CN113195698A - 用于化学机械研磨后(post-cmp)钴衬底的清洗的组合物和方法 - Google Patents
用于化学机械研磨后(post-cmp)钴衬底的清洗的组合物和方法 Download PDFInfo
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- CN113195698A CN113195698A CN201980083648.0A CN201980083648A CN113195698A CN 113195698 A CN113195698 A CN 113195698A CN 201980083648 A CN201980083648 A CN 201980083648A CN 113195698 A CN113195698 A CN 113195698A
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- acid
- cleaning composition
- ether
- hydroxide
- cleaning
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- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
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- OKHHGHGGPDJQHR-YMOPUZKJSA-L calcium;(2s,3s,4s,5s,6r)-6-[(2r,3s,4r,5s,6r)-2-carboxy-6-[(2r,3s,4r,5s,6r)-2-carboxylato-4,5,6-trihydroxyoxan-3-yl]oxy-4,5-dihydroxyoxan-3-yl]oxy-3,4,5-trihydroxyoxane-2-carboxylate Chemical compound [Ca+2].O[C@@H]1[C@H](O)[C@H](O)O[C@@H](C([O-])=O)[C@H]1O[C@H]1[C@@H](O)[C@@H](O)[C@H](O[C@H]2[C@H]([C@@H](O)[C@H](O)[C@H](O2)C([O-])=O)O)[C@H](C(O)=O)O1 OKHHGHGGPDJQHR-YMOPUZKJSA-L 0.000 description 1
- 125000004181 carboxyalkyl group Chemical group 0.000 description 1
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- RZEKVGVHFLEQIL-UHFFFAOYSA-N celecoxib Chemical compound C1=CC(C)=CC=C1C1=CC(C(F)(F)F)=NN1C1=CC=C(S(N)(=O)=O)C=C1 RZEKVGVHFLEQIL-UHFFFAOYSA-N 0.000 description 1
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- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 1
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- 239000013626 chemical specie Substances 0.000 description 1
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- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 1
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- LCUOIYYHNRBAFS-UHFFFAOYSA-N copper;sulfanylideneindium Chemical compound [Cu].[In]=S LCUOIYYHNRBAFS-UHFFFAOYSA-N 0.000 description 1
- LOGSONSNCYTHPS-UHFFFAOYSA-N cyclopentane-1,3-dione Chemical compound O=C1CCC(=O)C1 LOGSONSNCYTHPS-UHFFFAOYSA-N 0.000 description 1
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- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 1
- JVQOASIPRRGMOS-UHFFFAOYSA-M dodecyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCC[N+](C)(C)C JVQOASIPRRGMOS-UHFFFAOYSA-M 0.000 description 1
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- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WJLUBOLDZCQZEV-UHFFFAOYSA-M hexadecyl(trimethyl)azanium;hydroxide Chemical compound [OH-].CCCCCCCCCCCCCCCC[N+](C)(C)C WJLUBOLDZCQZEV-UHFFFAOYSA-M 0.000 description 1
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- 239000011147 inorganic material Substances 0.000 description 1
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- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
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- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
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- 238000001465 metallisation Methods 0.000 description 1
- RSMUVYRMZCOLBH-UHFFFAOYSA-N metsulfuron methyl Chemical compound COC(=O)C1=CC=CC=C1S(=O)(=O)NC(=O)NC1=NC(C)=NC(OC)=N1 RSMUVYRMZCOLBH-UHFFFAOYSA-N 0.000 description 1
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- 239000000178 monomer Substances 0.000 description 1
- PAZXUKOJTOTKBK-UHFFFAOYSA-N n,n-dibutylhydroxylamine Chemical compound CCCCN(O)CCCC PAZXUKOJTOTKBK-UHFFFAOYSA-N 0.000 description 1
- VMESOKCXSYNAKD-UHFFFAOYSA-N n,n-dimethylhydroxylamine Chemical compound CN(C)O VMESOKCXSYNAKD-UHFFFAOYSA-N 0.000 description 1
- ZKXYINRKIDSREX-UHFFFAOYSA-N n,n-dipropylhydroxylamine Chemical compound CCCN(O)CCC ZKXYINRKIDSREX-UHFFFAOYSA-N 0.000 description 1
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- DXBRUVBTKJOAGO-UHFFFAOYSA-N n-butyl-n-ethylhydroxylamine Chemical compound CCCCN(O)CC DXBRUVBTKJOAGO-UHFFFAOYSA-N 0.000 description 1
- YHSRJRGROTVVRH-UHFFFAOYSA-N n-butyl-n-methylhydroxylamine Chemical compound CCCCN(C)O YHSRJRGROTVVRH-UHFFFAOYSA-N 0.000 description 1
- JXZCPFYRABEECK-UHFFFAOYSA-N n-butyl-n-propylhydroxylamine Chemical compound CCCCN(O)CCC JXZCPFYRABEECK-UHFFFAOYSA-N 0.000 description 1
- RRUADNNEIGVWSQ-UHFFFAOYSA-N n-ethyl-n-methylhydroxylamine Chemical compound CCN(C)O RRUADNNEIGVWSQ-UHFFFAOYSA-N 0.000 description 1
- KNPVJTATSXDLPW-UHFFFAOYSA-N n-ethyl-n-propylhydroxylamine Chemical compound CCCN(O)CC KNPVJTATSXDLPW-UHFFFAOYSA-N 0.000 description 1
- CPSHTTIOTFLGFS-UHFFFAOYSA-N n-methyl-n-propylhydroxylamine Chemical compound CCCN(C)O CPSHTTIOTFLGFS-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002811 oleoyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
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- 238000000206 photolithography Methods 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000083 poly(allylamine) Polymers 0.000 description 1
- 229920000333 poly(propyleneimine) Polymers 0.000 description 1
- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 108010054442 polyalanine Proteins 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 108010094020 polyglycine Proteins 0.000 description 1
- 229920000232 polyglycine polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229960003975 potassium Drugs 0.000 description 1
- ONQDVAFWWYYXHM-UHFFFAOYSA-M potassium lauryl sulfate Chemical compound [K+].CCCCCCCCCCCCOS([O-])(=O)=O ONQDVAFWWYYXHM-UHFFFAOYSA-M 0.000 description 1
- 229940116985 potassium lauryl sulfate Drugs 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- FVEFRICMTUKAML-UHFFFAOYSA-M sodium tetradecyl sulfate Chemical compound [Na+].CCCCC(CC)CCC(CC(C)C)OS([O-])(=O)=O FVEFRICMTUKAML-UHFFFAOYSA-M 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- UUCCCPNEFXQJEL-UHFFFAOYSA-L strontium dihydroxide Chemical compound [OH-].[OH-].[Sr+2] UUCCCPNEFXQJEL-UHFFFAOYSA-L 0.000 description 1
- 229910001866 strontium hydroxide Inorganic materials 0.000 description 1
- 150000005846 sugar alcohols Chemical class 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000011885 synergistic combination Substances 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- LJRHSDGQWGPCCR-UHFFFAOYSA-N thiolutin Natural products S1SC=C2NC(=O)C(NC(=O)C)C21 LJRHSDGQWGPCCR-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- ZTWTYVWXUKTLCP-UHFFFAOYSA-N vinylphosphonic acid Chemical compound OP(O)(=O)C=C ZTWTYVWXUKTLCP-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 239000002888 zwitterionic surfactant Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3218—Alkanolamines or alkanolimines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0042—Reducing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0047—Other compounding ingredients characterised by their effect pH regulated compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/0005—Other compounding ingredients characterised by their effect
- C11D3/0073—Anticorrosion compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/044—Hydroxides or bases
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/34—Organic compounds containing sulfur
- C11D3/3445—Organic compounds containing sulfur containing sulfino groups, e.g. dimethyl sulfoxide
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/36—Organic compounds containing phosphorus
- C11D3/361—Phosphonates, phosphinates or phosphonites
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/02—Inorganic compounds
- C11D7/04—Water-soluble compounds
- C11D7/06—Hydroxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/265—Carboxylic acids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract
本发明公开一种用于从上面有残留物和/或污染物的微电子装置清洗所述残留物和/或污染物的清洗组合物。所述组合物包含至少一种络合剂、至少一种清洗添加剂、至少一种pH调节剂、水和至少一种氧胺化合物。有利地,所述组合物展示含钴衬底的有效清洗和经改良的钴相容性。
Description
技术领域
本发明大体上涉及用于从上面有残留物和/或污染物的微电子装置清洗所述残留物和/或污染物的清洗组合物,其中所述组合物具有经改良的钴相容性。
背景技术
微电子装置晶片用于形成集成电路且包括例如硅的衬底,在衬底中区域经图案化用以沉积具有绝缘、导电或半导电特性的不同材料。
为获得恰当的图案化,必须去除用于在衬底上形成层的过量材料。此外,为制造功能性且可靠的电路,在后续加工之前制备平整或平坦的微电子晶片表面很重要。因此,必需去除和/或研磨微电子装置晶片的某些表面。
化学机械研磨或平坦化(“CMP”)为一种从微电子装置晶片的表面去除材料,且通过联合物理方法(例如磨耗)与化学方法(例如氧化或螯合)研磨(更特定地说,平坦化)所述表面的方法。基本上,CMP涉及将浆料(例如在水溶液中含有活性化学物质的研磨剂的组合)施加到研磨垫,所述研磨垫对微电子装置晶片的表面进行抛光以实现去除、平坦化和研磨过程。物理与化学操作的协同组合实现快速、均匀去除。在集成电路的制造中,CMP浆料还应能够优先去除包含金属和其它材料的络合层的膜,从而可产生用于后续光刻、或图案化、蚀刻和薄膜处理的高度平坦的表面。在研磨之后获得在整个晶片表面中的良好均匀性的一个关键为使用针对所存在材料中的每一者具有恰当去除选择性的CMP浆料。
大多数处理操作(包括晶片衬底表面制备、沉积、电镀、蚀刻和化学机械研磨)需要清洗操作以确保微电子装置产品没有将另外以有害方式影响产品的功能或甚至致使微电子装置产物不可用于其预期功能的污染物。通常,这些污染物的粒子小于0.3μm。这些残留物如果不去除,则可能对例如铜线造成损害或使铜金属化严重粗糙,以及造成装置衬底上的CMP后所施加的层粘着性不佳。
在本行业中持续需要提供从衬底有效地和选择性地去除各种残留物(例如CMP后残留物、刻蚀后残留物和灰化后残留物)的组合物和方法,特别是随着对经改良的装置性能和减小的装置尺寸和减小的装置特征尺寸的需求增加。组合物和方法应消除粒子和其它污染物,且不腐蚀或以其它方式损害例如钴的组分。
发明内容
本发明大体上涉及用于从上面有残留物和/或污染物的微电子装置清洗所述残留物和/或污染物的组合物和方法。所述残留物可包括CMP后、蚀刻后和/或灰化后残留物。有利地,本文中所描述的组合物相对于所属领域中先前所描述的组合物展示经改良的钴相容性。
在一个方面中,描述一种清洗组合物,所述组合物包含至少一种络合剂、至少一种清洗添加剂、至少一种pH调节剂、水和至少一种氧胺化合物或其盐。在一些实施例中,所述组合物进一步包含至少一种蚀刻剂、至少一种腐蚀抑制剂和/或至少一种还原剂。优选地,所述清洗组合物大体上不含含氟化物源、研磨材料和氢氧化四甲铵。
在另一方面中,描述从上面有残留物和污染物的微电子装置去除所述残留物和污染物的方法,所述方法包含使微电子装置与清洗组合物接触足以至少部分地从微电子装置清洗所述残留物和污染物的时间,其中所述清洗组合物包含至少一种络合剂、至少一种清洗添加剂、水、至少一种pH调节剂和至少一种氧胺化合物或其盐。在一些实施例中,所述组合物进一步包含至少一种蚀刻剂、至少一种腐蚀抑制剂和/或至少一种还原剂。优选地,所述清洗组合物大体上不含含氟化物源、研磨材料和氢氧化四甲铵。
其它方面、特征和优势将从随后公开内容和随附权利要求书更充分地显而易见。已发现相对于现有技术中的组合物,此类组合物可实现经改良的钴相容性。此类相容性例如在现代微电子装置工艺中的CMP后清洗中具有相当大的益处。
具体实施方式
本发明大体上涉及适用于从上面有残留物和污染物的微电子装置去除此类材料的组合物。所述组合物尤其适用于在不损害本体钴的情况下从含钴衬底去除CMP后、蚀刻后或灰化后残留物。
为易于参考,“微电子装置”对应于半导体衬底、平板显示器、相变存储器装置、太阳电池板和其它包括太阳能衬底、光伏和微机电系统(MEMS)的产品,经制造用于微电子应用、集成电路应用或计算机芯片应用。太阳能衬底包括但不限于硅、非晶硅、多晶硅、单晶硅、CdTe、硒化铜铟、硫化铜铟和镓上砷化镓(gallium arsenide on gallium)。太阳能衬底可经掺杂或未经掺杂。应理解,术语“微电子装置”并不打算以任何方式限制且包括将最终变为微电子装置或微电子总成的任何衬底。
所述微电子装置可包含含钴材料。如本文中所使用,“含钴材料”和“钴物种”包括包含按材料的总重量计大于50wt%元素钴的任何材料。含钴材料的实例包括但不限于纯钴、氮化钴(包括包含例如Ta或Li的额外元素的氮化钴)、CoP、CoSi、CoW、氧化钴和氢氧化钴。所属领域的技术人员应理解,用于各种氧化钴和氮化钴的化学式可基于钴离子的氧化态而变化,其中钴的常见氧化态为-3、-1、+1、+2、+3、+4或+5。
如本文中所使用,“残留物”对应于在制造微电子装置期间产生的粒子,所述微电子装置包括但不限于等离子体蚀刻、灰化、化学机械研磨、湿式蚀刻和其组合。
如本文所使用,“污染物”对应于存在于CMP浆料中的化学物质、研磨浆液的反应副产物、存在于湿式蚀刻组合物中的化学物质、湿式蚀刻组合物的反应副产物,和为CMP工艺、湿式蚀刻、等离子体蚀刻或等离子体灰化工艺的副产物的任何其它材料。常见污染物包括苯并三唑,其通常存在于CMP浆料中。
如本文中所定义,“蚀刻后残留物”对应于在气相等离子体蚀刻工艺(例如,BEOL双金属镶嵌工艺或湿式蚀刻工艺)之后所剩余的材料。蚀刻后残留物本质上可为有机的、有机金属的、有机硅的或无机的,例如含硅材料、基于碳的有机材料和例如氧气和氟气的蚀刻气体残留物。
如本文中所定义,如本文中所使用的“灰化后残留物”对应于与用以去除硬化光致抗蚀剂和/或底部抗反射涂层(BARC)材料的氧化或还原等离子体灰化之后所剩余的材料。灰化后残留物本质上可为有机的、有机金属的、有机硅的或无机的。
如本文中所使用,“CMP后残留物”对应于来自研磨浆料的粒子,例如含二氧化硅粒子、存在于浆料中的化学物质、研磨浆料的反应副产物、富碳粒子、研磨垫粒子、刷下料粒子、构建粒子的装备材料、金属、金属氧化物、有机残留物、阻挡层残留物和为CMP工艺的副产物的任何其它材料。如本文中所定义,通常被研磨的“金属”包括铜、铝和钨。
如本文中所定义,“反应物或降解产物”包括但不限于由于在表面处的催化、氧化、还原、与组成组分反应或以其它方式聚合而形成的(一或多种)产物或(一或多种)副产物;由于(一或多种)变化或(一或多种)转化而形成的(一或多种)产物或(一或多种)副产物,在所述变化和转化中,物质或材料(例如分子、化合物等)与其它物质或材料组合,与其它物质或材料交换组分、分解、重排或以其它方式经化学和/或物理改变,包括前述(一或多种)反应、(一或多种)变化和/或(一或多种)转化中的任一者或前述的任何组合的(一或多种)中间产物或(一或多种)副产物。应了解,反应物或降解产物可具有比原始反应物更大或更小的摩尔质量。
如本文中所使用,“低k介电材料”对应于在分层微电子装置中用作介电材料的任何材料,其中所述材料具有小于约3.5的介电常数。优选地,低k介电材料包括低极性材料,例如含硅有机聚合物、含硅杂化有机/无机材料、有机硅酸盐玻璃(OSG)、TEOS、氟化硅酸盐玻璃(FSG)、二氧化硅和掺碳氧化物(CDO)玻璃。应了解低k介电材料可具有不同密度和不同孔隙率
如本文中所定义,术语“阻挡材料”对应于所属领域中用以密封金属线(例如,铜互连件)以使所述金属(例如,铜)向介电材料的扩散降到最低的任何材料。优选阻挡层材料包括钽、钛、钌、铪、钨、钴以及前述金属中的任一者的氮化物和硅化物。
如本文中所使用,“络合剂”包括由所属领域的技术人员理解为络合剂、螯合剂和/或钳合剂的那些化合物。络合剂将与待使用本文中所描述的组合物去除的金属原子和/或金属离子化学组合或以物理方式夹持所述金属原子和/或金属离子。
如本文中所使用,“含氟化合物”对应于以离子方式键结到另一原子的氟离子(F-)的盐或酸化合物。
“大体上不含”在本文中定义为小于2wt.%、优选小于1wt.%、更优选小于0.5wt.%且最优选小于0.1wt.%。在一个实施例中,“大体上不含”对应于零百分比,指示组合物不含特定组分。
如本文中所使用,“约”打算对应于所陈述值的±5%。
如本文中所使用,用于从上面有残留物和污染物的微电子装置清洗所述残留物和污染物的“适合性”对应于从微电子装置至少部分去除所述残留物/污染物。清洗功效由在微电子装置上的物体的减少来评定。举例来说,可使用原子力显微镜来进行清洗前分析和清洗后分析。样品上的粒子可记录为像素范围。直方图(例如,Sigma Scan Pro)可应用于以某一强度(例如,231-235)过滤像素和计数粒子的数量。粒子减少可使用以下计算:
值得注意的是,清洗功效的测定方法仅提供为实例且并不打算受限于所述实例。可替代地,清洗功效可视为由粒子物质所覆盖的全部表面的百分比。举例来说,可对AFM进行编程以执行z平面扫描以在某一高度阈值以上鉴定所关注的表面形貌区域,且随后计算由所关注的所述区域覆盖的总表面面积。所属领域的技术人员将容易理解,由清洗后所关注的所述区域覆盖的面积越小,清洗组合物越有效。优选地,使用本文中所述的组合物从微电子装置去除至少75%的残留物/污染物,更优选地去除至少90%、甚至更优选地去除至少95%且最优选地去除至少99%的残留物/污染物。
如下文更充分地描述,本文所述的组合物可以广泛多种特定调配物形式体现。
在所有此类组合物中,其中参考重量百分比范围(包括零下限)论述组合物的特定组分,应理解所述组分可存在或不存在于组合物的各种特定实施例中,且在存在此类组分的实例中,按采用此类组分的组合物的总重量计,其可以低到0.001重量百分比的浓度存在。
贯穿本说明书的具体实施方式和权利要求书,词语“包含(comprise)”和“含有(contain)”以及所述词语的变体,例如“包含(comprising/comprises)”意指“包括但不限于”且不排除其它组分、整数或步骤。然而,无论在何处使用词语“包含”,还明确包涵其中将“包含”理解为“由…组成”或“基本上由…组成”的实施例。
本文中,除非上下文另外要求,否则单数形式涵盖复数形式。具体来说,当使用不定冠词时,除非上下文另外要求,否则本说明书应理解为考虑复数以及单数。
本发明各方面的优选特征可如结合其它方面中的任一者所描述。在本申请案的范围内,明确地预期前述段落中、权利要求书中和/或在以下描述和图式中所阐述的各种方面、实施例、实例和替代例和具体来说其个别特征可独立或以任何组合采用。也就是说,除非此类特征不相容,否则可以任何方式和/或组合来组合所有实施例和/或任何实施例的特征。
在从微电子装置去除残留物材料之前,本文中所描述的清洗组合物可大体上不含或不含含氟化物源、研磨材料、氢氧化四甲铵(TMAH)和其组合。此外,清洗组合物应当不会固化形成聚合物固体,例如光致抗蚀剂。如所属领域的技术人员易于理解,尽管经考虑调配物可包括至少一种表面活性剂,但还考虑所述调配物大体上不含表面活性剂。
清洗组合物包含以下组分、由以下组分组成或基本上由以下组分组成:至少一种络合剂、至少一种清洗添加剂、至少一种pH调节剂、水和至少一种氧胺化合物或其盐。优选地,清洗组合物为包含至少50%水的水性清洗组合物。有利地,清洗组合物增加残留在微电子装置的经暴露的钴上的污染物和残留物(例如苯并三唑、浆料粒子和其它CMP后残留物)的去除且同时降低经暴露的钴的腐蚀速率。
在一个优选实施例中,本公开的清洗组合物包含以下、由以下组成或基本上由以下组成:至少一种络合剂、至少一种清洗添加剂、至少一种pH调节剂、至少一种氧胺化合物或其盐和水,其中所述清洗组合物按以下重量百分比比率调配:
不论何时组分的浓度在本文中指定时,应理解水可将组合物的余量补偿到100%。按组合物的总重量计,清洗组合物中的水的量可为至少80wt%、优选至少85wt%、且更优选至少90wt%。
本公开的清洗组合物包含至少一种络合剂(金属螯合剂、金属络合剂或金属钳合剂)。络合剂将与待使用本文中所描述的组合物去除的金属原子和/或金属离子化学组合或以物理方式夹持所述金属原子和/或金属离子。适合地,组合物可包含由多个络合剂组成的络合剂组分。说明性络合剂可包括具有通式NR1R2R3的物种,其中R1、R2和R3可彼此相同或不同且选自由以下组成的群组:氢、直链或支链C1-C6烷基(例如甲基、乙基、丙基、丁基、戊基和己基)、直链或支链C1-C6羟基烷基(例如羟基甲基、羟基乙基、羟基丙基、羟基丁基、羟基戊基和羟基己基)、和直链或支链C1-C6羟基烷基的C1-C6烷基醚,如上文所定义。最优选地,R1、R2和R3中的至少一者为直链或支链C1-C6羟基烷基。实例包括(但不限于)烷醇胺,例如氨基乙基乙醇胺、N-甲基氨基乙醇、氨基乙氧基乙醇、二甲基氨基乙氧基乙醇、二乙醇胺、N-甲基二乙醇胺、单乙醇胺(MEA)、三乙醇胺(TEA)、异丙醇胺、二异丙醇胺、氨基丙基二乙醇胺、N,N-二甲基丙醇胺、N-甲基丙醇胺、1-氨基-2-丙醇、2-氨基-1-丁醇、异丁醇胺、三亚乙基二胺、其它C1-C8烷醇胺和其组合。当胺包括烷基醚组分时,胺可视为烷氧基胺,例如1-甲氧基-2-氨基乙烷。
可替代地或除NR1R2R3胺以外,络合剂还可为多官能胺,包括但不限于:4-(2-羟基乙基)吗啉(HEM)、1,2-环己二胺-N,N,N',N'-四乙酸(CDTA)、乙二胺四乙酸(EDTA)、间二甲苯二胺(MXDA)、亚氨二乙酸(IDA)、2-(羟基乙基)亚氨二乙酸(HIDA)、次氮基三乙酸、硫脲、1,1,3,3-四甲基脲、脲、脲衍生物、尿酸、丙氨酸、精氨酸、天冬酰胺、天冬氨酸、半胱氨酸、谷氨酸、谷氨酰胺、组氨酸、异亮氨酸、亮氨酸、赖氨酸、甲硫氨酸、苯丙氨酸、脯氨酸、丝氨酸、苏氨酸、色氨酸、酪氨酸、缬氨酸和其组合。
替代地,或除前述络合剂以外,额外络合剂可包括膦酸酯(例如1-羟基亚乙基-1,1-二膦酸(HEDP)、1,5,9-三氮杂环十二烷-N,N',N”-三(亚甲基膦酸)(DOTRP)、1,4,7,10-四氮杂环十二烷-N,N,N”,N”'-四(亚甲基膦酸)(DOTP)、次氮基三(亚甲基)三膦酸、二亚乙基三胺五(亚甲基膦酸)(DETAP)、氨基三(亚甲基膦酸)、双(亚己基)三胺亚戊基膦酸、1,4,7-三氮杂环壬烷-N,N',N”-三(亚甲基膦酸(NOTP)、羟基乙基二膦酸酯、次氮基三(亚甲基)膦酸、2-膦酰基-丁烷-1,2,3,4-四甲酸、羧基乙基膦酸、氨基乙基膦酸、草甘膦、乙二胺四(亚甲基膦酸)苯基膦酸、其盐和其衍生物)和/或羧酸(例如,草酸、丁二酸、顺丁烯二酸、苹果酸、丙二酸、己二酸、邻苯二甲酸、柠檬酸、柠檬酸钠、柠檬酸钾、柠檬酸铵、丙三羧酸、二羟甲基丙酸、三羟甲基丙酸、酒石酸、葡糖醛酸、2-羧基吡啶)和/或磺酸例如试钛灵(4,5-二羟基-1,3-苯二磺酸二钠盐)。例如,至少一种络合剂可包含选自由单乙醇胺、三乙醇胺、硫酸、柠檬酸和其组合组成的群组的物种。
按清洗组合物的总重量计,清洗组合物中的一或多种络合剂的量在约0.01wt%到约20wt%的范围内。优选地,按清洗组合物的总重量计,络合剂以约0.01wt%到约10wt%的量存在,且更优选以约0.01wt%到约5wt%的量存在。
本公开的清洗组合物包含至少一种清洗添加剂,其可包括各种溶剂、水溶性聚合物和表面活性剂。适合地,组合物可包含由多种清洗添加剂组成的清洗添加剂组分。说明性清洗添加剂包括但不限于,2-吡咯烷酮、1-(2-羟基乙基)-2-吡咯烷酮(HEP)、甘油、1,4-丁二醇、四亚甲基砜(环丁砜)、二甲砜、乙二醇、丙二醇、二丙二醇、四乙二醇二甲醚、二乙二醇二甲醚、甲基异丁基酮、甲基乙基酮、丙酮、异丙醇、辛醇、乙醇、丁醇、甲醇、异佛尔酮、二醇醚(例如二乙二醇单甲醚、三乙二醇单甲醚、二乙二醇单乙醚、三乙二醇单乙醚、乙二醇单丙醚、乙二醇单丁醚、二乙二醇单丁醚(DEGBE)、三乙二醇单丁醚(TEGBE)、乙二醇单己醚(EGHE)、二乙二醇单己醚(DEGHE)、乙二醇苯醚、二乙二醇苯醚、六乙二醇单苯醚、丙二醇甲醚、二丙二醇甲醚(DPGME)、三丙二醇甲醚(TPGME)、二丙二醇二甲醚、二丙二醇乙醚、丙二醇正丙醚、二丙二醇正丙醚(DPGPE)、三丙二醇正丙醚、丙二醇正丁醚(例如DOWANOL PnB)、二丙二醇正丁醚、三丙二醇正丁醚、二丙二醇苯醚、丙二醇苯醚(PPh,例如DOWANOL PPh)、4-甲基-2-戊酮、2,4-二甲基-3-戊酮、环己酮、5-甲基-3-庚酮、3-戊酮、5-羟基-2-戊酮、2,5-己二酮、4-羟基-4-甲基-2-戊酮、丙酮、丁酮、2-甲基-2-丁酮、3,3-二甲基-2-丁酮、4-羟基-2-丁酮、环戊酮、2-戊酮、3-戊酮、1-苯基乙酮、苯乙酮、二苯甲酮、2-己酮、3-己酮、2-庚酮、3-庚酮、4-庚酮、2,6-二甲基-4-庚酮、2-辛酮、3-辛酮、4-辛酮、二环己基酮、2,6-二甲基环己酮、2-乙酰基环己酮、2,4-戊二酮、薄荷酮、二甲亚砜(DMSO)、二甲基甲酰胺(DMF)、N-甲基吡咯烷酮、N-乙基吡咯烷酮、碳酸亚乙酯、碳酸亚丙酯、塞里尼(cyrene)、二甲基亚乙基脲和其组合。
替代地或另外,所述清洗添加剂可包括水溶性聚合物或表面活性剂,其包括例如,甲基丙烯酸均聚物和与例如丙烯酰胺基甲基丙烷磺酸和顺丁烯二酸的共聚物;顺丁烯二酸/乙烯基醚共聚物;聚(乙烯吡咯烷酮)/乙酸乙烯酯;均聚物,例如膦酸化聚乙二醇寡聚物、聚(丙烯酸)(PAA)、聚(丙烯酰胺)、聚(乙酸乙烯酯)、聚(乙二醇)(PEG)、聚(丙二醇)(PPG)、聚(苯乙烯磺酸)、聚(乙烯基磺酸)、聚(乙烯基膦酸)、聚(乙烯基磷酸)、聚(亚乙亚胺)、聚(亚丙亚胺)、聚烯丙胺、聚氧化乙烯(PEO)、聚乙烯吡咯烷酮(PVP)、聚(乙烯醇)、亲水性水溶性或分散性聚氨酯,聚(乙二醇丙烯酸酯)、聚(乙二醇甲基丙烯酸脂)、PPG-PEG-PPG嵌段共聚物、PEG-PPG-PEG嵌段共聚物和其组合。
替代地或另外,至少一种清洗添加剂可为表面活性剂,其包括但不限于阴离子、非离子、阳离子和/或两性离子表面活性剂。实例包括海藻酸和其盐;羟基或羧基烷基纤维素;硫酸葡聚糖和其盐;聚(半乳糖醛酸)和其盐;(甲基)丙烯酸和其盐、顺丁烯二酸、顺丁烯二酸酐、苯乙烯磺酸和其盐、乙烯基磺酸和其盐、烯丙基磺酸和其盐、丙烯酰胺基丙基磺酸和其盐的均聚物;(甲基)丙烯酸和其盐、顺丁烯二酸、顺丁烯二酸酐、苯乙烯磺酸和其盐、乙烯基磺酸和其盐、烯丙基磺酸和其盐、丙烯酰胺基丙基磺酸和其盐的共聚物;壳聚糖;阳离子淀粉;聚赖氨酸和其盐;氯化二烯丙基二甲铵(DADMAC)、溴化二烯丙基二甲铵、硫酸二烯丙基二甲铵、磷酸二烯丙基二甲铵、氯化二甲基烯丙基二甲铵、氯化二乙基烯丙基二甲铵、氯化二烯丙基二(β-羟基乙基)铵、氯化二烯丙基二(β-乙氧基乙基)铵、二甲基氨基乙基(甲基)丙烯酸酯酸加成盐和季盐、二乙基氨基乙基(甲基)丙烯酸酯酸加成盐和季盐、7-氨基-3,7-二甲基辛基(甲基)丙烯酸酯酸加成盐和季盐、N,N'-二甲基氨基丙基丙烯酰胺酸加成盐和季盐、烯丙胺、二烯丙胺、乙烯胺、乙烯吡啶的均聚物;和氯化二烯丙基二甲铵(DADMAC)、溴化二烯丙基二甲铵、硫酸二烯丙基二甲铵、磷酸二烯丙基二甲铵、氯化二甲基烯丙基二甲铵、氯化二乙基烯丙基二甲铵、氯化二烯丙基二(β-羟基乙基)铵、氯化二烯丙基二(β-乙氧基乙基)铵、二甲基氨基乙基(甲基)丙烯酸酯酸加成盐和季盐、二乙基氨基乙基(甲基)丙烯酸酯酸加成盐和季盐、7-氨基-3,7-二甲基辛基(甲基)丙烯酸酯酸加成盐和季盐、N,N'-二甲基氨基丙基丙烯酰胺酸加成盐和季盐、烯丙胺、二烯丙胺、乙烯胺、乙烯吡啶的共聚物;椰油二甲基羧甲基甜菜碱;月桂基二甲基羧甲基甜菜碱;月桂基二甲基-α-羧乙基甜菜碱;十六烷基二甲基羧甲基甜菜碱;月桂基-双-(2-羟基乙基)羧甲基甜菜碱;硬脂基-双-(2-羟基丙基)羧甲基甜菜碱;油酰基二甲基-γ-羧丙基甜菜碱;月桂基-双-(2-羟基丙基)α-羧乙基甜菜碱;椰油二甲基磺丙基甜菜碱;硬脂基二甲基磺丙基甜菜碱;月桂基-双-(2-羟基乙基)磺丙基甜菜碱;十二烷基硫酸钠(SDS);Surfynol 104、二辛基磺基丁二酸钠盐;月桂基醚硫酸钠;聚乙二醇支链-壬基苯基醚硫酸铵盐;2-十二烷基-3-(2-磺酸根基苯氧基)二钠;PEG25-PABA;聚乙二醇单-C10-16-烷基醚硫酸钠盐;(2-N-丁氧基乙氧基)乙酸;十六烷基苯磺酸;氢氧化鲸蜡基三甲铵;氢氧化十二烷基三甲铵;氯化十二烷基三甲铵;氯化鲸蜡基三甲铵;氯化N-烷基-N-苄基-N,N-二甲基胺;十二烷基胺;聚氧乙烯月桂基醚;十二烯基丁二酸单二乙醇酰胺;乙二胺四(乙氧基化物-嵌段-丙氧基化物);和其组合。
特定的清洗添加剂包括但不限于羟基丙基纤维素、羟基乙基纤维素、羧甲基纤维素、羧甲基纤维素钠(NaCMC)、十二烷基硫酸钠(SDS);十二烷基硫酸铵、十二烷基硫酸钾、羧甲基纤维素铵、羧甲基纤维素钾、海藻酸铵、海藻酸钾、海藻酸钙、Surfynol 104、聚乙烯吡咯烷酮(PVP)、使用N-乙烯吡咯烷酮单体制得的任何聚合物、聚(乙烯醇)、聚丙烯酸酯和聚丙烯酸酯的类似物、聚氨基酸(例如聚丙氨酸、聚亮氨酸、聚甘氨酸等)、聚酰胺羟基氨基甲酸酯、聚内酯、聚丙烯酰胺、黄原胶、壳聚糖、聚氧化乙烯、聚乙烯醇、聚乙酸乙烯酯、聚丙烯酸、聚乙烯亚胺、例如山梨糖醇酯和木糖醇的糖醇、脱水山梨糖醇的酯、例如TERGITOL的仲醇乙氧基化物和其组合。
按清洗组合物的总重量计,清洗组合物中的清洗添加剂的量在约0.01wt%到约20wt%的范围内。优选地,按清洗组合物的总重量计,清洗添加剂以约0.1wt%到约10wt%的量存在,且更优选以约0.5wt%到约5wt%的量存在。
本公开的清洗组合物包含至少一种pH调节剂,其用于将组合物的pH升高或降低到目标值。尽管pH调节剂可包括酸和/或碱,优选地pH调节剂为碱且用于提升清洗组合物的pH。说明性碱包括但不限于碱金属氢氧化物(例如,LiOH、KOH、RbOH、CsOH)、碱土金属氢氧化物(例如Be(OH)2、Mg(OH)2、Ca(OH)2、Sr(OH)2、Ba(OH)2)、氢氧化铵(即,氨)和具有式NR1R2R3R4OH的氢氧化四烷铵化合物,其中R1、R2、R3和R4可彼此相同或不同且选自由以下组成的群组:氢、直链或支链C1-C6烷基(例如甲基、乙基、丙基、丁基、戊基和己基)、C1-C6羟基烷基(例如羟基甲基、羟基乙基、羟基丙基、羟基丁基、羟基戊基和羟基己基)、和经取代的或未经取代的C6-C10芳基(例如苄基)。市售的氢氧化四烷基铵包括氢氧化四甲铵(TMAH)、氢氧化四乙基铵(TEAH)、氢氧化四丙基铵(TPAH)、氢氧化四丁基铵(TBAH)、氢氧化三丁基甲铵(TBMAH)、氢氧化苄基三甲铵(BTMAH)、氢氧化胆碱、氢氧化乙基三甲基铵、氢氧化三(2-羟基乙基)甲铵、氢氧化二乙基二甲基铵和其组合可使用。
替代地或另外,所述pH调节剂可为具有式(PR1R2R3R4)OH的季碱,其中R1、R2、R3和R4可彼此相同或不同且选自由以下组成的群组:氢、直链C1-C6烷基(例如甲基、乙基、丙基、丁基、戊基和己基)、支链C1-C6烷基、C1-C6羟基烷基(例如羟基甲基、羟基乙基、羟基丙基、羟基丁基、羟基戊基和羟基己基)、经取代的C6-C10芳基、未经取代的C6-C10芳基(例如苄基)和其任何组合,例如氢氧化四丁基鏻(TBPH)、氢氧化四甲基鏻、氢氧化四乙基鏻、氢氧化四丙基鏻、氢氧化苄基三苯基鏻、氢氧化甲基三苯基鏻、氢氧化乙基三苯基鏻、氢氧化正丙基三苯基鏻。
所添加(一或多种)pH调节剂的量取决于所需pH,如本文中所公开和如所属领域的技术人员所理解。例如,按清洗组合物的总重量计,pH调节剂可以约0.1wt%到约10wt%的量存在,且更优选以约1wt%到约5wt%的量存在。在一个实施例中,pH调节剂包含KOH。在另一实施例中,pH调节剂包含氢氧化胆碱。在又另一实施例中,pH调节剂包含氢氧化铵。在另一实施例中,pH调节剂包含本文中所枚举的至少一种碱金属氢氧化物和至少一种额外氢氧化物。在另一实施例中,pH调节剂包含KOH和至少一种本文中所枚举的额外氢氧化物。在再一实施例中,pH调节剂包含KOH以及氢氧化胆碱和氢氧化铵中的至少一者。
本文中所描述的清洗组合物的pH可视目标应用而变化。在一个实施例中,组合物的pH大于7,且因而可为碱性水性清洗组合物。对于此实施例,优选地pH在约10到大于14的范围内,更优选地在约12到约14的范围内,且最优选在约13到14的范围内。所属领域的技术人员应理解,在稀释后,例如通过形成下文所描述的浓度和随后添加水,清洗组合物的pH将降低到约10到约12的范围内。
本文中所描述的清洗组合物包含至少一种氧胺化合物或其盐。具体来说,氧胺化合物可为羟胺或氨氧基(硝酰基)化合物。例如,组合物可包含至少一种羟胺化合物、至少一种氨氧基化合物或其组合。氧胺化合物原则上可为包括键结到氮(N)原子的氧基(例如-O.或-OH)的任何化合物。在一些情况下,氧胺化合物的盐形式可更稳定或可易于获得,其中化合物包括键结到氮原子的羟基化(-OM)基团。实例包括Na+、K+、Li+或铵盐。
更详细地说,氧胺化合物可为具有通式(I)的羟胺化合物:
或可为具有通式(II)的氨氧基化合物:
R1和R2可彼此相同或不同且选自由以下组成的群组:氢和直链、支链或环烷基、包括C1-C8烷基(例如,甲基、乙基、丙基、丁基、戊基、己基、庚基和辛基)。因此,氧胺化合物可为烷基氧胺(例如烷基羟胺,尤其二烷基羟胺)。适合地,氧胺化合物可为对称的,其中式(I)和式(II)中的R1和R2相同。羟胺化合物的说明性实例包括但不限于羟胺(NH2OH)、二甲基羟胺、甲基乙基羟胺、甲基丙基羟胺、甲基丁基羟胺、二乙基羟胺(DEHA)、乙基丙基羟胺、乙基丁基羟胺、二丙基羟胺、丙基丁基羟胺、二丁基羟胺、二(叔丁基)羟胺、吗啉-N-氢氧化物、N-羟基琥珀胺、N-羟基顺丁烯二酰亚胺或其盐。盐的实例包括但不限于羟胺盐酸盐、羟胺硫酸盐或羟胺乙酸盐。氨氧基化合物的说明性实例包括但不限于2,2,6,6-四甲基哌啶-1-基)氧基(有时也称为(2,2,6,6-四甲基哌啶-1-基)氧烷基或TEMPO)、4-氨基-TEMPO、4-羧基-TEMPO、4-膦基氧基-TEMPO、4-羟基-TEMPO、具有共价键结TEMPO侧基或端基的聚合物。其它适合的实例包括2,2,5,5-四甲基吡咯烷-1-基)氧烷基(有时也称为2,2,5,5-四甲基吡咯烷-N-氧基氮氧化物或PROXYL)、3-氨基-PROXYL、3-羧基-PROXYL、3-膦酰氧基-PROXYL、3-羟基-PROXYL和具有共价键结PROXYL侧基或端基的聚合物。
在一些实施例中,羟基胺可进一步经官能化,其中例如R1和R2可选自由以下组成的群组:直链或支链C1-C8醇(例如甲醇、乙醇、丙醇、丁醇、戊醇、己醇、庚醇和辛醇),和具有式R4-O-R5的直链或支链醚,其中R4和R5可彼此相同或不同且选自由C1-C8烷基组成的群组,其中R4或R5键结到N。作为特定实例,R1和/或R2可包含C1-C4烷基。
在各种实施例中,按组合物的总重量计,组合物包含在0.1到20%w/w的范围内的如本文任何地方所描述的氧胺化合物或氧胺化合物组分。适合地,氧胺化合物或氧胺化合物组分的量可在0.01到10%w/w的范围内,例如在0.1到7%w/w的范围内。
按清洗组合物的总重量计,清洗组合物中的氧胺化合物或其盐的量在约0.01wt%到约25wt%范围内。优选地,按清洗组合物的总重量计,氧胺化合物以约0.1wt%到约10wt%的量存在,且更优选以约0.5wt%到约5wt%的量存在。
本公开的清洗组合物可任选地进一步包含一或多种额外组分,其可提供其它益处,尤其用于清洗包含含钴材料的微电子装置。在一些实施例中,清洗组合物可包含至少一种蚀刻剂、至少一种腐蚀抑制剂和/或至少一种还原剂。
例如,清洗组合物可任选地包含至少一种蚀刻剂。适合地,组合物可包含由多种额外蚀刻剂组成的蚀刻剂组分。蚀刻剂的实例包括(但不限于)吗啉、二乙二醇胺、3-丁氧基丙胺、丙二醇单丁醚(例如DOWANOL PnB)、羟乙基吗啉、羟丙基吗啉、氨基乙基吗啉、氨基丙基吗啉、五甲基二亚乙基三胺(PMDETA)、哌嗪、N,N-二甲基丙醇胺、乙醇胺、二乙醇胺、二乙胺、乙二胺、二亚乙基三胺、四亚乙基五胺、三亚乙基四胺、三甲基氨基乙基乙醇胺、三甲基氨基丙基乙醇胺和其组合。在各种实施例中,按清洗组合物的总重量计,清洗中的蚀刻剂(若存在)的量在约0.1wt%到约20wt%的范围内。优选地,按组合物的总重量计,蚀刻剂以约1wt%到约20wt%的量,且更优选以约1wt%到约10wt%的量存在。在各种实施例中,清洗组合物不含有蚀刻剂。
清洗组合物可任选地包含至少一种腐蚀抑制剂。说明性腐蚀抑制剂包括但不限于乙酸、丙酮肟、丙烯酸、己二酸、丙氨酸、精氨酸、天冬酰胺、天冬氨酸、甜菜碱、二甲基乙二肟、甲酸、反丁烯二酸、葡糖酸、谷氨酸、谷氨酰胺、戊二酸、甘油酸、甘油、乙醇酸、乙醛酸、组氨酸、亚氨二乙酸、间苯二甲酸、衣康酸、乳酸、亮氨酸、赖氨酸、顺丁烯二酸、顺丁烯二酸酐、苹果酸、丙二酸、杏仁酸、2,4-戊二酮、苯乙酸、苯丙氨酸、邻苯二甲酸、脯氨酸、丙酸、邻苯二酚、苯均四酸、奎尼酸、丝氨酸、山梨糖醇、丁二酸、酒石酸、对苯二甲酸、偏苯三甲酸、苯均三酸、酪氨酸、缬氨酸、木糖醇、草酸、鞣酸、吡啶甲酸、1,3-环戊二酮、儿茶酚、邻苯三酚、间苯二酚、对苯二酚、三聚氰酸、巴比妥酸、1,2-二甲基巴比妥酸、丙酮酸、丙硫醇、苯甲羟肟酸、2,5-二羧基吡啶、4-(2-羟基乙基)吗啉(HEM)、N-氨基乙基哌嗪(N-AEP)、乙二胺四乙酸(EDTA)、1,2-环己二胺-N,N,N’,N’-四乙酸(CDTA)、N-(羟基乙基)-乙二胺三乙酸(HEdTA)、亚氨二乙酸(IDA)、2-(羟基乙基)亚氨二乙酸(HIDA)、次氮基三乙酸、硫脲、1,1,3,3-四甲基脲、脲、脲衍生物、甘氨酸、半胱氨酸、谷氨酸、异亮氨酸、甲硫氨酸、哌啶、N-(2-氨基乙基)哌啶、吡咯烷、苏氨酸、色氨酸、水杨酸、对甲苯磺酸、水杨基羟肟酸、5-磺基水杨酸、三唑、氨基三唑、二甲基丙炔醇、月桂酰基肌氨酸、硬脂酰基肌氨酸、糖精和其组合。在各种实施例中,按清洗组合物的总重量计,清洗中的腐蚀抑制剂(若存在)的量在约0.01wt%到约10wt%的范围内。优选地,按组合物的总重量计,腐蚀抑制剂以约0.01wt%到约5wt%的量存在,且更优选以约0.05wt%到约5wt%的量存在。在各种实施例中,清洗组合物不含有腐蚀抑制剂。
清洗组合物可任选地包含至少一种还原剂。说明性还原剂包括但不限于抗坏血酸、L(+)-抗坏血酸、异抗坏血酸、抗坏血酸衍生物、亚硫酸、亚硫酸铵、亚硫酸钾、亚硫酸钠、多巴胺HCl、亚磷酸、次膦酸、次磷酸、偏亚硫酸氢钾、偏亚硫酸氢钠、偏亚硫酸氢铵、丙酮酸钾、丙酮酸钠、丙酮酸铵、甲酸、甲酸钠、甲酸钾、甲酸铵、多巴胺、二氧化硫溶液和其任何组合。例如,至少一种还原剂可包含至少一种亚硫酸根离子和至少一种其它所枚举的还原剂,例如亚硫酸、亚硫酸钾、亚硫酸铵、次膦酸和其任何组合。应了解当存在亚硫酸铵时,可当场产生亚硫酸铵,其中特定组分的组合导致形成亚硫酸铵以辅助去除残留物,例如二氧化铈粒子和其它CMP后残留物。在各种实施例中,按清洗组合物的总重量计,清洗中的还原剂(若存在)的量在约0.0001wt%到约1wt%的范围内。优选地,按组合物的总重量计,还原剂以约0.0001wt%到约0.2wt%的量,且更优选以约0.01wt%到约0.2wt%的量存在。在各种实施例中,清洗组合物不含有还原剂。
组分的重量百分比比率范围将覆盖组合物的所有可能经浓缩或经稀释的实施例。为此,在一个实施例中,提供可稀释以用作清洗溶液的浓缩去除组合物。浓缩组合物或“浓缩物”有利地准许使用者(例如CMP工艺工程师)在使用时将浓缩物稀释到所需强度和pH。经浓缩的水性去除组合物的稀释度可在约1:1到约2500:1、优选约5:1到约200:1且最优选约20:1到约120:1的范围内,其中水性去除组合物在工具处或恰好在工具之前经溶剂(例如去离子水)稀释。所属领域的技术人员应了解,在稀释之后,本文所公开的组分的重量百分比的范围应保持不变。
本文中所描述的组合物可在包括但不限于蚀刻后残留物去除、灰化后残留物去除表面制备、电镀后清洗和CMP后残留物去除的应用中具有效用。除了清洗含钴组分以外,经考虑本文中所描述的水性清洗组合物还可适用于清洗和保护其它金属(例如,含铜和含钨)产品,包括但不限于装饰性金属、金属线接合、印刷电路板和使用金属或金属合金的其它电子封装。
水性清洗组合物很容易通过简单添加各别成分且混合到均质状况来调配。此外,组合物可易于调配为单封装调配物或在使用时或使用前混合的多部分调配物,例如,多部分调配物的个别部分可在工具处或在工具上游的储槽中混合。各别成分的浓度可以组合物的特定倍数广泛变化,即更稀或更浓,且应了解,本文中所描述的组合物可不同地且可替代地包含符合本文中的公开内容的成分的任何组合,由其组成或基本上由其组成。
因此,另一方面涉及一种试剂盒,所述试剂盒在一或多个容器中包括经调适以形成本文中所描述的清洗组合物的一或多种组分。试剂盒在一或多个容器中可包括至少一种络合剂、至少一种清洗添加剂、至少一种pH调节剂、至少一种氧胺化合物、水、任选的至少一种蚀刻剂、任选的至少一种腐蚀抑制剂和任选的至少一种还原剂,用于在制造时或在使用时与额外溶剂(例如,水)组合。替代地,试剂盒在一或多个容器中可包括至少一种络合剂、至少一种清洗添加剂、至少一种氧胺化合物、水、任选的至少一种蚀刻剂、任选的至少一种腐蚀抑制剂和任选的至少一种还原剂,用于在制造时或在使用时与至少一种pH调节剂和额外溶剂(例如,水)组合。试剂盒的容器必须适合于储存和运输组合物,且可为例如容器(美国马萨诸塞州比尔里卡的英特格公司(Entegris,Inc.,Billerica,Mass.,USA))。
含有水性清洗组合物的组分的一或多个容器优选包括用于使所述一或多个容器中的组分流体连通以便掺合和分配的构件。例如,参考容器,可向所述一或多个容器中内衬的外部施加气体压力以使得内衬的内容物的至少一部分排出且因此使得能够流体连通以便掺合和分配。替代地,可向可用于使得能够实现流体连通的常规可加压容器或泵的顶部空间施加气体压力。另外,系统优选包括用于将经掺合去除组合物分配到处理工具的施配口。
当应用于微电子制造操作时,有效地采用本文所描述的清洗组合物以从微电子装置的表面去除包括粒子、CMP后残留物、灰化后残留物和蚀刻后残留物的残留物和污染物。有利地,本文中所描述的本发明清洗组合物相对于所属领域中先前所描述的替代性清洗组合物展示经改良的钴相容性。因此,本公开进一步涉及使用本文中所描述的清洗组合物从上面有残留物和污染物的微电子装置去除所述残留物和污染物的方法。
所述方法包含使微电子装置与清洗组合物接触足以至少部分地从微电子装置清洗所述残留物和污染物的时间,在使用中,在约20℃到约90℃、优选约20℃到约50℃的范围内的温度下,使清洗组合物典型地与装置接触约5秒到约10分钟、优选约1秒到20分钟、优选约15秒到约5分钟的时间。此类接触时间和温度为说明性的,且在所述方法的广泛实践内,可采用有效地从装置至少部分去除残留物和污染物的任何其它适合的时间和温度条件。“至少部分清洗”和“大体上去除”均对应于在粒子去除之前去除存在于装置上的至少85%、更优选至少90%、甚至更优选至少95%或最优选至少99%的氧化铈粒子。
在接触装置和去除目标所需残留物和/或污染物之后,清洗组合物可易于从先前已施加有所述清洗组合物的装置去除,如在本文所描述的组合物的既定最终用途应用中可为所需且有效的。例如,优选可使用冲洗溶液,其中冲洗溶液包括去离子水。其后,如所属领域中已知,可使用氮气或旋转干燥循环来干燥装置。
本公开的又一方面涉及根据本文所描述的方法制得的经改良微电子装置且关于含有此类微电子装置的产品。另一方面涉及一种再循环清洗组合物,其中如所属领域的技术人员容易地确定,所述组合物可经再循环直到粒子和/或污染物负载达到水性去除组合物可容纳的最大量为止。因此,本文中所公开的清洗组合物可包括残留物和/或污染物。残余物和污染物可溶解于组合物中。替代地,残余物和污染物可悬浮于组合物中。优选地,残留物包括CMP后残留物、蚀刻后残留物、灰化后残留物、污染物或其组合。又一方面涉及制造包含微电子装置的物品的方法,所述方法包含使所述微电子装置与本发明清洗组合物接触,持续足以从所述微电子装置去除残余物和/或污染物的时间,且将所述经清洗的微电子装置并入到所述物品中。另一方面涉及通过此方法产生的物品。
实例
除非另外明确说明,否则本公开的清洗组合物的特征和优点通过以下非限制性实例更充分地说明,其中所有份数和百分比均按重量计。所公开的清洗组合物尤其适用于从微电子装置结构清洗残留物和污染物(例如CMP后残留物、蚀刻后残留物、灰化后残留物和污染物)同时仍与存在于表面上的含钴材料相容。
实例1
以下实例展现将至少一种羟胺添加到清洗组合物的有效性。
制备两种组合物且展示于下表1中。表中的所有数值均指按总组合物计的wt%,且任何未达到总数100%只是由于四舍五入。
表1
如所展示,比较实例1与实例1的组合物之间的唯一差异为用DEHA代替一定量的水。比较实例1为不根据本公开的比较实例。
各组合物以60:1水与组合物的比率经去离子水稀释,且随后在30℃的温度下将钴的试样暴露于各经稀释的组合物15分钟。测定钴试样的蚀刻程度且展示于表1中。如可见,比较实例1的清洗组合物展示0.6A/min的蚀刻速率且标准差为0.02。经比较,实例1的组合物展示0.4A/min的蚀刻速率且标准差为0.05。这些结果展示包括例如DEHA的羟胺有效地减少钴蚀刻。
实例2-3
以下实例展现本公开的清洗组合物,其包含至少一种羟胺且具有高钴相容性。
制备包含至少一种络合剂、至少一种清洗添加剂、至少一种pH调节剂和至少一种羟胺的本公开组合物。组合物如下:
实例2:18.2%氢氧化胆碱(作为46.7%水溶液添加)、1.13%MEA、0.05%半胱氨酸、4.9%DEHA和75.625%去离子水。组合物的pH为13.5。
实例3:2.09%KOH(作为45%水溶液添加)、1.25%MEA、0.1%半胱氨酸、0.8%HEDP(作为60%水溶液添加)、5.3%吗啉、1%1-丁氧基-2-丙醇、3%DMSO、0.9%DEHA和85.56%去离子水。
所有数值均指按总组合物计的wt%,且任何未达到总数100%只是由于四舍五入。
各组合物以60:1水与组合物的比率经去离子水稀释。随后在30℃的温度下将钴的试样暴露于各经稀释的组合物15分钟且测定钴试样的蚀刻程度。已发现含有DEHA作为羟胺的实例2和实例3两者的组合物基于其减小的钴蚀刻速率而具有经改良的钴相容性。
实例4-13
以下实例表明本公开的各种清洗组合物的有效性,所述清洗组合物包含至少一种用于从钴衬底去除二氧化硅浆料的羟胺。
制备包含至少一种络合剂、至少一种清洗添加剂、至少一种pH调节剂和至少一种羟胺的本公开的组合物且展示于下表2中。表中的所有数值均指按总组合物计的wt%,且任何未达到总数100%只是由于四舍五入。
制备所展示的组合物且经水稀释100:1。将钴试样浸没于含二氧化硅浆料中5分钟,在去离子水中冲洗30秒,且随后浸没于清洗组合物中60秒,随后经第二次去离子水冲洗液冲洗30秒。浸没期间的温度为室温。使用扫描电子显微法(SEM)测定清洗程度,且结果展示于下表3中。
表2
表3
实例 | 二氧化硅粒子面积(SEM) |
2 | 3308 |
3 | 2737 |
4 | 2789 |
5 | 4540 |
6 | 4508 |
7 | 3008 |
8 | 5490 |
9 | 3137 |
10 | 6950 |
11 | 5470 |
如所示,含有二乙基羟胺的清洗组合物中的各者能够有效地从含钴衬底去除二氧化硅浆料粒子。因此,含有羟胺的组合物可从钴衬底去除残余物粒子同时维持有效的钴相容性(如通过实例1-3中的减小的蚀刻速率所展示)。
尽管本文已参考说明性实施例和特征不同地公开本发明,但应了解上文描述的实施例和特征不打算限制本发明,且基于本文中公开内容,其它变化、修饰和其它实施例将向那些所属领域的一般技术人员表明自身。因此如在下文阐述的权利要求书的精神和范围内涵盖所有此类变化、修饰和替代实施例,将大致解释本发明。
Claims (20)
1.一种用于从上面有残留物和污染物的微电子装置清洗所述残留物和污染物的清洗组合物,所述清洗组合物包含至少一种络合剂、至少一种清洗添加剂、至少一种pH调节剂、水和至少一种氧胺化合物或其盐。
2.根据权利要求1所述的清洗组合物,其中所述络合剂包含选自由以下组成的群组的物种:氨基乙基乙醇胺、N-甲基氨基乙醇、氨基乙氧基乙醇、二甲基氨基乙氧基乙醇、二乙醇胺、N-甲基二乙醇胺、单乙醇胺(MEA)、三乙醇胺(TEA)、异丙醇胺、二异丙醇胺、氨基丙基二乙醇胺、N,N-二甲基丙醇胺、N-甲基丙醇胺、1-氨基-2-丙醇、2-氨基-1-丁醇、异丁醇胺、三亚乙基二胺、4-(2-羟基乙基)吗啉(HEM)、1,2-环己二胺-N,N,N',N'-四乙酸(CDTA)、乙二胺四乙酸(EDTA)、间二甲苯二胺(MXDA)、亚氨二乙酸(IDA)、2-(羟基乙基)亚氨二乙酸(HIDA)、次氮基三乙酸、硫脲、1,1,3,3-四甲基脲、脲、脲衍生物、尿酸、丙氨酸、精氨酸、天冬酰胺、天冬氨酸、半胱氨酸、谷氨酸、谷氨酰胺、组氨酸、异亮氨酸、亮氨酸、赖氨酸、甲硫氨酸、苯丙氨酸、脯氨酸、丝氨酸、苏氨酸、色氨酸、酪氨酸、缬氨酸、1-羟基亚乙基-1,1-二膦酸(HEDP)、1,5,9-三氮杂环十二烷-N,N',N”-三(亚甲基膦酸)(DOTRP)、1,4,7,10-四氮杂环十二烷-N,N,N”,N”'-四(亚甲基膦酸)(DOTP)、次氮基三(亚甲基)三膦酸、二亚乙基三胺五(亚甲基膦酸)(DETAP)、氨基三(亚甲基膦酸)、双(亚己基)三胺亚戊基膦酸、1,4,7-三氮杂环壬烷-N,N',N”-三(亚甲基膦酸(NOTP)、羟基乙基二膦酸酯、次氮基三(亚甲基)膦酸、2-膦酰基-丁烷-1,2,3,4-四甲酸、羧基乙基膦酸、氨基乙基膦酸、草甘膦、乙二胺四(亚甲基膦酸)苯基膦酸、草酸、丁二酸、顺丁烯二酸、苹果酸、丙二酸、己二酸、邻苯二甲酸、柠檬酸、柠檬酸钠、柠檬酸钾、柠檬酸铵、丙三羧酸、三羟甲基丙酸、酒石酸、葡萄糖醛酸、2-羧基吡啶、4,5-二羟基-1,3-苯二磺酸二钠盐和其组合。
3.根据权利要求1所述的清洗组合物,其中所述清洗组合物包含约0.1wt%到约10wt%的所述络合剂。
4.根据权利要求1所述的清洗组合物,其中所述清洗添加剂包含选自由以下组成的群组的物种:2-吡咯烷酮、1-(2-羟基乙基)-2-吡咯烷酮(HEP)、甘油、1,4-丁二醇、四亚甲基砜(环丁砜)、二甲砜、乙二醇、丙二醇、二丙二醇、四乙二醇二甲醚、二乙二醇二甲醚、甲基异丁基酮、甲基乙基酮、丙酮、异丙醇、辛醇、乙醇、丁醇、甲醇、异佛尔酮、二醇醚(例如二乙二醇单甲醚、三乙二醇单甲醚、二乙二醇单乙醚、三乙二醇单乙醚、乙二醇单丙醚、乙二醇单丁醚、二乙二醇单丁醚(DEGBE)、三乙二醇单丁醚(TEGBE)、乙二醇单己醚(EGHE)、二乙二醇单己醚(DEGHE)、乙二醇苯醚、二乙二醇苯醚、六乙二醇单苯醚、丙二醇甲醚、二丙二醇甲醚(DPGME)、三丙二醇甲醚(TPGME)、二丙二醇二甲醚、二丙二醇乙醚、丙二醇正丙醚、二丙二醇正丙醚(DPGPE)、三丙二醇正丙醚、丙二醇正丁醚(例如DOWANOL PnB)、二丙二醇正丁醚、三丙二醇正丁醚、二丙二醇苯醚、丙二醇苯醚(PPh,例如DOWANOLPPh)、4-甲基-2-戊酮、2,4-二甲基-3-戊酮、环己酮、5-甲基-3-庚酮、3-戊酮、5-羟基-2-戊酮、2,5-己二酮、4-羟基-4-甲基-2-戊酮、丙酮、丁酮、2-甲基-2-丁酮、3,3-二甲基-2-丁酮、4-羟基-2-丁酮、环戊酮、2-戊酮、3-戊酮、1-苯基乙酮、苯乙酮、二苯甲酮、2-己酮、3-己酮、2-庚酮、3-庚酮、4-庚酮、2,6-二甲基-4-庚酮、2-辛酮、3-辛酮、4-辛酮、二环己基酮、2,6-二甲基环己酮、2-乙酰基环己酮、2,4-戊二酮、薄荷酮、二甲亚砜(DMSO)、二甲基甲酰胺(DMF)、N-甲基吡咯烷酮、N-乙基吡咯烷酮、羟基丙基纤维素、羟基乙基纤维素、羧甲基纤维素、羧甲基纤维素钠(NaCMC)、十二烷基硫酸钠(SDS);Surfynol 104、聚乙烯吡咯烷酮(PVP)、聚氨基酸、聚酰胺羟基氨基甲酸酯、聚内酯、聚丙烯酰胺、黄原胶、壳聚糖、聚氧化乙烯、聚乙烯醇、聚乙酸乙烯酯、聚丙烯酸、聚乙烯亚胺、山梨糖醇酯、木糖醇、脱水山梨糖醇的酯、仲醇乙氧基化物、海藻酸钾、海藻酸铵、聚(乙二醇甲基丙烯酸酯)和其组合。
5.根据权利要求1所述的清洗组合物,其中所述清洗组合物包含约0.01wt%到约10wt%的所述清洗添加剂。
6.根据权利要求1所述的清洗组合物,其中所述pH调节剂包含选自由以下组成的群组的物种:碱金属氢氧化物、碱土金属氢氧化物、氢氧化铵、氢氧化四甲铵(TMAH)、氢氧化四乙基铵(TEAH)、氢氧化四丙基铵(TPAH)、氢氧化四丁基铵(TBAH)、氢氧化三丁基甲铵(TBMAH)、氢氧化苄基三甲铵(BTMAH)、氢氧化胆碱、氢氧化乙基三甲铵、氢氧化三(2-羟基乙基)甲铵、氢氧化二乙基二甲铵、氢氧化四丁基鏻(TBPH)、氢氧化四甲基鏻、氢氧化四乙基鏻、氢氧化四丙基鏻、氢氧化苄基三苯基鏻、氢氧化甲基三苯基鏻、氢氧化乙基三苯基鏻、氢氧化正丙基三苯基鏻和其组合。
7.根据权利要求1所述的清洗组合物,其中所述清洗组合物包含约1wt%到约5wt%的所述pH调节剂。
8.根据权利要求1所述的清洗组合物,其中所述清洗组合物水性清洗组合物包含至少约80wt%的水。
10.根据权利要求9所述的清洗组合物,其中所述羟胺化合物包含N,N-二乙基羟胺或其盐。
12.根据权利要求1所述的清洗组合物,其中所述清洗组合物包含约0.01wt%到约10wt%的所述氧胺化合物或其盐。
13.根据权利要求1所述的清洗组合物,其中所述清洗组合物进一步包含至少一种蚀刻剂,其中所述蚀刻剂包含选自由以下组成的群组的物种:吗啉、二乙二醇胺、3-丁氧基丙胺、丙二醇单丁醚(DOWANOL PnB)、羟乙基吗啉、羟丙基吗啉、氨基乙基吗啉、氨基丙基吗啉、五甲基二亚乙基三胺(PMDETA)、哌嗪、N,N-二甲基丙醇胺、乙醇胺、二乙醇胺、二乙胺、乙二胺、二亚乙基三胺、四亚乙基五胺、三亚乙基四胺、三甲基氨基乙基乙醇胺、三甲基氨基丙基乙醇胺和其组合。
14.根据权利要求1所述的清洗组合物,其中所述清洗组合物进一步包含至少一种腐蚀抑制剂,其中所述腐蚀抑制剂包含选自由以下组成的群组的物种:乙酸、丙酮肟、丙烯酸、己二酸、丙氨酸、精氨酸、天冬酰胺、天冬氨酸、甜菜碱、二甲基乙二肟、甲酸、反丁烯二酸、葡糖酸、谷氨酸、谷氨酰胺、戊二酸、甘油酸、甘油、乙醇酸、乙醛酸、组氨酸、亚氨二乙酸、间苯二甲酸、衣康酸、乳酸、亮氨酸、赖氨酸、顺丁烯二酸、顺丁烯二酸酐、苹果酸、丙二酸、杏仁酸、2,4-戊二酮、苯乙酸、苯丙氨酸、邻苯二甲酸、脯氨酸、丙酸、邻苯二酚、苯均四酸、奎尼酸、丝氨酸、山梨糖醇、丁二酸、酒石酸、对苯二甲酸、偏苯三甲酸、苯均三酸、酪氨酸、缬氨酸、木糖醇、草酸、鞣酸、吡啶甲酸、1,3-环戊二酮、儿茶酚、邻苯三酚、间苯二酚、对苯二酚、三聚氰酸、巴比妥酸、1,2-二甲基巴比妥酸、丙酮酸、丙硫醇、苯甲羟肟酸、2,5-二羧基吡啶、4-(2-羟基乙基)吗啉(HEM)、N-氨基乙基哌嗪(N-AEP)、乙二胺四乙酸(EDTA)、1,2-环己二胺-N,N,N',N'-四乙酸(CDTA)、N-(羟基乙基)-乙二胺三乙酸(HEdTA)、亚氨二乙酸(IDA)、2-(羟基乙基)亚氨二乙酸(HIDA)、次氮基三乙酸、硫脲、1,1,3,3-四甲基脲、脲、脲衍生物、甘氨酸、半胱氨酸、谷氨酸、异亮氨酸、甲硫氨酸、哌啶、N-(2-氨基乙基)哌啶、吡咯烷、苏氨酸、色氨酸、水杨酸、对甲苯磺酸、水杨基羟肟酸、5-磺基水杨酸、三唑、氨基三唑、二甲基丙炔醇、月桂酰基肌氨酸、硬脂酰基肌氨酸、糖精和其组合。
15.根据权利要求1所述的清洗组合物,其中所述清洗组合物进一步包含至少一种还原剂,其中所述还原剂包含选自由以下组成的群组的物种:抗坏血酸、L(+)-抗坏血酸、异抗坏血酸、抗坏血酸衍生物、亚硫酸、亚硫酸铵、亚硫酸钾、亚硫酸钠、多巴胺HCl、亚磷酸、次膦酸、偏亚硫酸氢钾、偏亚硫酸氢钠、偏亚硫酸氢铵、羟胺、丙酮酸钾、丙酮酸钠、丙酮酸铵、甲酸、甲酸钠、甲酸钾、甲酸铵、多巴胺、二氧化硫溶液和其组合。
16.根据权利要求1所述的清洗组合物,其中所述清洗组合物大体上不含含氟化物源、研磨材料和氢氧化四甲铵。
17.根据权利要求1所述的清洗组合物,其中所述清洗组合物的pH在约10到约14的范围内。
18.根据权利要求1所述的清洗组合物,其中所述清洗组合物进一步包含残留物和污染物,其中所述残留物包含CMP后残留物、蚀刻后残留物、灰化后残留物或其组合。
19.一种从上面有残留物和污染物的微电子装置去除所述残留物和污染物的方法,所述方法包含使所述微电子装置与清洗组合物接触足以至少部分地从所述微电子装置清洗所述残留物和污染物的时间,其中所述清洗组合物包含至少一种络合剂、至少一种清洗添加剂、至少一种pH调节剂、水和至少一种氧胺化合物或其盐。
20.根据权利要求19所述的方法,其中所述微电子装置包含含钴材料,且其中所述清洗组合物接触所述含钴材料。
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US11845917B2 (en) | 2023-12-19 |
WO2020131313A1 (en) | 2020-06-25 |
JP2022514611A (ja) | 2022-02-14 |
KR20210094124A (ko) | 2021-07-28 |
TW202030319A (zh) | 2020-08-16 |
KR102625498B1 (ko) | 2024-01-17 |
US20200199500A1 (en) | 2020-06-25 |
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