JP7313728B2 - 出荷検査装置、これを有する包装装置および包装システム - Google Patents

出荷検査装置、これを有する包装装置および包装システム Download PDF

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Publication number
JP7313728B2
JP7313728B2 JP2021525408A JP2021525408A JP7313728B2 JP 7313728 B2 JP7313728 B2 JP 7313728B2 JP 2021525408 A JP2021525408 A JP 2021525408A JP 2021525408 A JP2021525408 A JP 2021525408A JP 7313728 B2 JP7313728 B2 JP 7313728B2
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JP
Japan
Prior art keywords
light
container
bag
packaging
sealing
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JP2021525408A
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English (en)
Japanese (ja)
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JPWO2020250267A1 (enExample
JPWO2020250267A5 (enExample
Inventor
貴史 桑野
肇 冨澤
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Micro Engineering Inc
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Micro Engineering Inc
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Publication of JPWO2020250267A1 publication Critical patent/JPWO2020250267A1/ja
Publication of JPWO2020250267A5 publication Critical patent/JPWO2020250267A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B57/00—Automatic control, checking, warning, or safety devices
    • B65B57/10—Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
    • B65B51/10—Applying or generating heat or pressure or combinations thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B57/00—Automatic control, checking, warning, or safety devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
    • B65B2220/00—Specific aspects of the packaging operation
    • B65B2220/16—Packaging contents into primary and secondary packaging

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Closing Of Containers (AREA)
JP2021525408A 2019-06-10 2019-06-10 出荷検査装置、これを有する包装装置および包装システム Active JP7313728B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/022875 WO2020250267A1 (ja) 2019-06-10 2019-06-10 出荷検査装置、これを有する包装装置および包装システム

Publications (3)

Publication Number Publication Date
JPWO2020250267A1 JPWO2020250267A1 (enExample) 2020-12-17
JPWO2020250267A5 JPWO2020250267A5 (enExample) 2022-02-14
JP7313728B2 true JP7313728B2 (ja) 2023-07-25

Family

ID=73782135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021525408A Active JP7313728B2 (ja) 2019-06-10 2019-06-10 出荷検査装置、これを有する包装装置および包装システム

Country Status (4)

Country Link
JP (1) JP7313728B2 (enExample)
KR (1) KR102744895B1 (enExample)
CN (1) CN114007942B (enExample)
WO (1) WO2020250267A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114379830B (zh) * 2022-03-23 2022-06-10 南京伟测半导体科技有限公司 一种晶舟盒内晶圆位置检测装置
EP4273910A1 (de) * 2022-05-05 2023-11-08 Siltronic AG Vorrichtung zum verpacken von waferkassetten
CN114889866B (zh) * 2022-05-13 2024-04-26 漳州佳龙科技股份有限公司 一种推包机构及其工作方法
CN114889867B (zh) * 2022-05-13 2024-08-09 漳州佳龙科技股份有限公司 一种真空包装二次装袋机及其工作方法
JP2024033435A (ja) * 2022-08-30 2024-03-13 オリオン機械工業株式会社 ガセット袋の封止方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064515A (ja) 2003-08-15 2005-03-10 Asm Internatl Nv 閉じたウェハカセットの内部に配置されたウェハのマッピングのための方法および装置
JP2015058958A (ja) 2013-09-19 2015-03-30 ミクロ技研株式会社 包装装置および包装システム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63253205A (ja) * 1987-04-09 1988-10-20 Nichizou Tec:Kk チユ−ブシ−ル等の異常検出装置
JPH04142231A (ja) * 1990-09-21 1992-05-15 Anritsu Corp 包装機
CN102576687B (zh) * 2009-11-17 2015-11-25 昕芙旎雅有限公司 晶圆检测装置
JP5407961B2 (ja) 2010-03-18 2014-02-05 信越半導体株式会社 容器包装装置
JP5639958B2 (ja) * 2011-05-27 2014-12-10 日東電工株式会社 半導体ウエハマウント方法および半導体ウエハマウント装置
JP2017037910A (ja) * 2015-08-07 2017-02-16 日東電工株式会社 半導体ウエハの搬送方法および半導体ウエハの搬送装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064515A (ja) 2003-08-15 2005-03-10 Asm Internatl Nv 閉じたウェハカセットの内部に配置されたウェハのマッピングのための方法および装置
JP2015058958A (ja) 2013-09-19 2015-03-30 ミクロ技研株式会社 包装装置および包装システム

Also Published As

Publication number Publication date
KR102744895B1 (ko) 2024-12-19
WO2020250267A1 (ja) 2020-12-17
JPWO2020250267A1 (enExample) 2020-12-17
CN114007942B (zh) 2024-07-05
KR20220018043A (ko) 2022-02-14
CN114007942A (zh) 2022-02-01

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