CN1132463A - 一种使带窗口的基板形成迭层和电路的方法 - Google Patents
一种使带窗口的基板形成迭层和电路的方法 Download PDFInfo
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Abstract
本发明提供一种把至少两块基板叠层在一起并在叠层板的至少一个表面上形成电路的方法。从至少一个基板电路接受面延伸出一个窗口。还提供一个插件,其上边有支撑面。当插件在窗口中,支撑面与电路接受面是同一平面。把压力加到两块基板相对面上使基板叠层。用干膜光刻胶薄片把电路接受面和支撑面覆盖起来以密封窗口,插入部件支撑光刻胶薄片。干膜光刻胶依规定图形图形化并显影,其表面形成电路。剥除残留光刻胶,并拿掉插入部件。
Description
本发明一般说来涉及使基板迭层化和电路化。说得详细一点,本发明涉及用于形成单芯片组件迭层板(SCML)或多芯片组件迭层板(MCML)的芯片托架的一种改进技术。上述多芯片组件迭层板托架上开有窗口用于接受集成电路芯片。尤其是在用以FR4而知名的类型的有机电路板工艺和其它环氧树酯一玻璃纤维板工艺来形成SCML和MCML的时候,本发明特别有用。
在形成电路板,特别是形成计算机中所用的电路板的时候,必须把各种部件装到一个基板上去。这些部件中有集成电路(I/C)芯片。为了把集成电路芯片装到电路板上去人们已经开发出了许多工艺。一种工艺是所谓的“直接芯片连接”(direct chip attach,DCA)。在这种工艺中,芯片和其他部件一起被直接地组装到计算机的电路板或者母板上。尽管这种装配形式有某些吸引人的方面,但对直接芯片连接来说存在着某些严重的限制。这些限制包括硅芯片与电路板的热不匹配。因为电路板典型地说是用环氧树酯玻璃纤维RF4工艺制成的而且它的热胀系数(CTE)和典型地说由硅制造的集成电路芯片的热胀系数有极大的不同。而且,还存在着在有芯片失效的情况下电路板要重新返工的问题,在极端的情况下,由于某一单个集成电路芯片的功能失常或其他问题,在生产工艺的最后不得不整个地拆毁一块电路板。
由于上述的和其他的理由,用于把集成电路芯片连接到电路上去的一个最通用的工艺是利用芯片托架。先把集成电路芯片装配到这些芯片托架上,然后依次把这些托架装配到电路板上。尽管这将导入另一封装级别。但对这种芯片装配形式来说有某些优点,例如,它是芯片连接的一种更希望的模式。在这种工艺中,可用焊球连接法,丝焊法把集成电路芯片安装到托架上,接着把已安装上一个或多个芯片的托架用各种不同的工艺,诸如插针入孔片(pin-in-hole),焊球法或者丝焊法安装到电路板上。这种工艺的优点是允许对单个托架上的芯片单个地或一小组进行测试,而且,如果发现有失效或功能失常的芯片,就可从很容易地换掉该芯片,或者如果不更换,该芯片和该托架可以报废而不必在工艺处理的最终形态下废掉或者拆掉整个电路板。此外,这种工艺还允许(由于若干理由)在芯片和芯片托架之间对热不匹配有较大的容限。
在一种工艺中,托架材料可选择为使其热胀系数在集成电路的硅和电路基板的有机环氧树酯玻璃纤维材料的热胀系数之间。这种类型的托架之一是陶瓷托架,这种托架在专业人员中是人所共知的。
在造成或者使芯片和电路板材料之间的热不匹配的后果减至最小的其他的因素是芯片托架本身和电路板比较相对地小,因而,当和把相对小的集成电路芯片直接安装到相对大的电路板上那种情况相比,芯片的热不匹配效果就大大地减小了。因此,一种用于把芯片装在托架上而托架装在电路板上的技术已被开发了出来,在这种技术中,芯片托架和电路板两者用的是同一种材料,在许多例子中,这种材料是FR4环氧树脂玻璃纤维材料。借助于把同一材料用于芯片托架和电路板双方,从实质上说,可把同一工艺用于形成芯片托架和电路板材料双方,并以此来减少提供最终产品所必须的工艺数目。
用于把环氧树脂玻璃纤维FR4材料形成为芯片托架的技术,除了其他技术之外,包括把若干层FR4或者有机电路板迭层在一起以形成芯片托架的技术,还包括光刻技术。在光刻技术中,光刻胶(无论是正胶还是负胶)或者被用于使材料图形化或者去掉或增添电路。在用于制造SCML和MCML芯片托架的工艺中。这两种工艺,由于它们的构造上的原因,都可对生产工艺具有某些不利的影响。这种影响是当把最终制得的芯片托架用于对于它的预计用途所不能符合要求的程度时将会导致形成重大问题。因此,希望消除FR4电路板工艺中的这些问题。
此外,某些这类问题不仅在FR4板工艺中会碰到。在其他类型的工艺中,诸如在用于形成芯片托架的陶瓷中也会碰到。因为在那里光刻胶工艺被利用来形成芯片托架。因此,人们希望消除在这些其他形式的托架工艺中光刻胶工艺所带来的问题。
我们对本发明作一概括。
本发明提供一种方法,它把至少两层基板叠在一起并在迭叠基板的至少一个表面上形成电路。这一方法包括把压力加在上述两个基板的彼此相反的面上的处理。从上述基板的至少一块基板的电路接受面上延伸出一个窗口。提供一个插件,它被构成为可移动地插入上述窗口并在其上边有一个支撑面。当上述插件被定位于上述窗口之内的时候,该支撑面与电路接受平面基本上是同一平面。把插件插入上述窗口中,使支撑面与电路接受面基本上处于同一平面。用在基板的相对的表面上加压的办法使各基板叠在一起。至少上述电路接受面和支撑面的一部分用干膜光刻胶薄层覆盖起来,用上述插件的一部分在一个窗口的区域内支撑光刻胶层。把干膜光刻胶薄层图形化并进行显影以在电路接受面上形成事先规定的图形,接着该表面就被电路化。之后,剥除任何残留的光刻胶并把插入部件移走。
下边对附图进行说明
图1是一个透视画法的分解图,多少带点图示的味道儿。它示出了单芯片组件迭层构造各个层以及准备插入和已准备好了的进行叠层的部件。
图2是图1的部件的长轴方向剖视图,在该图中部件已被装配到供叠层的位置上。
图3是已迭层产品的长轴方向剖视图。
图4是与具有迭层构造的图3相同的长轴方向的剖视图,但图4所示构造已装上了准备进行光刻的光刻胶。
图5是一个与图4相同的视图。该图中光刻胶已被曝光和显影。
图6是一个与图5相同的视图。它示出了已电路化了的产品。
图7是一个与图6相同的视图。它示出了已拿掉了插头的已电路化了的产品。
图8是一个与图7相同的视图,该图上已连接上了一个集成电路芯片。
在详细说明工艺之前,大家已经看到本发明所推荐的形态构成了一种用于用以FR4有机电路板工艺而知名的环氧树酯玻璃纤维工艺形成单芯片组件迭层板(SCML)的工艺。本发明的某些方面特别可用于这样一些类型的工艺:在这些工艺中,叠层化的进行归因于材料的粘滞性渍流。这些材料是诸如用环氧树酯浸泡过的玻璃纤维薄片(半固化片)。这种半固化片用于把各种层压板粘合在一起,而层压板用在SCML和多芯片组件叠层板(MCML)中。但是,本发明的另外一些方面,诸如在光刻操作期间用一个插入部件支撑光刻胶的技术,一般说来可以应用于许多不同种类的技术和若干种用于形成芯片托架的材料,诸如陶瓷。
我们来看附图。对于画出了用于形成一个SCML芯片托架的各个组成部分的图1来说,该图多少带有图示性的味道,而且是一种分解式的构造。这些组成部分皆已准备就绪进行装配以形成本发明的结构。本发明中的SCML是由3个电路板切片10、12和14组成的。这三个切片用本发明的工艺叠层在一起以形成一个下边将要说明的多叠层芯片托架。每一切片10、12和14本身在功效上都是一个小型的或小的电路板。就是说,切片10、12和14中的每一个都是多层的有机电路板,该电路板由其中夹有电路的多层浸过环氧树酯的玻璃纤维布形成并被叠层以形成小型的“电路板”。因此,每一切片都是一个固化了的环氧树酯玻璃纤维FR4“电路板”构造。但具有芯片托架的尺寸并用现有的FR4工艺形成。典型地说来,每一切片10、12和14就如在下边将要说明的那样由在其内部有合适的电路的多达七层或七层以上的有机FR4材料组成。上述适当的电路用于在被安装到托架上的芯片和用于连接电路板的焊盘之间形成必需的电连。典型地说,每一个这种切片大约0.025英寸厚,尽管底层切片14在某些情况下厚一点,比如说0.030英寸厚。在切片10上有一个芯片接受窗口20,切片12上有一个芯片接受窗口22,在切片14上有芯片接受窗口24,其目的将在下边叙述。一般地说,窗口20约为1英寸平方,窗口22小了0.05英寸,而窗口24又比窗口22小0.05英寸。但是,这些窗口的大小取决于将要连接的芯片的大小,而且将取决于究竟要把物理尺寸多大的芯片连接上去而变化。
就如以上所指出的那样,切片10、12和14具有内部电路(没有画出来)。这些电路可以用下边将要说明的通孔(Via)或镀金过渡孔(plated-through hole)进行互连。大家知道,切片10、12和14是简单的示意图。典型地说,这些切片上具有比下边将要说明的情况要多得多的过渡孔和更密的电路,图1所画的,只不过是构成情况的解说图。
切片14的表面上有电路图36,图中包括芯片安装焊盘38,它在图形上被安排为在窗口的周围以便用丝焊法把芯片连接好。这一独特的配置被设计为安装一个I/C芯片,就如下边将要说明的那样。
由于切片10、12和14是完全固化了的玻璃浸透环氧树酯有机电路板,所以把这些板叠层在一起的热吹用的工艺是利用浸过环氧树酯的玻璃纤维片40,42。把这些玻璃纤维片浸泡于选定的环氧树酯中并使之部分地固化以形成一种固态材料薄板,这种材料的固化方法,人们称之为“B”固化,归因于使沉浸于玻璃纤维布中的环氧酯部分地聚合。在这种形式下,片40,42常常被称作“半固化片”。B固化了的半固化片厚约2—3个密耳。在加热加压下,这种状态的环氧树酯将会涨溢,而这种加热加压最终将形成一种完全固化了的环氧树酯。这些半固化的片40,42通常被用于在已完全固化了的充满环氧树酯的玻璃纤维基板之间进行叠层的工序。这些半固化片将把基板的各种各样的层结合起来以形成一个完全固化的电路板,这些技术在技术上是人们所熟知的。这种技术在技术上是众所周知的。
片中之一的40被插入到电路板10和12之间而片中的另一片的42则被插入到切片12和14之间。片40有一个中央窗口44,该窗口比切片10上的窗口20稍大(例如,约大10—15密耳)。片42有一个中央窗口46,该窗口比窗口22稍大(例如,约大10—15密耳)。这样做的目的将在下边说明。人们将会看到,当切片10,12和14以及片40和42彼此相互叠加起来的时候窗口20,22和24以及窗口44和46在一条直线上。
为了形成迭层构造,切片10,12和14以及片40和42,就像图2所示的构造那样,被排成一条直线而且彼此叠加起来。就如在图2A中看得非常清楚的那样。在窗口44周围的玻璃片40的边沿稍大于切片10上的窗口20。这将允许在切片10的窗口20的周围溢出少量的环氧树酯,这样作的目的将在下边解释。而环绕玻璃片42中的窗口46的边沿则被放在放在远离切片12的窗口22的地方。就如即将说明的那样,这是为了防止材料从玻璃片42溢出并完全盖住切片14上面的丝焊焊盘38。在典型的形态下,窗口22比窗口24要足够的宽以允许丝焊焊盘38从窗口22的边沿伸出约50—60密耳,片42的窗口46的边沿被放置为离切片12的窗口22的每一边约10—15密耳。
典型地说,多片切片10,12和14的迭层化是把切片10,12和14以及片40和42如图2所示那样在挤压机中堆积成一条直线来完成的。还给出了一个插头或插入部件56,它有一个帽58和一个芯柱60。插入部件56理想的情况是用与切片10,12和14同样的材料即用FR4在完全固化的条件下形成。
插入部件56的成形如下所述。帽58的大小被构成为比切片10中的窗口20的尺寸稍小一点以便于将帽58嵌入窗口20,而帽58的底面62如图2和2A所示,靠停在环绕窗口22的切片12的暴露面上。帽58的厚度基本上与切片10的厚度加上B固化半固化片40的厚度之和相同,以使得当帽58停在切片12的上表面上时,如图2所示,切片10的上表面与帽58的上表面基本上是平齐的或者稍微低一点(例如:低一英寸的万分之几)。芯柱60从帽伸出来的长度基本上等于切片12的厚度加上切片14的厚度再加上一半固化片42的厚度,以使得底面64基本上与切片14的底面平齐或者稍许高出一点(例如:高出万分之几英寸)。而且,芯片60的大小比切片14中的窗口24的尺稍小一点。
在这种构成中,切片10,12和14以及玻璃片40与42在叠层挤压机中堆积起来,同时,插件56如图2所示那样插了进来。应用常用的热压迭层技术把切片10,12和14叠加到一起。叠层压板示于图2并标上了参考字符“p”。在迭层化期间所用的特定温度和压力在技术上是人所共知的。
在迭层工艺期间,有某些量的环氧树酯溢出,这些环氧树酯浸沉到玻璃片40和42中去。溢出的量取决于各种因素,诸如所用的压力和温度以及用于浸泡半固化片板40和42的环氧树酯的量和环氧树酯的其他的性质,此外还有玻璃转变温度(Tg)。一种典型的环氧树酯的Tg约为134℃,另一种为约170℃。不论怎样,都将存在着某些溢出,其量取决于叠层中所用的温度和压力等各种因素。
在叠层工艺期间,玻璃片42上的环氧树酯将会溢出,但是,就如以前说过的那样,窗口46的边沿被放置为距切片12上的窗口22的边沿约10—15密耳。由于下述理由,这种配置是重要的。把窗口46环绕在其内的片42的边沿必须距窗口22足够近以致在树酯流动时,不留下任何值得注意的无故的区域或者未形成边界的区域,因为无效区或无边界区域在今后的加工工序中是不利的,在那些工序中,化学药品将会进去引起短路和其他不利影响。另一方面,片42的窗口46的边沿又不能离把窗口22围起来的切片12的边沿太近以致树酯会流出来并基本上盖住切片14上表面上的丝焊焊盘38。这些丝焊焊盘伸出了切片12的边沿22之外约50—60密耳并曝露出来。借助于把窗口46围在其中的片42的边沿放置在距窗口22的边沿的距离为10—15密耳的作法,借助于选择所希望的环氧树酯和环氧树酯浸于玻璃纤维布中的量并借助于形成迭层的温度和压力,将有这样的一种树酯溢出:片42上的环氧树酯将伸出到丝焊焊盘38以外1—2密耳的距离。为了确保在切片12和14之间没有失效或失效空间,必须有某些环氧树酯至少向外溢流到丝焊焊盘38上,但是,这个溢流不能那么多以致把丝焊焊盘盖起来,有碍于把芯片丝焊到它上边去。
玻璃片40中的窗口44的边沿被放置为距切片10中的窗口20的边沿约10—15密耳。但是,那儿将会有某些少量的浸入到片40中的环氧树酯溢流从切片10的下边流出来。这种环氧树酯的溢流将绕着插件56的帽58流动。就像上边说过的那样,对其量的要求是很苛的:要有足够的溢流以防止失效,但又不能太多以把插件56完全地和紧紧地粘结起来,但又要足以形成一个宽松的粘结。因此,在固化和冷却期间,这一溢流树酯将和帽58形成一个粘结以把插件56保持在下边将要说明的位置上。这一溢流并不需要大量材料,因而在插件56和切片10以及12之间不会形成非常强的粘结,但是,这种粘结又是足够地强使得在后续工艺处理中能保持插入位置,在接下来的工序中,它还可以相对容易地取出而又不会危及切片10,12和14。
通过了解插件的某些功能,人们就会很好地了解到其高度的苛刻性了。插件56的功能之一是在切片12和切片14之间的下述区域提供压力;在该区域里切片12与切片14相接触而且切片12从切片10中的窗口20伸展出来。通过对帽58的厚度进行控制,使得帽58的上表面与切片10的上表面平齐或者很接近于平齐,而使芯柱60的底面与切片14的底面平剂或者接近于平齐。如图2所示,在迭层期间,当加上压力的时候,帽58将对切片12从切片10的窗口20伸出来的部分施加压力,因而将形成一个在迭层工艺期间加到切片12整个表面上的均匀的压力。此外,和切片14的底面平齐的芯柱60保证在整个插件56的帽58上压力保持均匀。如果芯柱60不到位,在帽58上面的加压平台的作用将增加环绕窗口22的边沿的压力,因此有可能挤碎丝焊焊盘38或者放在下边的电路36。通过给出一个芯柱60,将产生一个遍及整个切片10,12和14以及片40和42的迭层的均匀的压力。
在完成了加热加压的叠层循环之后,把已叠好了的切片10,12和14从迭层挤压机中取出来。进行过叠层之后,切片10,12和14与片40,42一起形成了一个整体构造。但是,在图3—5中,各个组成部分却是分开画的。如图3所示,就如上边说过的那样,由于在插件56的帽58的周围的从半固化片40溢出的环氧树酯的粘附性质,插件56将留在里边。因此,插件56在叠层工艺中将一直被用作它的一个用途,即在叠层工艺期间等化加在正在进行叠层处理的各个切片10,12和14上的压力的用途。
在工艺中的这一时刻,如图3所示,钻好了通孔或者过渡孔65,并在已经叠层完毕的切片10,12和14上形成了电路。(大家知道,通常上边有许多通孔或过渡孔,但为了使画面简洁仅仅画出了两个)。采用本发明的电路化工艺是一种利用干膜光刻胶工艺的附加镀膜工艺。即用光刻胶材料薄片。和把液态光刻胶喷上去或均匀地涂上去相反,这种薄片是干的固态的形式。镀膜可以用电解或非电解镀膜法。
现在来看图4。图4示出了一种用于使已叠层化的切片10,12和14电路化的工艺,在该工艺中利用附加镀膜工艺和负光刻胶。就如图4所示那样,已被粘结成一个整体的电路板基板的叠层切片10,12和14首先被安排在众所周知的方式下进行非电解镀膜,之后把两个干光刻胶薄片66和68加到其相对的两侧。在一个实施形态中用的是杜邦光刻胶3120,在另一实施形态中用的是杜邦光刻胶T168。这两种光刻胶都是负胶,就是说这样的胶将被显影并在显影之后把未被光化辐射曝光的部分洗掉。
当应用干胶工艺时所碰到的困难之一是光刻胶必须用拱状或帐篷状来覆盖基板构造上的所有的窗口并在后续的光刻胶曝光和显影工艺和使基板电路化期间保持这样的条件。虽然光刻胶可以横跨相对说小的窗口,诸如过渡孔65并在整个工艺过程中保持完整,但对于分别在切片10和14中的窗口20和24那么大小的窗口情况却并不如此。如果一种光刻胶要横跨这些窗口,这些窗口如上面所指出的那样,其宽度可以达到一英寸以上,则在后续的加工工序(曝光工序,显影工序和电路化工序)中在大部分情况下将失掉它的完整性,并允许在这些工艺或者后续工艺中所用的化学药品进入窗口20,22和24,这样会损坏丝焊焊盘38或者使其变性。
在后续工艺中,插件56对光刻胶膜66和68起着支撑物的作用,使得在后续的曝光,显影和电路化期间光刻胶帐篷式的盖住窗口20和24,因而把由窗口20,22和24限定的迭层切片10,12和14的内部密封了起来。这将保护丝焊焊盘38使之在后续工艺期间避免曝露于不同的化学药品之中。于是,尽管插件56原先用于分配叠层力的目的,但如今却用于在后续操作中支撑光刻胶的目的。
如图5所示,应用常用的光刻技术对光刻胶薄片66和68进行曝光和显影以露出将在那儿施行金属化的下边的区域。采用通常的金属化方法,对已曝光的区域金属化以在切片10的上表面上制作电路69。金属化也淀积到过渡孔65中,接着这些过滤孔由于其里边的金属70而变成镀金(属膜)过渡孔。其次,把光刻胶除掉以提供一个示于图6的产品。在此时,如图7所示,可以拿走插入物或插件56。这一单托架组件迭层构造于是就如图8所示已准备好去接受铜制薄片71形成的接地面和一个集成电路芯片72。芯片72由胶粘剂73在其一面上粘结到接地面71上。接地面有专用窗口(没有画出来)以防与镀金过渡孔65和切片14上的任何部件接触。胶粘剂73也起着把接地面71粘到切片14的表面上的作用,而该接地面71也起着热沉的作用。芯片72用细金属丝74压焊到焊盘38上,因而完成了芯片托架结构。
可以应用别的镀膜和/或光刻技术。例如,可以用正光刻胶代替负光刻胶。
大家还可看到,在刚才说明过的推荐形态中,本发明是和应用注满环氧树酯的玻璃纤维布构成的叠层构造接合起来讲述的。但是,本发明可以采用其他的叠层工艺。凡是在叠层构造中采用压力的地方,都可以把插入物插件56用于在叠层工艺期间分配压力。但是,如果应用的是别的叠层工艺,诸如使用不依赖压力的陶瓷托架,然而如果在电路化中用了光刻胶技术,则仍可以有效地应用插入物或者插件56。在这种情况下,就像前边说过的那样,插件支撑干膜光刻胶。插件56既可用在这一方面,在把聚酰亚胺技术用于形成这些叠层时,如果需要,也可以在某些叠层工序中应用。
如上所述,本发明在形成芯片托架中,无论是SCML或MCML,都特别有用。然而,在一个广泛的意义上讲,同一技术一般地说可用于把芯片附着到已电路化的板上。
至此,本发明的实施形态就讲述完了。但是依据留在脑子中的以前的叙述,我们知道这种叙述仅仅是为了当作一个例子,知道本发明不受限于这儿所讲的特定形态,还知道,就如下述权利要求中所阐明的那样,可以进行各种的重新排列、修改和替换而不脱离本发明的范围。
Claims (19)
1.一种使其上边至少有一个从其电路接受表面延伸出来的窗口的基板电路化的方法,这种方法具有下述工序:
提供一个其形状被作成为可放入上述窗口之内而且在其上边有一支撑表面的插入部件,
把上述插入部件牢靠地安放到上述窗口之内,使其上述支撑面基本上与上述基板的上述电路接受表面为同一平面,
至少把上述电路接受表面和上述支撑表面的一部分用干膜光刻胶薄片覆盖起来,以在上述一个窗口的范围内将上述一个窗口及支撑上述光刻胶薄片的插入部件密封起来,
用光刻技术对上述干膜光刻胶材料进行曝光和显影以形成规定的图形,
应用带有电路图的表面形成上述电路,
最后,剥去任何残留的光刻胶。
2.权利要求1所述的方法,其特征是:上述窗口包括一种阶梯式形状的结构,在这种结构的上述台阶上有电路。
3.权利要求1所述的方法,其特征是:上述一个窗口穿过上述基板延伸到相对的表面,上述相对的表面用第2个干光刻胶薄片覆盖起来。
4.权利要求2所述的方法,其特征是:在上述台阶上的上述电路包括丝焊焊盘,在剥除了残留的光刻胶之后,把一个集成电路芯片丝焊到那里的上述丝焊焊盘上。
5.一种把至少两块基板叠层到一起的方法。在这种方法中,压力被加到上述两块基板的各自的相对的表面上,而且在这种方法中,有从上述基板的至少一块基板的上述表面上延伸出来的窗口。这种方法具有下述工序,
提供一个插入件,其构造为可移动地插入上述窗中去,并在其上边有支撑表面,当上述插件被定位于上述窗中的时候,该支撑面基本上与上述一个表面在同一平面上,
把上述插件插入到上述窗口中,使上述支撑面基本上与上述一块基板的表面是同一平面,
用在上述基板的上述相对的表面上加压的办法使上述基板叠层化,
在上述基板粘结好之后,拿掉上述插入部件。
6.如权利要求5中所定义的方法,其特征是:窗口包括台阶式构造。
且上述插件被支撑在上述台阶上。
7.如权利要求5所定义的发明,其特征是:上述窗口穿过上述每一块基板,上述插件包括一个第2支撑面,该面基本上与另一上述基板的表面为同一平面。
8.如权利要求7所定义的方法,其特征是:上述窗口有台阶式构造,而上述插件具有支撑于上述台阶上的头部部分。
9.如权利要求5所定义的方法,其特征是:这些基板是部分地固化了的浸过环氧树酯的玻璃纤维。
10.如权利要求9所定义的方法,其特征是:已填充环氧树酯的玻璃纤维薄片被插入到各个上述相邻基板之间,而上述叠层工艺包括加热。
11.一种把至少两块基板叠层在一起并至少在叠层板的一个表面上形成电路的方法,在该方法中,在上述两块基板的各自的相对的表面上加有压力,而且从至少上述基板之一的电路接受面上伸展出一个窗口,这种方法包括下述工序:
提供一个插件,该插件被构成为可移动地插入上述窗口而且在插件上有一个支撑面,该支撑面在上述插件被定位于上述窗口中的时候,基本上与上述电路接受面为同一平面,
把上述插件插入到窗口中去,使上述支撑面与上述一个基板的上述电路接受表面基本上为同一平面,
在上述基板的上述相对的表面上加压使上述基板形成叠层,并用一片干膜光刻胶薄片把上述电路接受表面和上述支撑表面的至少一部分覆盖起来以在上述一个窗口的范围内将上述窗口及支撑上述光刻胶薄片的插入部件,
用光刻技术对上述干膜光刻胶材料进行曝光和显影以形成规定的图形,
在上述有电路图的电路接受面上形成电路,
然后,剥去任何残留的光刻胶并拿走上述插入部件。
12.一种把至少两块基板叠层在一起的方法,在这种方法中,在上述两块基板的各自的相对的表面上加压,而且上述基板的每一块都有一个窗口,上述窗口之一大于另一个上述窗口,这样,当使上述窗口排成一条直线的时候,就形成了在上述基板之一的上边有一台阶的台阶式构造,这种方法包括下述工序:
提供一个在其上边有一个窗口的叠层材料的薄片,该窗口至少要与上述各基板中上述窗口的较小的窗口大小相等,
把上述叠层薄片放在上述基板之间并使上述基板上的窗口与上述叠层薄片的窗口两者排成一条直线,把上述基板叠好,
在上述基板的上述相对的表面上加热加压使上述基板进行叠层,
上述压力与上述温度应足以使上述叠层薄片材料至少部分地流溢到,但不是完全地流溢到上述台阶上。
13.权利要求12所述的方法,其特征是:上述基板是固化了的环氧树酯,而上述叠层薄片是环氧树酯浸泡过的玻璃。
14.权利要求12所述的方法,其特征是:在上述台阶上有电路图。
15.一种叠层构造,它由有机材料形成的第1和第2块基板组成,
上述基板上各自有第1和第2穿通窗口,两块基板形成为使窗口排成一条线的构造,上述第2窗口小于上述第1窗口,因此在上述第2块基板上将形成被第1块基板上的窗口包围起来的台阶,
把在上述台阶上的丝焊焊盘连接到上述第1块基板上的电路上并布局为对一个集成电路芯片提供互连。
16.权利要求15所述的装置,其特征是:上述基板是用浸过环氧树酯的玻璃纤维形成。
17.权利要求16所述的装置,其特征是:上述两块基板是用浸过环氧树酯的玻璃纤维的薄片粘结在一起的。
18.权利要求15所述的装置的进一步的特征是被限定于上述接受窗口中的一个集成电路芯片并把上述集成电路芯片与上述丝焊焊盘用丝焊连接。
19.权利要求15所述的装置,其再进一步的特征是:一个被粘结到上述第1块基板上的第3基板,该基板上有一窗口,该窗口比上述第1基板上的窗口大并和第1基板上的窗口排列成一条直线以在上述第1块基板上形成第2个台阶。
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US359,491 | 1994-12-20 | ||
US08/359,491 US5542175A (en) | 1994-12-20 | 1994-12-20 | Method of laminating and circuitizing substrates having openings therein |
US359491 | 1994-12-20 |
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CNB991215664A Division CN1181714C (zh) | 1994-12-20 | 1995-12-05 | 用带开口的基板制造多层电路板的方法 |
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CN1053551C CN1053551C (zh) | 2000-06-14 |
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CN95120551A Expired - Fee Related CN1053551C (zh) | 1994-12-20 | 1995-12-05 | 多层电路板 |
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CN1181714C (zh) | 2004-12-22 |
CN1262596A (zh) | 2000-08-09 |
US5578796A (en) | 1996-11-26 |
US5542175A (en) | 1996-08-06 |
CN1053551C (zh) | 2000-06-14 |
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