard Systems and methods for test circuitry for insulated-gate bipolar transistors
WO2016208141A1 (ja) * 2015-06-25 2016-12-29 株式会社デンソー 半導体素子の検査装置および検査方法
JP2017020811A (ja) * 2015-07-07 2017-01-26 株式会社デンソー 半導体素子の検査回路および検査方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0836019A (ja) * 1994-07-22 1996-02-06 Sony Tektronix Corp 特性測定装置
JP2008545949A (ja) * 2005-03-22 2008-12-18 フォームファクター， インコーポレイテッド 電圧故障検出保護
JP2010276477A (ja) * 2009-05-28 2010-12-09 Fuji Electric Systems Co Ltd 半導体チップの試験装置および試験方法
JP2013024794A (ja) * 2011-07-25 2013-02-04 Honda Motor Co Ltd 半導体検査装置及び半導体検査方法
JP2014175643A (ja) * 2013-03-13 2014-09-22 Sharp Corp 半導体トランジスタのテスト方法
US20160025802A1 (en) * 2014-07-25 2016-01-28 Thierry Sicard Systems and methods for test circuitry for insulated-gate bipolar transistors
WO2016208141A1 (ja) * 2015-06-25 2016-12-29 株式会社デンソー 半導体素子の検査装置および検査方法
JP2017020811A (ja) * 2015-07-07 2017-01-26 株式会社デンソー 半導体素子の検査回路および検査方法

Also Published As

Publication number Publication date
CN115461630A (zh) 2022-12-09
US20230141552A1 (en) 2023-05-11
JP2021039086A (ja) 2021-03-11
JP7370459B2 (ja) 2023-10-27
WO2021220602A1 (ja) 2021-11-04

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