CN115244689B - 半导体装置 - Google Patents

半导体装置

Info

Publication number
CN115244689B
CN115244689B CN202080096322.4A CN202080096322A CN115244689B CN 115244689 B CN115244689 B CN 115244689B CN 202080096322 A CN202080096322 A CN 202080096322A CN 115244689 B CN115244689 B CN 115244689B
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CN
China
Prior art keywords
conductor
semiconductor element
semiconductor device
electrode
conductor plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080096322.4A
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English (en)
Chinese (zh)
Other versions
CN115244689A (zh
Inventor
门口卓矢
川岛崇功
平光真二
大前翔一朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
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Denso Corp
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Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to CN202510993537.0A priority Critical patent/CN120857587A/zh
Publication of CN115244689A publication Critical patent/CN115244689A/zh
Application granted granted Critical
Publication of CN115244689B publication Critical patent/CN115244689B/zh
Active legal-status Critical Current
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    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
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    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
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    • H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
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    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
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    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
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    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
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    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
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    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
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Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN202080096322.4A 2020-02-14 2020-02-14 半导体装置 Active CN115244689B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202510993537.0A CN120857587A (zh) 2020-02-14 2020-02-14 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/005878 WO2021161526A1 (ja) 2020-02-14 2020-02-14 半導体装置

Related Child Applications (1)

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CN202510993537.0A Division CN120857587A (zh) 2020-02-14 2020-02-14 半导体装置

Publications (2)

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CN115244689A CN115244689A (zh) 2022-10-25
CN115244689B true CN115244689B (zh) 2025-07-25

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US (1) US12581969B2 (https=)
JP (1) JP7173396B2 (https=)
CN (2) CN115244689B (https=)
WO (1) WO2021161526A1 (https=)

Families Citing this family (1)

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CN116230666B (zh) * 2023-05-05 2023-08-08 烟台台芯电子科技有限公司 一种dbc双面微通道制冷igbt模块及其制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1542957A (zh) * 2003-03-26 2004-11-03 ��ʽ�����װ 半导体器件

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3366192B2 (ja) * 1995-09-08 2003-01-14 株式会社日立製作所 配線基板及びそれを用いた電力変換装置
JP2004201000A (ja) * 2002-12-18 2004-07-15 Mitsubishi Electric Corp プリント配線板および信号伝送装置
JP4039258B2 (ja) * 2003-01-31 2008-01-30 富士電機デバイステクノロジー株式会社 電力用半導体装置
JP2004247383A (ja) * 2003-02-12 2004-09-02 Mitsubishi Electric Corp パワーモジュール
JP4062191B2 (ja) * 2003-07-03 2008-03-19 富士電機デバイステクノロジー株式会社 半導体装置及びその製造方法
JP2006019596A (ja) * 2004-07-02 2006-01-19 Sony Corp 半導体装置およびその製造方法
CN100369252C (zh) * 2006-02-13 2008-02-13 友达光电股份有限公司 静电放电保护电路
JP5183893B2 (ja) * 2006-08-01 2013-04-17 新光電気工業株式会社 配線基板及びその製造方法、及び半導体装置
JP4924411B2 (ja) 2007-12-27 2012-04-25 三菱電機株式会社 電力半導体装置
JP5381444B2 (ja) * 2009-07-17 2014-01-08 トヨタ自動車株式会社 パワーモジュール
US9351404B2 (en) * 2010-11-24 2016-05-24 Hitachi Metals, Ltd. Electronic device
JP2013110216A (ja) * 2011-11-18 2013-06-06 Sumitomo Electric Ind Ltd 電力制御用の半導体装置
JP5665729B2 (ja) * 2011-12-27 2015-02-04 三菱電機株式会社 電力用半導体装置
JP2016046497A (ja) 2014-08-27 2016-04-04 株式会社日立製作所 パワー半導体装置及びパワー半導体装置の製造方法
JP2016066700A (ja) * 2014-09-25 2016-04-28 株式会社日立製作所 パワー半導体モジュール
JP6609633B2 (ja) * 2015-10-15 2019-11-20 ルネサスエレクトロニクス株式会社 半導体装置
JP6697944B2 (ja) * 2016-04-27 2020-05-27 三菱電機株式会社 電力用半導体装置
CN107403784B (zh) * 2016-05-19 2020-04-24 胡川 线路板制作方法及结构
JP2018022818A (ja) * 2016-08-05 2018-02-08 カルソニックカンセイ株式会社 半導体装置
DE102016119485A1 (de) 2016-10-12 2018-04-12 Infineon Technologies Ag Chipträger mit elektrisch leitfähiger Schicht, die sich über eine wärmeleitfähige dielektrische Sheet-Struktur hinaus erstreckt
JP2019009280A (ja) * 2017-06-23 2019-01-17 トヨタ自動車株式会社 半導体装置
JP7130928B2 (ja) * 2017-09-07 2022-09-06 株式会社デンソー 半導体装置
JP6881238B2 (ja) * 2017-10-31 2021-06-02 三菱電機株式会社 半導体モジュール、その製造方法及び電力変換装置
JP2019110280A (ja) * 2017-12-20 2019-07-04 トヨタ自動車株式会社 半導体装置の製造方法
JP7163583B2 (ja) * 2018-01-30 2022-11-01 株式会社デンソー 半導体装置
JP7192235B2 (ja) * 2018-02-06 2022-12-20 株式会社デンソー 半導体装置
JP2019201187A (ja) * 2018-05-18 2019-11-21 住友電気工業株式会社 電子回路装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1542957A (zh) * 2003-03-26 2004-11-03 ��ʽ�����װ 半导体器件

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