CN114007942B - 一种出厂检查装置、具有该装置的包装装置及包装系统 - Google Patents

一种出厂检查装置、具有该装置的包装装置及包装系统 Download PDF

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Publication number
CN114007942B
CN114007942B CN201980097122.8A CN201980097122A CN114007942B CN 114007942 B CN114007942 B CN 114007942B CN 201980097122 A CN201980097122 A CN 201980097122A CN 114007942 B CN114007942 B CN 114007942B
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China
Prior art keywords
container
light
light source
bag
packaging
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CN201980097122.8A
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English (en)
Chinese (zh)
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CN114007942A (zh
Inventor
桑野贵史
富泽肇
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Ultra Micro Technology Research Co ltd
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Ultra Micro Technology Research Co ltd
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Publication of CN114007942A publication Critical patent/CN114007942A/zh
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B51/00Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
    • B65B51/10Applying or generating heat or pressure or combinations thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B57/00Automatic control, checking, warning, or safety devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B57/00Automatic control, checking, warning, or safety devices
    • B65B57/10Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65BMACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B2220/00Specific aspects of the packaging operation
    • B65B2220/16Packaging contents into primary and secondary packaging

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Closing Of Containers (AREA)
CN201980097122.8A 2019-06-10 2019-06-10 一种出厂检查装置、具有该装置的包装装置及包装系统 Active CN114007942B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/022875 WO2020250267A1 (ja) 2019-06-10 2019-06-10 出荷検査装置、これを有する包装装置および包装システム

Publications (2)

Publication Number Publication Date
CN114007942A CN114007942A (zh) 2022-02-01
CN114007942B true CN114007942B (zh) 2024-07-05

Family

ID=73782135

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980097122.8A Active CN114007942B (zh) 2019-06-10 2019-06-10 一种出厂检查装置、具有该装置的包装装置及包装系统

Country Status (4)

Country Link
JP (1) JP7313728B2 (enExample)
KR (1) KR102744895B1 (enExample)
CN (1) CN114007942B (enExample)
WO (1) WO2020250267A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114379830B (zh) * 2022-03-23 2022-06-10 南京伟测半导体科技有限公司 一种晶舟盒内晶圆位置检测装置
EP4273910A1 (de) * 2022-05-05 2023-11-08 Siltronic AG Vorrichtung zum verpacken von waferkassetten
CN114889866B (zh) * 2022-05-13 2024-04-26 漳州佳龙科技股份有限公司 一种推包机构及其工作方法
CN114889867B (zh) * 2022-05-13 2024-08-09 漳州佳龙科技股份有限公司 一种真空包装二次装袋机及其工作方法
JP2024033435A (ja) * 2022-08-30 2024-03-13 オリオン機械工業株式会社 ガセット袋の封止方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63253205A (ja) * 1987-04-09 1988-10-20 Nichizou Tec:Kk チユ−ブシ−ル等の異常検出装置
CN1591775A (zh) * 2003-08-15 2005-03-09 阿斯莫国际公司 用于勘测位于封闭的晶片盒内的晶片的方法和装置
JP2015058958A (ja) * 2013-09-19 2015-03-30 ミクロ技研株式会社 包装装置および包装システム

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04142231A (ja) * 1990-09-21 1992-05-15 Anritsu Corp 包装機
CN102576687B (zh) * 2009-11-17 2015-11-25 昕芙旎雅有限公司 晶圆检测装置
JP5407961B2 (ja) 2010-03-18 2014-02-05 信越半導体株式会社 容器包装装置
JP5639958B2 (ja) * 2011-05-27 2014-12-10 日東電工株式会社 半導体ウエハマウント方法および半導体ウエハマウント装置
JP2017037910A (ja) * 2015-08-07 2017-02-16 日東電工株式会社 半導体ウエハの搬送方法および半導体ウエハの搬送装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63253205A (ja) * 1987-04-09 1988-10-20 Nichizou Tec:Kk チユ−ブシ−ル等の異常検出装置
CN1591775A (zh) * 2003-08-15 2005-03-09 阿斯莫国际公司 用于勘测位于封闭的晶片盒内的晶片的方法和装置
JP2015058958A (ja) * 2013-09-19 2015-03-30 ミクロ技研株式会社 包装装置および包装システム

Also Published As

Publication number Publication date
KR102744895B1 (ko) 2024-12-19
WO2020250267A1 (ja) 2020-12-17
JP7313728B2 (ja) 2023-07-25
JPWO2020250267A1 (enExample) 2020-12-17
KR20220018043A (ko) 2022-02-14
CN114007942A (zh) 2022-02-01

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