CN115335482B - 粘接剂组合物和粘接片材、层叠体及印刷线路板 - Google Patents
粘接剂组合物和粘接片材、层叠体及印刷线路板 Download PDFInfo
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- CN115335482B CN115335482B CN202180024655.0A CN202180024655A CN115335482B CN 115335482 B CN115335482 B CN 115335482B CN 202180024655 A CN202180024655 A CN 202180024655A CN 115335482 B CN115335482 B CN 115335482B
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- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 238000000710 polymer precipitation Methods 0.000 description 1
- 239000002685 polymerization catalyst Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 150000003097 polyterpenes Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- WXYNMTGBLWPTNQ-UHFFFAOYSA-N tetrabutoxygermane Chemical compound CCCCO[Ge](OCCCC)(OCCCC)OCCCC WXYNMTGBLWPTNQ-UHFFFAOYSA-N 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- YGBFTDQFAKDXBZ-UHFFFAOYSA-N tributyl stiborite Chemical compound [Sb+3].CCCC[O-].CCCC[O-].CCCC[O-] YGBFTDQFAKDXBZ-UHFFFAOYSA-N 0.000 description 1
- UDUKMRHNZZLJRB-UHFFFAOYSA-N triethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OCC)(OCC)OCC)CCC2OC21 UDUKMRHNZZLJRB-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020068163 | 2020-04-06 | ||
| JP2020-068163 | 2020-04-06 | ||
| PCT/JP2021/013044 WO2021205917A1 (ja) | 2020-04-06 | 2021-03-26 | 接着剤組成物ならびに接着シート、積層体およびプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115335482A CN115335482A (zh) | 2022-11-11 |
| CN115335482B true CN115335482B (zh) | 2024-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180024655.0A Active CN115335482B (zh) | 2020-04-06 | 2021-03-26 | 粘接剂组合物和粘接片材、层叠体及印刷线路板 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6981583B1 (ja) |
| KR (1) | KR20220163937A (ja) |
| CN (1) | CN115335482B (ja) |
| TW (1) | TW202144528A (ja) |
| WO (1) | WO2021205917A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7223300B2 (ja) * | 2020-09-18 | 2023-02-16 | 三菱ケミカル株式会社 | ポリエステル系樹脂、接着剤組成物及び接着剤 |
| JP7156562B1 (ja) | 2021-04-16 | 2022-10-19 | 三菱ケミカル株式会社 | フレキシブルプリント配線板用接着剤組成物 |
| KR102521064B1 (ko) * | 2021-12-14 | 2023-04-13 | 율촌화학 주식회사 | Lcp 필러를 포함하는 폴리올레핀계 저유전 접착제 조성물 및 이를 이용한 저유전 본딩 시트 |
| WO2023127890A1 (ja) * | 2021-12-28 | 2023-07-06 | 東亞合成株式会社 | 接着剤組成物及び接着剤層付き積層体 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102627934A (zh) * | 2011-02-01 | 2012-08-08 | 阿尔卑斯电气株式会社 | 密封材料 |
| CN108291076A (zh) * | 2015-12-24 | 2018-07-17 | 株式会社钟化 | 树脂组合物、使用了其的半固化性热传导膜、电路基板和粘接片 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104813B2 (ja) * | 1987-12-16 | 1994-12-21 | 信越化学工業株式会社 | 難燃性カバーレイフイルム |
| JPH06104813A (ja) | 1992-09-18 | 1994-04-15 | Canon Inc | 無線電話機 |
| JP4036345B2 (ja) * | 1996-04-10 | 2008-01-23 | 三井・デュポンフロロケミカル株式会社 | 金属基材被覆用組成物 |
| JP4172063B2 (ja) * | 1997-06-30 | 2008-10-29 | 東レ株式会社 | 溶着用樹脂組成物の製造方法 |
| JP2002249754A (ja) * | 2001-02-27 | 2002-09-06 | Dainippon Ink & Chem Inc | 接着剤用樹脂組成物及び積層体 |
| JP2004013054A (ja) * | 2002-06-11 | 2004-01-15 | Sumitomo Chem Co Ltd | 高耐熱ラベル |
| JP2006307093A (ja) * | 2005-05-02 | 2006-11-09 | Sekisui Chem Co Ltd | 光反応型接着剤組成物および液晶表示装置の製造方法 |
| CN104968713B (zh) | 2013-01-09 | 2019-05-03 | 株式会社村田制作所 | 处理完的液晶聚合物粉末的制造方法 |
| WO2014147903A1 (ja) * | 2013-03-22 | 2014-09-25 | 東亞合成株式会社 | 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板 |
| KR102178215B1 (ko) * | 2014-08-27 | 2020-11-12 | 도요보 가부시키가이샤 | 저유전 접착제 조성물 |
| CN107075335B (zh) | 2014-09-24 | 2020-02-14 | 东亚合成株式会社 | 粘接剂组合物和使用了其的带有粘接剂层的层叠体 |
| TW201938741A (zh) * | 2018-03-05 | 2019-10-01 | 日商拓自達電線股份有限公司 | 接著劑用組成物 |
| CN109666434B (zh) * | 2018-12-27 | 2021-09-10 | 苏州赛伍应用技术股份有限公司 | 粘合剂及制备方法、包含其的胶膜和制备方法及应用 |
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- 2021-03-26 KR KR1020227027639A patent/KR20220163937A/ko active Search and Examination
- 2021-03-26 JP JP2021539128A patent/JP6981583B1/ja active Active
- 2021-03-26 WO PCT/JP2021/013044 patent/WO2021205917A1/ja active Application Filing
- 2021-03-26 CN CN202180024655.0A patent/CN115335482B/zh active Active
- 2021-03-29 TW TW110111346A patent/TW202144528A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102627934A (zh) * | 2011-02-01 | 2012-08-08 | 阿尔卑斯电气株式会社 | 密封材料 |
| CN108291076A (zh) * | 2015-12-24 | 2018-07-17 | 株式会社钟化 | 树脂组合物、使用了其的半固化性热传导膜、电路基板和粘接片 |
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| Publication number | Publication date |
|---|---|
| JPWO2021205917A1 (ja) | 2021-10-14 |
| TW202144528A (zh) | 2021-12-01 |
| WO2021205917A1 (ja) | 2021-10-14 |
| KR20220163937A (ko) | 2022-12-12 |
| JP6981583B1 (ja) | 2021-12-15 |
| CN115335482A (zh) | 2022-11-11 |
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Effective date of registration: 20230525 Address after: South Building, Meitian Twin Towers, No. 13-1, Meitian 1-chome, Kita ku, Osaka City, Osaka Prefecture, Japan Applicant after: Dongyang Textile MC Co.,Ltd. Address before: No. 1, No. 13, meitian-1, Shibei District, Osaka, Osaka, Japan Applicant before: TOYOBO Co.,Ltd. |
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