TW202144528A - 黏接劑組成物、及黏接片、疊層體及印刷配線板 - Google Patents

黏接劑組成物、及黏接片、疊層體及印刷配線板 Download PDF

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Publication number
TW202144528A
TW202144528A TW110111346A TW110111346A TW202144528A TW 202144528 A TW202144528 A TW 202144528A TW 110111346 A TW110111346 A TW 110111346A TW 110111346 A TW110111346 A TW 110111346A TW 202144528 A TW202144528 A TW 202144528A
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TW
Taiwan
Prior art keywords
adhesive composition
adhesive
mass
liquid crystal
parts
Prior art date
Application number
TW110111346A
Other languages
English (en)
Chinese (zh)
Inventor
坂本晃一
三浦航
川楠哲生
Original Assignee
日商東洋紡股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東洋紡股份有限公司 filed Critical 日商東洋紡股份有限公司
Publication of TW202144528A publication Critical patent/TW202144528A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K19/00—Liquid crystal materials
    • C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
    • C09K19/38—Polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW110111346A 2020-04-06 2021-03-29 黏接劑組成物、及黏接片、疊層體及印刷配線板 TW202144528A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020068163 2020-04-06
JP2020-068163 2020-04-06

Publications (1)

Publication Number Publication Date
TW202144528A true TW202144528A (zh) 2021-12-01

Family

ID=78023025

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110111346A TW202144528A (zh) 2020-04-06 2021-03-29 黏接劑組成物、及黏接片、疊層體及印刷配線板

Country Status (5)

Country Link
JP (1) JP6981583B1 (ja)
KR (1) KR20220163937A (ja)
CN (1) CN115335482B (ja)
TW (1) TW202144528A (ja)
WO (1) WO2021205917A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7223300B2 (ja) * 2020-09-18 2023-02-16 三菱ケミカル株式会社 ポリエステル系樹脂、接着剤組成物及び接着剤
JP7156562B1 (ja) 2021-04-16 2022-10-19 三菱ケミカル株式会社 フレキシブルプリント配線板用接着剤組成物
KR102521064B1 (ko) * 2021-12-14 2023-04-13 율촌화학 주식회사 Lcp 필러를 포함하는 폴리올레핀계 저유전 접착제 조성물 및 이를 이용한 저유전 본딩 시트
WO2023127890A1 (ja) * 2021-12-28 2023-07-06 東亞合成株式会社 接着剤組成物及び接着剤層付き積層体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104813B2 (ja) * 1987-12-16 1994-12-21 信越化学工業株式会社 難燃性カバーレイフイルム
JPH06104813A (ja) 1992-09-18 1994-04-15 Canon Inc 無線電話機
JP4036345B2 (ja) * 1996-04-10 2008-01-23 三井・デュポンフロロケミカル株式会社 金属基材被覆用組成物
JP4172063B2 (ja) * 1997-06-30 2008-10-29 東レ株式会社 溶着用樹脂組成物の製造方法
JP2002249754A (ja) * 2001-02-27 2002-09-06 Dainippon Ink & Chem Inc 接着剤用樹脂組成物及び積層体
JP2004013054A (ja) * 2002-06-11 2004-01-15 Sumitomo Chem Co Ltd 高耐熱ラベル
JP2006307093A (ja) * 2005-05-02 2006-11-09 Sekisui Chem Co Ltd 光反応型接着剤組成物および液晶表示装置の製造方法
JP5679844B2 (ja) * 2011-02-01 2015-03-04 アルプス電気株式会社 封止材
CN104968713B (zh) 2013-01-09 2019-05-03 株式会社村田制作所 处理完的液晶聚合物粉末的制造方法
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
KR102178215B1 (ko) * 2014-08-27 2020-11-12 도요보 가부시키가이샤 저유전 접착제 조성물
CN107075335B (zh) 2014-09-24 2020-02-14 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体
JP6740254B2 (ja) * 2015-12-24 2020-08-12 株式会社カネカ 樹脂組成物およびそれを用いた半硬化性熱伝導フィルムおよび回路基板および接着シート
TW201938741A (zh) * 2018-03-05 2019-10-01 日商拓自達電線股份有限公司 接著劑用組成物
CN109666434B (zh) * 2018-12-27 2021-09-10 苏州赛伍应用技术股份有限公司 粘合剂及制备方法、包含其的胶膜和制备方法及应用

Also Published As

Publication number Publication date
JPWO2021205917A1 (ja) 2021-10-14
CN115335482B (zh) 2024-06-25
WO2021205917A1 (ja) 2021-10-14
KR20220163937A (ko) 2022-12-12
JP6981583B1 (ja) 2021-12-15
CN115335482A (zh) 2022-11-11

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