KR102744895B1 - 출하 검사 장치, 이것을 갖는 포장 장치 및 포장 시스템 - Google Patents
출하 검사 장치, 이것을 갖는 포장 장치 및 포장 시스템 Download PDFInfo
- Publication number
- KR102744895B1 KR102744895B1 KR1020227000712A KR20227000712A KR102744895B1 KR 102744895 B1 KR102744895 B1 KR 102744895B1 KR 1020227000712 A KR1020227000712 A KR 1020227000712A KR 20227000712 A KR20227000712 A KR 20227000712A KR 102744895 B1 KR102744895 B1 KR 102744895B1
- Authority
- KR
- South Korea
- Prior art keywords
- light
- container
- packaging
- envelope
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract 26
- 238000007689 inspection Methods 0.000 title claims abstract 4
- 235000012431 wafers Nutrition 0.000 claims abstract 26
- 238000001514 detection method Methods 0.000 claims abstract 10
- 238000007789 sealing Methods 0.000 claims 14
- 230000001678 irradiating effect Effects 0.000 claims 3
- 230000037431 insertion Effects 0.000 abstract 1
- 238000003780 insertion Methods 0.000 abstract 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B51/00—Devices for, or methods of, sealing or securing package folds or closures; Devices for gathering or twisting wrappers, or necks of bags
- B65B51/10—Applying or generating heat or pressure or combinations thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B57/00—Automatic control, checking, warning, or safety devices
- B65B57/10—Automatic control, checking, warning, or safety devices responsive to absence, presence, abnormal feed, or misplacement of articles or materials to be packaged
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B2220/00—Specific aspects of the packaging operation
- B65B2220/16—Packaging contents into primary and secondary packaging
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supplying Of Containers To The Packaging Station (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Closing Of Containers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/022875 WO2020250267A1 (ja) | 2019-06-10 | 2019-06-10 | 出荷検査装置、これを有する包装装置および包装システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20220018043A KR20220018043A (ko) | 2022-02-14 |
| KR102744895B1 true KR102744895B1 (ko) | 2024-12-19 |
Family
ID=73782135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227000712A Active KR102744895B1 (ko) | 2019-06-10 | 2019-06-10 | 출하 검사 장치, 이것을 갖는 포장 장치 및 포장 시스템 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7313728B2 (enExample) |
| KR (1) | KR102744895B1 (enExample) |
| CN (1) | CN114007942B (enExample) |
| WO (1) | WO2020250267A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114379830B (zh) * | 2022-03-23 | 2022-06-10 | 南京伟测半导体科技有限公司 | 一种晶舟盒内晶圆位置检测装置 |
| EP4273910A1 (de) * | 2022-05-05 | 2023-11-08 | Siltronic AG | Vorrichtung zum verpacken von waferkassetten |
| CN114889866B (zh) * | 2022-05-13 | 2024-04-26 | 漳州佳龙科技股份有限公司 | 一种推包机构及其工作方法 |
| CN114889867B (zh) * | 2022-05-13 | 2024-08-09 | 漳州佳龙科技股份有限公司 | 一种真空包装二次装袋机及其工作方法 |
| JP2024033435A (ja) * | 2022-08-30 | 2024-03-13 | オリオン機械工業株式会社 | ガセット袋の封止方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005064515A (ja) * | 2003-08-15 | 2005-03-10 | Asm Internatl Nv | 閉じたウェハカセットの内部に配置されたウェハのマッピングのための方法および装置 |
| JP2015058958A (ja) * | 2013-09-19 | 2015-03-30 | ミクロ技研株式会社 | 包装装置および包装システム |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63253205A (ja) * | 1987-04-09 | 1988-10-20 | Nichizou Tec:Kk | チユ−ブシ−ル等の異常検出装置 |
| JPH04142231A (ja) * | 1990-09-21 | 1992-05-15 | Anritsu Corp | 包装機 |
| CN102576687B (zh) * | 2009-11-17 | 2015-11-25 | 昕芙旎雅有限公司 | 晶圆检测装置 |
| JP5407961B2 (ja) | 2010-03-18 | 2014-02-05 | 信越半導体株式会社 | 容器包装装置 |
| JP5639958B2 (ja) * | 2011-05-27 | 2014-12-10 | 日東電工株式会社 | 半導体ウエハマウント方法および半導体ウエハマウント装置 |
| JP2017037910A (ja) * | 2015-08-07 | 2017-02-16 | 日東電工株式会社 | 半導体ウエハの搬送方法および半導体ウエハの搬送装置 |
-
2019
- 2019-06-10 CN CN201980097122.8A patent/CN114007942B/zh active Active
- 2019-06-10 KR KR1020227000712A patent/KR102744895B1/ko active Active
- 2019-06-10 JP JP2021525408A patent/JP7313728B2/ja active Active
- 2019-06-10 WO PCT/JP2019/022875 patent/WO2020250267A1/ja not_active Ceased
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005064515A (ja) * | 2003-08-15 | 2005-03-10 | Asm Internatl Nv | 閉じたウェハカセットの内部に配置されたウェハのマッピングのための方法および装置 |
| JP2015058958A (ja) * | 2013-09-19 | 2015-03-30 | ミクロ技研株式会社 | 包装装置および包装システム |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020250267A1 (ja) | 2020-12-17 |
| JP7313728B2 (ja) | 2023-07-25 |
| JPWO2020250267A1 (enExample) | 2020-12-17 |
| CN114007942B (zh) | 2024-07-05 |
| KR20220018043A (ko) | 2022-02-14 |
| CN114007942A (zh) | 2022-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20220107 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PA0201 | Request for examination | ||
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20231106 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20241126 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20241216 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20241217 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration |