CN1134829C - 半导体器件的制造装置 - Google Patents

半导体器件的制造装置 Download PDF

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Publication number
CN1134829C
CN1134829C CNB971918805A CN97191880A CN1134829C CN 1134829 C CN1134829 C CN 1134829C CN B971918805 A CNB971918805 A CN B971918805A CN 97191880 A CN97191880 A CN 97191880A CN 1134829 C CN1134829 C CN 1134829C
Authority
CN
China
Prior art keywords
semiconductor device
manufacturing apparatus
silicon
halogen element
device manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB971918805A
Other languages
English (en)
Chinese (zh)
Other versions
CN1209908A (zh
Inventor
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今井伸一
二河秀夫
地割信浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp, Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electronics Corp
Publication of CN1209908A publication Critical patent/CN1209908A/zh
Application granted granted Critical
Publication of CN1134829C publication Critical patent/CN1134829C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H10P72/0421—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H10P50/242—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
CNB971918805A 1996-01-26 1997-01-23 半导体器件的制造装置 Expired - Fee Related CN1134829C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11434/96 1996-01-26
JP1143496 1996-01-26
JP11434/1996 1996-01-26

Publications (2)

Publication Number Publication Date
CN1209908A CN1209908A (zh) 1999-03-03
CN1134829C true CN1134829C (zh) 2004-01-14

Family

ID=11777987

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB971918805A Expired - Fee Related CN1134829C (zh) 1996-01-26 1997-01-23 半导体器件的制造装置

Country Status (6)

Country Link
US (1) US6214740B1 (OSRAM)
EP (1) EP0966028A1 (OSRAM)
KR (1) KR100309225B1 (OSRAM)
CN (1) CN1134829C (OSRAM)
TW (1) TW371779B (OSRAM)
WO (1) WO1997027622A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1252359B1 (en) * 1999-12-02 2020-03-11 OEM Group, Inc Method of operating a platinum etch reactor
AU2002212963A1 (en) * 2000-10-25 2002-05-06 Tokyo Electron Limited Method of and structure for controlling electrode temperature
JP3971603B2 (ja) * 2001-12-04 2007-09-05 キヤノンアネルバ株式会社 絶縁膜エッチング装置及び絶縁膜エッチング方法
JP4645167B2 (ja) * 2004-11-15 2011-03-09 東京エレクトロン株式会社 フォーカスリング、プラズマエッチング装置及びプラズマエッチング方法。
JP4791034B2 (ja) * 2004-12-28 2011-10-12 東京エレクトロン株式会社 半導体装置の製造方法
US20090084987A1 (en) * 2007-09-28 2009-04-02 Varian Semiconductor Equipment Associates, Inc. Charge neutralization in a plasma processing apparatus
CN102017099A (zh) * 2008-12-17 2011-04-13 松下电器产业株式会社 贯通电极的形成方法及半导体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776840A (en) 1980-10-31 1982-05-14 Victor Co Of Japan Ltd Forming method of pattern
JPS61276322A (ja) 1985-05-31 1986-12-06 Mitsubishi Electric Corp 半導体製造装置
JPS6247130A (ja) 1985-08-27 1987-02-28 Kokusai Electric Co Ltd 反応性イオンエツチング装置
US5556501A (en) * 1989-10-03 1996-09-17 Applied Materials, Inc. Silicon scavenger in an inductively coupled RF plasma reactor
JPH0826464B2 (ja) * 1989-10-20 1996-03-13 イビデン株式会社 プラズマエツチング用電極板
JP3044824B2 (ja) * 1991-04-27 2000-05-22 ソニー株式会社 ドライエッチング装置及びドライエッチング方法
KR100281345B1 (ko) 1992-12-01 2001-03-02 조셉 제이. 스위니 전자기 결합성 플래너 플라즈마 장치에서의 산화물 에칭 공정
JPH07161702A (ja) * 1993-10-29 1995-06-23 Applied Materials Inc 酸化物のプラズマエッチング方法
JP3257741B2 (ja) * 1994-03-03 2002-02-18 東京エレクトロン株式会社 プラズマエッチング装置及び方法
JP3138381B2 (ja) 1994-01-20 2001-02-26 株式会社日立製作所 監視装置
US5474649A (en) * 1994-03-08 1995-12-12 Applied Materials, Inc. Plasma processing apparatus employing a textured focus ring
US6007673A (en) * 1996-10-02 1999-12-28 Matsushita Electronics Corporation Apparatus and method of producing an electronic device

Also Published As

Publication number Publication date
KR100309225B1 (ko) 2002-02-19
US6214740B1 (en) 2001-04-10
KR19990082008A (ko) 1999-11-15
EP0966028A4 (OSRAM) 1999-12-22
WO1997027622A1 (fr) 1997-07-31
TW371779B (en) 1999-10-11
CN1209908A (zh) 1999-03-03
EP0966028A1 (en) 1999-12-22

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Granted publication date: 20040114

Termination date: 20130123

CF01 Termination of patent right due to non-payment of annual fee