CN115023810B - 半导体装置以及电力变换装置 - Google Patents

半导体装置以及电力变换装置

Info

Publication number
CN115023810B
CN115023810B CN202080094197.3A CN202080094197A CN115023810B CN 115023810 B CN115023810 B CN 115023810B CN 202080094197 A CN202080094197 A CN 202080094197A CN 115023810 B CN115023810 B CN 115023810B
Authority
CN
China
Prior art keywords
peripheral end
bonding material
outer peripheral
semiconductor device
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080094197.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN115023810A (zh
Inventor
田中阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN115023810A publication Critical patent/CN115023810A/zh
Application granted granted Critical
Publication of CN115023810B publication Critical patent/CN115023810B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H10W72/387—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202080094197.3A 2020-01-30 2020-01-30 半导体装置以及电力变换装置 Active CN115023810B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/003535 WO2021152795A1 (ja) 2020-01-30 2020-01-30 半導体装置および電力変換装置

Publications (2)

Publication Number Publication Date
CN115023810A CN115023810A (zh) 2022-09-06
CN115023810B true CN115023810B (zh) 2025-07-15

Family

ID=77078485

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080094197.3A Active CN115023810B (zh) 2020-01-30 2020-01-30 半导体装置以及电力变换装置

Country Status (5)

Country Link
US (1) US20220415748A1 (https=)
JP (1) JP7132340B2 (https=)
CN (1) CN115023810B (https=)
DE (1) DE112020006643T5 (https=)
WO (1) WO2021152795A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115428145B (zh) * 2020-04-17 2025-10-24 株式会社电装 半导体装置及半导体模组
JP7657529B2 (ja) 2021-11-16 2025-04-07 三菱電機株式会社 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7227245B1 (en) * 2004-02-26 2007-06-05 National Semiconductor Corporation Die attach pad for use in semiconductor manufacturing and method of making same
CN108281407A (zh) * 2017-01-05 2018-07-13 意法半导体公司 具有粘合剂溢流凹部的经修改的引线框架设计

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6373544A (ja) * 1986-09-16 1988-04-04 Matsushita Electronics Corp リ−ドフレ−ム
US6909178B2 (en) * 2000-09-06 2005-06-21 Sanyo Electric Co., Ltd. Semiconductor device and method of manufacturing the same
JP4343117B2 (ja) * 2005-01-07 2009-10-14 株式会社ルネサステクノロジ 半導体装置およびその製造方法
JP2006318996A (ja) * 2005-05-10 2006-11-24 Matsushita Electric Ind Co Ltd リードフレームおよび樹脂封止型半導体装置
US8536689B2 (en) * 2005-10-03 2013-09-17 Stats Chippac Ltd. Integrated circuit package system with multi-surface die attach pad
US7838974B2 (en) * 2007-09-13 2010-11-23 National Semiconductor Corporation Intergrated circuit packaging with improved die bonding
JP2009076658A (ja) * 2007-09-20 2009-04-09 Renesas Technology Corp 半導体装置及びその製造方法
US7808089B2 (en) * 2007-12-18 2010-10-05 National Semiconductor Corporation Leadframe having die attach pad with delamination and crack-arresting features
US20090152683A1 (en) * 2007-12-18 2009-06-18 National Semiconductor Corporation Rounded die configuration for stress minimization and enhanced thermo-mechanical reliability
WO2011093500A1 (ja) * 2010-01-31 2011-08-04 国立大学法人長崎大学 電力変換装置の制御回路および制御方法
US8230743B2 (en) * 2010-08-23 2012-07-31 Honeywell International Inc. Pressure sensor
CN103402853B (zh) * 2011-04-07 2016-01-13 三菱电机株式会社 作为电动助力转向装置的功率部使用的模塑模块以及电动助力转向装置
EP2725609B1 (en) * 2011-06-27 2019-11-13 Rohm Co., Ltd. Semiconductor module
JP5813137B2 (ja) * 2011-12-26 2015-11-17 三菱電機株式会社 電力用半導体装置及びその製造方法
JP5804203B2 (ja) * 2012-07-11 2015-11-04 三菱電機株式会社 半導体装置およびその製造方法
US9711424B2 (en) * 2012-09-17 2017-07-18 Littelfuse, Inc. Low thermal stress package for large area semiconductor dies
KR101957529B1 (ko) * 2013-06-28 2019-03-13 매그나칩 반도체 유한회사 반도체 패키지
KR101827186B1 (ko) * 2013-09-04 2018-02-07 미쓰비시덴키 가부시키가이샤 반도체 모듈 및 인버터 장치
MY184608A (en) * 2013-12-10 2021-04-07 Carsem M Sdn Bhd Pre-molded integrated circuit packages
JP5892184B2 (ja) * 2014-03-18 2016-03-23 トヨタ自動車株式会社 半導体装置及び半導体装置の製造方法
JP6303776B2 (ja) * 2014-04-29 2018-04-04 三菱電機株式会社 半導体装置
JP2016042553A (ja) * 2014-08-19 2016-03-31 株式会社東芝 半導体チップおよび電子部品
WO2016035217A1 (ja) * 2014-09-05 2016-03-10 三菱電機株式会社 電力変換システム
WO2016157394A1 (ja) * 2015-03-30 2016-10-06 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6418126B2 (ja) * 2015-10-09 2018-11-07 三菱電機株式会社 半導体装置
CN114823859A (zh) 2015-12-11 2022-07-29 罗姆股份有限公司 半导体装置
CN109891579B (zh) * 2016-10-31 2023-06-20 三菱电机株式会社 半导体装置及其制造方法
JP6874467B2 (ja) * 2017-03-29 2021-05-19 株式会社デンソー 半導体装置とその製造方法
JP2018186176A (ja) * 2017-04-25 2018-11-22 トヨタ自動車株式会社 半導体モジュール
JP6834815B2 (ja) * 2017-07-06 2021-02-24 株式会社デンソー 半導体モジュール
CN109427698B (zh) * 2017-09-04 2023-08-29 恩智浦美国有限公司 组装qfp型半导体器件的方法
WO2019044748A1 (ja) * 2017-09-04 2019-03-07 三菱電機株式会社 半導体モジュール及び電力変換装置
US20190103342A1 (en) * 2017-10-04 2019-04-04 Infineon Technologies Ag Semiconductor chip package comprising substrate, semiconductor chip, and leadframe and a method for fabricating the same
JP7074621B2 (ja) * 2018-09-05 2022-05-24 株式会社東芝 半導体装置及びその製造方法
JP7196815B2 (ja) * 2019-10-23 2022-12-27 三菱電機株式会社 半導体モジュール及び電力変換装置
JP7489181B2 (ja) * 2019-11-11 2024-05-23 株式会社 日立パワーデバイス 半導体装置
US20210202339A1 (en) * 2019-12-31 2021-07-01 UTAC Headquarters Pte. Ltd. Reliable semiconductor packages
JP7506564B2 (ja) * 2020-09-10 2024-06-26 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7227245B1 (en) * 2004-02-26 2007-06-05 National Semiconductor Corporation Die attach pad for use in semiconductor manufacturing and method of making same
CN108281407A (zh) * 2017-01-05 2018-07-13 意法半导体公司 具有粘合剂溢流凹部的经修改的引线框架设计

Also Published As

Publication number Publication date
WO2021152795A1 (ja) 2021-08-05
CN115023810A (zh) 2022-09-06
JPWO2021152795A1 (https=) 2021-08-05
JP7132340B2 (ja) 2022-09-06
DE112020006643T5 (de) 2022-11-24
US20220415748A1 (en) 2022-12-29

Similar Documents

Publication Publication Date Title
CN109727960B (zh) 半导体模块、其制造方法以及电力变换装置
JP6399272B1 (ja) パワーモジュール及びその製造方法並びに電力変換装置
CN116325135B (zh) 半导体封装、半导体装置以及电力变换装置
US11887903B2 (en) Power semiconductor device, method for manufacturing power semiconductor device, and power conversion apparatus
US20210391299A1 (en) Semiconductor device, method for manufacturing semiconductor device, and power conversion device
CN113646876B (zh) 功率半导体模块以及电力变换装置
CN111033736A (zh) 功率模块及其制造方法及电力变换装置
CN113874998A (zh) 半导体模块以及电力变换装置
CN113811990B (zh) 半导体装置、电力变换装置以及半导体装置的制造方法
JP7094447B2 (ja) パワーモジュール及び電力変換装置
US12469802B2 (en) Semiconductor device and power converter
JP7053897B2 (ja) 半導体装置、半導体装置の製造方法及び電力変換装置
CN111052325A (zh) 半导体模块以及电力转换装置
CN115023810B (zh) 半导体装置以及电力变换装置
CN111788676A (zh) 半导体装置以及电力变换装置
CN117438404A (zh) 半导体装置、半导体装置的制造方法以及电力变换装置
WO2018180580A1 (ja) 半導体装置および電力変換装置
JP7703109B1 (ja) パワーモジュール及びその製造方法、電子装置並びに電力変換装置
JP7781340B2 (ja) パワー半導体装置、パワーモジュール及び電力変換装置
JP7770282B2 (ja) 半導体装置、電力変換装置および半導体装置の製造方法
WO2021111563A1 (ja) 半導体装置、電力変換装置および半導体装置の製造方法
CN121444663A (zh) 功率模块及其制造方法以及电力变换装置
WO2025052628A1 (ja) 半導体装置、半導体装置の製造方法および電力変換装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant