JPWO2021152795A1 - - Google Patents

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Publication number
JPWO2021152795A1
JPWO2021152795A1 JP2020542477A JP2020542477A JPWO2021152795A1 JP WO2021152795 A1 JPWO2021152795 A1 JP WO2021152795A1 JP 2020542477 A JP2020542477 A JP 2020542477A JP 2020542477 A JP2020542477 A JP 2020542477A JP WO2021152795 A1 JPWO2021152795 A1 JP WO2021152795A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020542477A
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Japanese (ja)
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JP7132340B2 (ja
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Publication of JPWO2021152795A1 publication Critical patent/JPWO2021152795A1/ja
Application granted granted Critical
Publication of JP7132340B2 publication Critical patent/JP7132340B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/32—Means for protecting converters other than automatic disconnection
    • H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H02M7/53—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
    • H02M7/537—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters
    • H02M7/5387—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H10W72/387—Flow barriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/944—Dispositions of multiple bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2020542477A 2020-01-30 2020-01-30 半導体装置および電力変換装置 Active JP7132340B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/003535 WO2021152795A1 (ja) 2020-01-30 2020-01-30 半導体装置および電力変換装置

Publications (2)

Publication Number Publication Date
JPWO2021152795A1 true JPWO2021152795A1 (https=) 2021-08-05
JP7132340B2 JP7132340B2 (ja) 2022-09-06

Family

ID=77078485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020542477A Active JP7132340B2 (ja) 2020-01-30 2020-01-30 半導体装置および電力変換装置

Country Status (5)

Country Link
US (1) US20220415748A1 (https=)
JP (1) JP7132340B2 (https=)
CN (1) CN115023810B (https=)
DE (1) DE112020006643T5 (https=)
WO (1) WO2021152795A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115428145B (zh) * 2020-04-17 2025-10-24 株式会社电装 半导体装置及半导体模组
JP7657529B2 (ja) 2021-11-16 2025-04-07 三菱電機株式会社 半導体装置

Citations (10)

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JPS6373544A (ja) * 1986-09-16 1988-04-04 Matsushita Electronics Corp リ−ドフレ−ム
JP2006318996A (ja) * 2005-05-10 2006-11-24 Matsushita Electric Ind Co Ltd リードフレームおよび樹脂封止型半導体装置
US20070075404A1 (en) * 2005-10-03 2007-04-05 Stats Chippac Ltd. Integrated circuit package system with multi-surface die attach pad
US7227245B1 (en) * 2004-02-26 2007-06-05 National Semiconductor Corporation Die attach pad for use in semiconductor manufacturing and method of making same
JP2009076658A (ja) * 2007-09-20 2009-04-09 Renesas Technology Corp 半導体装置及びその製造方法
JP2015528648A (ja) * 2012-09-17 2015-09-28 リテルヒューズ・インク 広域半導体ダイのための低熱応力パッケージ
JP2015211178A (ja) * 2014-04-29 2015-11-24 三菱電機株式会社 半導体装置
WO2017099122A1 (ja) * 2015-12-11 2017-06-15 ローム株式会社 半導体装置
WO2018179981A1 (ja) * 2017-03-29 2018-10-04 トヨタ自動車株式会社 半導体装置
US20190043790A1 (en) * 2017-01-05 2019-02-07 Stmicroelectronics, Inc. Modified leadframe design with adhesive overflow recesses

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US6909178B2 (en) * 2000-09-06 2005-06-21 Sanyo Electric Co., Ltd. Semiconductor device and method of manufacturing the same
JP4343117B2 (ja) * 2005-01-07 2009-10-14 株式会社ルネサステクノロジ 半導体装置およびその製造方法
US7838974B2 (en) * 2007-09-13 2010-11-23 National Semiconductor Corporation Intergrated circuit packaging with improved die bonding
US7808089B2 (en) * 2007-12-18 2010-10-05 National Semiconductor Corporation Leadframe having die attach pad with delamination and crack-arresting features
US20090152683A1 (en) * 2007-12-18 2009-06-18 National Semiconductor Corporation Rounded die configuration for stress minimization and enhanced thermo-mechanical reliability
WO2011093500A1 (ja) * 2010-01-31 2011-08-04 国立大学法人長崎大学 電力変換装置の制御回路および制御方法
US8230743B2 (en) * 2010-08-23 2012-07-31 Honeywell International Inc. Pressure sensor
CN103402853B (zh) * 2011-04-07 2016-01-13 三菱电机株式会社 作为电动助力转向装置的功率部使用的模塑模块以及电动助力转向装置
EP2725609B1 (en) * 2011-06-27 2019-11-13 Rohm Co., Ltd. Semiconductor module
JP5813137B2 (ja) * 2011-12-26 2015-11-17 三菱電機株式会社 電力用半導体装置及びその製造方法
JP5804203B2 (ja) * 2012-07-11 2015-11-04 三菱電機株式会社 半導体装置およびその製造方法
KR101957529B1 (ko) * 2013-06-28 2019-03-13 매그나칩 반도체 유한회사 반도체 패키지
KR101827186B1 (ko) * 2013-09-04 2018-02-07 미쓰비시덴키 가부시키가이샤 반도체 모듈 및 인버터 장치
MY184608A (en) * 2013-12-10 2021-04-07 Carsem M Sdn Bhd Pre-molded integrated circuit packages
JP5892184B2 (ja) * 2014-03-18 2016-03-23 トヨタ自動車株式会社 半導体装置及び半導体装置の製造方法
JP2016042553A (ja) * 2014-08-19 2016-03-31 株式会社東芝 半導体チップおよび電子部品
WO2016035217A1 (ja) * 2014-09-05 2016-03-10 三菱電機株式会社 電力変換システム
WO2016157394A1 (ja) * 2015-03-30 2016-10-06 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6418126B2 (ja) * 2015-10-09 2018-11-07 三菱電機株式会社 半導体装置
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JP2018186176A (ja) * 2017-04-25 2018-11-22 トヨタ自動車株式会社 半導体モジュール
JP6834815B2 (ja) * 2017-07-06 2021-02-24 株式会社デンソー 半導体モジュール
CN109427698B (zh) * 2017-09-04 2023-08-29 恩智浦美国有限公司 组装qfp型半导体器件的方法
WO2019044748A1 (ja) * 2017-09-04 2019-03-07 三菱電機株式会社 半導体モジュール及び電力変換装置
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JP7196815B2 (ja) * 2019-10-23 2022-12-27 三菱電機株式会社 半導体モジュール及び電力変換装置
JP7489181B2 (ja) * 2019-11-11 2024-05-23 株式会社 日立パワーデバイス 半導体装置
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JP7506564B2 (ja) * 2020-09-10 2024-06-26 新光電気工業株式会社 リードフレーム、半導体装置及びリードフレームの製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6373544A (ja) * 1986-09-16 1988-04-04 Matsushita Electronics Corp リ−ドフレ−ム
US7227245B1 (en) * 2004-02-26 2007-06-05 National Semiconductor Corporation Die attach pad for use in semiconductor manufacturing and method of making same
JP2006318996A (ja) * 2005-05-10 2006-11-24 Matsushita Electric Ind Co Ltd リードフレームおよび樹脂封止型半導体装置
US20070075404A1 (en) * 2005-10-03 2007-04-05 Stats Chippac Ltd. Integrated circuit package system with multi-surface die attach pad
JP2009076658A (ja) * 2007-09-20 2009-04-09 Renesas Technology Corp 半導体装置及びその製造方法
JP2015528648A (ja) * 2012-09-17 2015-09-28 リテルヒューズ・インク 広域半導体ダイのための低熱応力パッケージ
JP2015211178A (ja) * 2014-04-29 2015-11-24 三菱電機株式会社 半導体装置
WO2017099122A1 (ja) * 2015-12-11 2017-06-15 ローム株式会社 半導体装置
US20190043790A1 (en) * 2017-01-05 2019-02-07 Stmicroelectronics, Inc. Modified leadframe design with adhesive overflow recesses
WO2018179981A1 (ja) * 2017-03-29 2018-10-04 トヨタ自動車株式会社 半導体装置

Also Published As

Publication number Publication date
WO2021152795A1 (ja) 2021-08-05
CN115023810A (zh) 2022-09-06
JP7132340B2 (ja) 2022-09-06
DE112020006643T5 (de) 2022-11-24
US20220415748A1 (en) 2022-12-29
CN115023810B (zh) 2025-07-15

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