CN114276378A - 一种含硅低氯环氧树脂及其制备方法 - Google Patents
一种含硅低氯环氧树脂及其制备方法 Download PDFInfo
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- CN114276378A CN114276378A CN202111639748.2A CN202111639748A CN114276378A CN 114276378 A CN114276378 A CN 114276378A CN 202111639748 A CN202111639748 A CN 202111639748A CN 114276378 A CN114276378 A CN 114276378A
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- Prior art keywords
- epoxy resin
- silicon
- containing low
- intermediate product
- chlorine
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 92
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 92
- 239000000460 chlorine Substances 0.000 title claims abstract description 83
- 229910052801 chlorine Inorganic materials 0.000 title claims abstract description 83
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 69
- 239000010703 silicon Substances 0.000 title claims abstract description 69
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 144
- 238000006243 chemical reaction Methods 0.000 claims abstract description 65
- 239000013067 intermediate product Substances 0.000 claims abstract description 41
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 40
- 239000000243 solution Substances 0.000 claims abstract description 32
- 239000012074 organic phase Substances 0.000 claims abstract description 28
- 239000003960 organic solvent Substances 0.000 claims abstract description 28
- 239000011259 mixed solution Substances 0.000 claims abstract description 21
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000002390 rotary evaporation Methods 0.000 claims abstract description 17
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 claims abstract description 7
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 claims abstract description 6
- 230000006837 decompression Effects 0.000 claims abstract description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 123
- 238000001816 cooling Methods 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 20
- 238000011084 recovery Methods 0.000 claims description 14
- 239000002904 solvent Substances 0.000 claims description 10
- 238000006116 polymerization reaction Methods 0.000 claims description 6
- 238000004090 dissolution Methods 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 230000035484 reaction time Effects 0.000 claims description 3
- 239000008346 aqueous phase Substances 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 abstract description 18
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 abstract description 14
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 9
- 230000015572 biosynthetic process Effects 0.000 abstract description 7
- 238000003786 synthesis reaction Methods 0.000 abstract description 7
- 238000007033 dehydrochlorination reaction Methods 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 238000004821 distillation Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 10
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 9
- 238000010521 absorption reaction Methods 0.000 description 8
- 239000012071 phase Substances 0.000 description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 230000007062 hydrolysis Effects 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical group [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006298 dechlorination reaction Methods 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012434 nucleophilic reagent Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- ZQZCOBSUOFHDEE-UHFFFAOYSA-N tetrapropyl silicate Chemical compound CCCO[Si](OCCC)(OCCC)OCCC ZQZCOBSUOFHDEE-UHFFFAOYSA-N 0.000 description 1
- YHLJHYMNIZNTGJ-UHFFFAOYSA-N trihydroxy(pentoxy)silane Chemical compound CCCCCO[Si](O)(O)O YHLJHYMNIZNTGJ-UHFFFAOYSA-N 0.000 description 1
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Abstract
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CN114276378A true CN114276378A (zh) | 2022-04-05 |
CN114276378B CN114276378B (zh) | 2023-09-19 |
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Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5336703A (en) * | 1988-11-25 | 1994-08-09 | Kanegafuchi Chemical Industry Co., Ltd. | Two pack type curable composition comprising epoxy resin and silicon-containing elastomeric polymer |
JP2001288244A (ja) * | 2000-04-06 | 2001-10-16 | Hitachi Ltd | 熱硬化性樹脂組成物、その製法及びそれを用いた製品 |
JP2002249539A (ja) * | 2000-12-22 | 2002-09-06 | Arakawa Chem Ind Co Ltd | アルコキシ基含有シラン変性エポキシ樹脂、その製造法、エポキシ樹脂組成物およびその硬化物 |
JP2003040970A (ja) * | 2001-07-27 | 2003-02-13 | Arakawa Chem Ind Co Ltd | シラン変性エポキシ樹脂の製造方法、及び樹脂組成物、半硬化物、硬化物 |
US6525160B1 (en) * | 1999-06-17 | 2003-02-25 | Arakawa Chemical Industries Ltd. | Epoxy resin composition and process for producing silane-modified epoxy resin |
JP2003113223A (ja) * | 2001-10-05 | 2003-04-18 | Nippon Kayaku Co Ltd | 高純度液状エポキシ樹脂及びその製法、エポキシ樹脂組成物及びその硬化物 |
JP2004323811A (ja) * | 2003-04-23 | 2004-11-18 | Hitachi Kasei Polymer Co Ltd | フレキシブルプリント配線板積層用接着剤組成物および接着フィルム |
JP2005179401A (ja) * | 2003-12-16 | 2005-07-07 | Sanyo Chem Ind Ltd | エポキシ樹脂組成物 |
JP2006143789A (ja) * | 2004-11-17 | 2006-06-08 | Arakawa Chem Ind Co Ltd | メトキシ基含有シラン変性エポキシ樹脂、メトキシ基含有シラン変性エポキシ樹脂組成物、樹脂硬化物、電気絶縁用樹脂組成物およびコーティング組成物 |
JP2007056089A (ja) * | 2005-08-23 | 2007-03-08 | Japan Epoxy Resin Kk | 精製エポキシ樹脂の製造方法 |
CN101265320A (zh) * | 2007-03-16 | 2008-09-17 | 西北工业大学 | 低有机氯含量环氧树脂的制备方法 |
JP2010006936A (ja) * | 2008-06-26 | 2010-01-14 | Konishi Co Ltd | 混合増粘型硬化性樹脂組成物及び硬化性樹脂組成物における増粘方法 |
KR101125845B1 (ko) * | 2011-08-24 | 2012-03-28 | 주식회사 코켐스 | 실리콘계 2액형 유ㆍ무기계 하이브리드 코팅제 및 제조방법 |
JP2014201650A (ja) * | 2013-04-04 | 2014-10-27 | 昭和電工株式会社 | エポキシ樹脂組成物 |
WO2017166913A1 (zh) * | 2016-04-01 | 2017-10-05 | 厦门大学 | 一种含氟硅环氧树脂耐辐射涂料及其制备方法 |
CN108395820A (zh) * | 2018-04-11 | 2018-08-14 | 陈雨薇 | 一种外墙用环氧树脂涂料的制备方法 |
CN109851759A (zh) * | 2018-11-06 | 2019-06-07 | 中国神华能源股份有限公司 | 有机硅改性环氧树脂、其制备方法以及有机硅改性环氧树脂胶黏剂 |
US20210363358A1 (en) * | 2017-12-20 | 2021-11-25 | Ppg Industries Ohio, Inc. | Coating Compositions Having Improved Corrosion Resistance |
-
2021
- 2021-12-29 CN CN202111639748.2A patent/CN114276378B/zh active Active
Patent Citations (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5336703A (en) * | 1988-11-25 | 1994-08-09 | Kanegafuchi Chemical Industry Co., Ltd. | Two pack type curable composition comprising epoxy resin and silicon-containing elastomeric polymer |
US6525160B1 (en) * | 1999-06-17 | 2003-02-25 | Arakawa Chemical Industries Ltd. | Epoxy resin composition and process for producing silane-modified epoxy resin |
JP2001288244A (ja) * | 2000-04-06 | 2001-10-16 | Hitachi Ltd | 熱硬化性樹脂組成物、その製法及びそれを用いた製品 |
JP2002249539A (ja) * | 2000-12-22 | 2002-09-06 | Arakawa Chem Ind Co Ltd | アルコキシ基含有シラン変性エポキシ樹脂、その製造法、エポキシ樹脂組成物およびその硬化物 |
JP2003040970A (ja) * | 2001-07-27 | 2003-02-13 | Arakawa Chem Ind Co Ltd | シラン変性エポキシ樹脂の製造方法、及び樹脂組成物、半硬化物、硬化物 |
JP2003113223A (ja) * | 2001-10-05 | 2003-04-18 | Nippon Kayaku Co Ltd | 高純度液状エポキシ樹脂及びその製法、エポキシ樹脂組成物及びその硬化物 |
JP2004323811A (ja) * | 2003-04-23 | 2004-11-18 | Hitachi Kasei Polymer Co Ltd | フレキシブルプリント配線板積層用接着剤組成物および接着フィルム |
JP2005179401A (ja) * | 2003-12-16 | 2005-07-07 | Sanyo Chem Ind Ltd | エポキシ樹脂組成物 |
JP2006143789A (ja) * | 2004-11-17 | 2006-06-08 | Arakawa Chem Ind Co Ltd | メトキシ基含有シラン変性エポキシ樹脂、メトキシ基含有シラン変性エポキシ樹脂組成物、樹脂硬化物、電気絶縁用樹脂組成物およびコーティング組成物 |
JP2007056089A (ja) * | 2005-08-23 | 2007-03-08 | Japan Epoxy Resin Kk | 精製エポキシ樹脂の製造方法 |
CN101265320A (zh) * | 2007-03-16 | 2008-09-17 | 西北工业大学 | 低有机氯含量环氧树脂的制备方法 |
JP2010006936A (ja) * | 2008-06-26 | 2010-01-14 | Konishi Co Ltd | 混合増粘型硬化性樹脂組成物及び硬化性樹脂組成物における増粘方法 |
KR101125845B1 (ko) * | 2011-08-24 | 2012-03-28 | 주식회사 코켐스 | 실리콘계 2액형 유ㆍ무기계 하이브리드 코팅제 및 제조방법 |
JP2014201650A (ja) * | 2013-04-04 | 2014-10-27 | 昭和電工株式会社 | エポキシ樹脂組成物 |
WO2017166913A1 (zh) * | 2016-04-01 | 2017-10-05 | 厦门大学 | 一种含氟硅环氧树脂耐辐射涂料及其制备方法 |
US20210363358A1 (en) * | 2017-12-20 | 2021-11-25 | Ppg Industries Ohio, Inc. | Coating Compositions Having Improved Corrosion Resistance |
CN108395820A (zh) * | 2018-04-11 | 2018-08-14 | 陈雨薇 | 一种外墙用环氧树脂涂料的制备方法 |
CN109851759A (zh) * | 2018-11-06 | 2019-06-07 | 中国神华能源股份有限公司 | 有机硅改性环氧树脂、其制备方法以及有机硅改性环氧树脂胶黏剂 |
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Effective date of registration: 20221208 Address after: 710000 Room 203, Linjian Market, Fengcheng 8th Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Applicant after: Zhilun Ultrapure Epoxy Resin (Xi'an) Co.,Ltd. Address before: 710000 Hubin Garden community, No. 3, Huanhu North Road, Weiyang District, Xi'an City, Shaanxi Province Applicant before: Du Biao |
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Address after: 710000 Room 203, Linjian Market, Fengcheng 8th Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee after: Zhilun New Materials Technology (Xi'an) Co.,Ltd. Country or region after: China Address before: 710000 Room 203, Linjian Market, Fengcheng 8th Road, Xi'an Economic and Technological Development Zone, Shaanxi Province Patentee before: Zhilun Ultrapure Epoxy Resin (Xi'an) Co.,Ltd. Country or region before: China |