CN113383382A - 阵列基板、显示面板、拼接显示面板及显示驱动方法 - Google Patents

阵列基板、显示面板、拼接显示面板及显示驱动方法 Download PDF

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CN113383382A
CN113383382A CN201980002696.2A CN201980002696A CN113383382A CN 113383382 A CN113383382 A CN 113383382A CN 201980002696 A CN201980002696 A CN 201980002696A CN 113383382 A CN113383382 A CN 113383382A
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circuit
pixel
shift register
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group
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CN113383382B (zh
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赵蛟
肖丽
玄明花
郑皓亮
刘冬妮
刘静
齐琪
张振宇
陈亮
陈昊
袁丽君
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BOE Technology Group Co Ltd
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    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
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    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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    • H01L27/0203Particular design considerations for integrated circuits
    • H01L27/0248Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
    • H01L27/0251Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices
    • H01L27/0296Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection for MOS devices involving a specific disposition of the protective devices
    • HELECTRICITY
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    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1248Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Liquid Crystal (AREA)
  • Control Of El Displays (AREA)
  • Electroluminescent Light Sources (AREA)
  • Shift Register Type Memory (AREA)
  • Liquid Crystal Display Device Control (AREA)

Abstract

一种阵列基板(101),包括:显示区(AA)、至少一个像素组(1)和至少一个像素电路组(2)。至少一个像素组(1)位于显示区(AA)内,至少一个像素组(1)中的每个包括阵列设置的多个像素(10)。至少一个像素电路组(2)中的每个位于对应的像素组(1)内相邻两行像素(10)或相邻两列像素(10)之间。

Description

PCT国内申请,说明书已公开。

Claims (15)

  1. PCT国内申请,权利要求书已公开。
CN201980002696.2A 2019-11-29 2019-11-29 阵列基板、显示面板、拼接显示面板及显示驱动方法 Active CN113383382B (zh)

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PCT/CN2019/122210 WO2021103014A1 (zh) 2019-11-29 2019-11-29 阵列基板、显示面板、拼接显示面板及显示驱动方法

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US (2) US11373584B2 (zh)
EP (1) EP4068258A4 (zh)
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WO (1) WO2021103014A1 (zh)

Cited By (3)

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CN114141162A (zh) * 2021-12-07 2022-03-04 惠州华星光电显示有限公司 一种显示屏拼接方法及拼接显示屏
CN115798342A (zh) * 2022-11-07 2023-03-14 上海天马微电子有限公司 显示面板及拼接显示装置
CN115830998A (zh) * 2022-11-29 2023-03-21 上海天马微电子有限公司 显示面板及拼接显示装置

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EP3918635A4 (en) * 2019-05-03 2022-04-06 Samsung Electronics Co., Ltd. LIGHT EMITTING DIODE MODULE
JP7422869B2 (ja) * 2019-11-29 2024-01-26 京東方科技集團股▲ふん▼有限公司 アレイ基板、表示パネル、スプライシング表示パネル、及び表示駆動方法
CN113196371A (zh) * 2019-11-29 2021-07-30 京东方科技集团股份有限公司 阵列基板及其制备方法、像素驱动方法、显示面板
KR20210086314A (ko) * 2019-12-31 2021-07-08 엘지디스플레이 주식회사 표시 장치와 이를 이용한 멀티 스크린 표시 장치
CN117037620A (zh) * 2020-05-22 2023-11-10 群创光电股份有限公司 电子装置
US11563051B2 (en) * 2020-08-05 2023-01-24 Wuhan China Star Optoelectronics Technology Co., Ltd. Light-emitting diode (LED) light board, spliced led light board and display device having the ends of the first and second signal wires being staggered
EP4167218A4 (en) * 2020-11-06 2023-07-26 Samsung Electronics Co., Ltd. DISPLAY MODULE, DISPLAY DEVICE AND METHOD OF MANUFACTURE THEREOF
TWI764449B (zh) * 2020-12-18 2022-05-11 友達光電股份有限公司 顯示裝置
US20230055746A1 (en) * 2021-08-17 2023-02-23 X Display Company Technology Limited Displays with dual-pixel drivers
CN113850223A (zh) * 2021-10-09 2021-12-28 武汉华星光电半导体显示技术有限公司 传感器装置及其驱动方法、显示装置
CN114023763B (zh) * 2021-10-19 2023-05-30 武汉华星光电半导体显示技术有限公司 显示面板及拼接显示面板
CN114299820B (zh) * 2021-12-29 2024-02-02 云谷(固安)科技有限公司 一种阵列基板以及显示面板
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